Patents by Inventor Noriko Murase

Noriko Murase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6881278
    Abstract: A solder powder comprises solder particles having a distribution such that the number of particles having a particle diameter of 20 ?m or less is 30% or less, wherein the oxygen content is 500 ppm or less. A flux for solder paste comprises an organic acid component consisting of an organic acid ester and an ester decomposer catalyst, an organic halogen compound, a reducing agent and a resin component. A solder paste mainly comprises a flux and a solder powder, wherein the water content of the solder paste is 0.5% by weight or less.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: April 19, 2005
    Assignee: Showa Denko K.K.
    Inventors: Hitoshi Amita, Takashi Shoji, Shunsuke Nagasaki, Yoshinori Shibuya, Isamu Taguchi, Noriko Murase
  • Publication number: 20030200836
    Abstract: A solder powder comprises solder particles having a distribution such that the number of particles having a particle diameter of 20 &mgr;m or less is 30% or less, wherein the oxygen content is 500 ppm or less. A flux for solder paste comprises an organic acid component consisting of an organic acid ester and an ester decomposer catalyst, an organic halogen compound, a reducing agent and a resin component. A solder paste mainly comprises a flux and a solder powder, wherein the water content of the solder paste is 0.5% by weight or less.
    Type: Application
    Filed: April 7, 2003
    Publication date: October 30, 2003
    Applicant: SHOWA DENKO K.K.
    Inventors: Hitoshi Amita, Takashi Shoji, Shunsuke Nagasaki, Yoshinori Shibuya, Isamu Taguchi, Noriko Murase
  • Publication number: 20020046627
    Abstract: A solder powder comprises solder particles having a distribution such that the number of particles having a particle diameter of 20 &mgr;m or less is 30% or less, wherein the oxygen content is 500 ppm or less. A flux for solder paste comprises an organic acid component consisting of an organic acid ester and an ester decomposer catalyst, an organic halogen compound, a reducing agent and a resin component. A solder paste mainly comprises a flux and a solder powder, wherein the water content of the solder paste is 0.5% by weight or less.
    Type: Application
    Filed: September 14, 2001
    Publication date: April 25, 2002
    Inventors: Hitoshi Amita, Takashi Shoji, Shunsuke Nagasaki, Yoshinori Shibuya, Isamu Taguchi, Noriko Murase
  • Patent number: 6337301
    Abstract: A composition comprising metal oxide particles having photo-catalytic activity, a solvent-soluble zirconium compound and a solvent. Preferably, the metal oxide particles having photocatalytic activity are titanium oxide particles; the metal oxide particles have an average particle diameter of about 0.005 to 0.3 &mgr;m; and the amount of the zirconium compound is in the range of about 3-200 parts by weight, as ZrO2, per 100 parts by weight of the metal oxide articles. A composite of a film having a photo-catalytic activity with a base material is made by coating the base material with the above composition to form a film, and curing the film on the base material.
    Type: Grant
    Filed: June 2, 2000
    Date of Patent: January 8, 2002
    Assignee: Showa Denko Kabushiki Kaisha
    Inventors: Masahiro Ohmori, Hidenori Nakamura, Noriko Murase, Nobuo Uotani, Takashi Ohkubo
  • Publication number: 20010042779
    Abstract: To provide a solder paste having excellent storage stability; a method for soldering, which method is highly reliable and suitable for producing fine-pitch mounted wiring boards and a variety of parts; and a joint produced through soldering.
    Type: Application
    Filed: February 6, 2001
    Publication date: November 22, 2001
    Inventors: Hitoshi Amita, Noriko Murase, Takashi Shoji