Abstract: The invention is directed toward a method of manufacturing a flexure blank whereby an opening portion is provided in a in a connecting portion of a flexure blank, an opening end portion of an insulating base layer is coated with a conductive member without exposing the opening end portion of the insulating base layer in the connecting portion, and a lower surface of the conductive member of the opening portion in the connecting portion of the flexure blank is structured such as to form the same surface as the lower surface of the insulating base layer.

Abstract: An opening portion is provided in a connecting portion of a flexure blank, an opening end portion of an insulating base layer is coated with a conductive member without exposing the opening end portion of the insulating base layer in the connecting portion, and a lower surface of the conductive member of the opening portion in the connecting portion of the flexure blank is structured such as to form the same surface as the lower surface of the insulating base layer.

Abstract: An opening portion is provided in a connecting portion of a flexure blank, an opening end portion of an insulating base layer is coated with a conductive member without exposing the opening end portion of the insulating base layer in the connecting portion, and a lower surface of the conductive member of the opening portion in the connecting portion of the flexure blank is structured such as to form the same surface as the lower surface of the insulating base layer.

Abstract: A method of manufacturing a magnetic head suspension assembly, wherein a wiring member for connecting a magnetic head element with a read/write amplifier circuit board is integrally formed with the suspension which includes the steps of (1) forming a flexible insulating base material on one surface of a springy metal layer by using a non-photosensitive polyimide resin layer or a photosensitive insulating resin layer; (2) producing a circuit wiring pattern on the top of the flexible insulating base material by plating and by using an electrically conductive metal thin film; (3) for forming a surface protecting layer on the surface of the circuit wiring pattern; (4) the springy metal layer; and (5) bending the springy metal layer to form a desired suspension.

Abstract: This invention provides a method of forming a circuit wiring pattern which cannot be formed by a prior art method such as etching or plating. This method comprises a step of forming trenches for forming a circuit wiring pattern at predetermined positions on at least one of the surface of an insulating base material and then filling a conductive material into the trenches, a step of removing conductor layers in such a manner that the conductor layers formed by the step described above exist only in the trenches formed in the insulating base material and gap portions of the circuit wiring pattern comprising the conductor layers formed in the trenches of the insulating base material are exposed, and a step of forming an insulating surface protection layer.