Abstract: An ink-jet printer includes: a base material transport mechanism for transporting a base material along a transport path in a transport direction; an ink ejection head having a lower surface opposed to the transport path, and an ink ejection port for ejecting ink toward the transport path; and a base plate having a lower surface opposed to the transport path over the transport path, and a mounting hole open in the lower surface, the ink ejection head being mounted in the mounting hole. The base plate includes an air flow hole that is a though hole penetrating through the base plate. The air flow hole has an air outlet open in a location downstream of the ink ejection port in the lower surface. Air passing through the air flow hole is ejected from the air outlet toward the transport path.

Abstract: An ink-jet printer includes: a base material transport mechanism for transporting a base material along a transport path in a transport direction; an ink ejection head having a lower surface opposed to the transport path, and an ink ejection port for ejecting ink toward the transport path; and a base plate having a lower surface opposed to the transport path over the transport path, and a mounting hole open in the lower surface, the ink ejection head being mounted in the mounting hole. The base plate includes an air flow hole that is a though hole penetrating through the base plate. The air flow hole has an air outlet open in a location downstream of the ink ejection port in the lower surface. Air passing through the air flow hole is ejected from the air outlet toward the transport path.

Abstract: A continuous lighting lamp irradiates a semiconductor wafer held by a quartz susceptor with light from below to perform preliminary heating, and then irradiation of a flash of light is performed by a flash lamp from above. A light absorption ring is provided so as to be close to a peripheral portion of the semiconductor wafer held by the susceptor. The light absorption ring absorbs infrared light and transmits visible light through itself. During preliminary heating, the light absorption ring absorbs light emitted from the continuous lighting lamp to be increased in temperature so that heat radiated from the peripheral portion of the wafer is compensated to cause in-plane temperature distribution of the semiconductor wafer to be uniform. Meanwhile, the flash of light is transmitted through the light absorption ring, so that the light absorption ring is prevented from being damaged by the irradiation of the flash of light.

Abstract: A continuous lighting lamp irradiates a semiconductor wafer held by a quartz susceptor with light from below to perform preliminary heating, and then irradiation of a flash of light is performed by a flash lamp from above. A light absorption ring is provided so as to be close to a peripheral portion of the semiconductor wafer held by the susceptor. The light absorption ring absorbs infrared light and transmits visible light through itself. During preliminary heating, the light absorption ring absorbs light emitted from the continuous lighting lamp to be increased in temperature so that heat radiated from the peripheral portion of the wafer is compensated to cause in-plane temperature distribution of the semiconductor wafer to be uniform. Meanwhile, the flash of light is transmitted through the light absorption ring, so that the light absorption ring is prevented from being damaged by the irradiation of the flash of light.

Abstract: A seal member adapted to be mounted between a cylinder head cover and an ignition plug tube comprises a mount portion interposed radially movably between an upper surface of an annular stepped portion formed around an opening of the cylinder head cover for insertion of the ignition plug tube and a baffle plate. A first seal portion and a second seal portion project radially outward and inward, respectively, from the mount portion to be brought into contact with a peripheral surface of the annular stepped portion and the ignition plug tube, respectively. The second seal portion can be elastically deformed following relative radial movements between the mount portion and the ignition plug tube.

Abstract: A seal member adapted to be mounted between a cylinder head cover and an ignition plug tube comprises a mount portion interposed radially movably between an upper surface of an annular stepped portion formed around an opening of the cylinder head cover for insertion of the ignition plug tube and a baffle plate. A first seal portion and a second seal portion project radially outward and inward, respectively, from the mount portion to be brought into contact with a peripheral surface of the annular stepped portion and the ignition plug tube, respectively. The second seal portion can be elastically deformed following relative radial movements between the mount portion and the ignition plug tube.

Abstract: A seal device is adapted to be mounted at an area of relative rotation between two mounting portions of a tire pressure-adjusting device. The seal device includes a pair of first and second seal rings which are disposed in opposed relation to each other. Each of the first and second seal rings includes a main seal of an annular shape having a radially inwardly-directed lip formed on an inner periphery of the main seal, the lip having at its distal end a lip sliding surface to which a self-lubricating thin plate for sliding contact with one of the two mounting portion. Each seal ring further includes an auxiliary seal of an annular shape having a radially inwardly-directed lip which is formed on an inner periphery of the auxiliary seal and is adapted for sliding contact with the one mounting portion, the auxiliary seal being connected to the main seal to form therebetween a closed space for holding grease.