Abstract: The present invention provides an adhesive film for semiconductor package, which comprises a polycarbodiimide resin, an epoxy resin and an inorganic filler, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as measured by gel permeation chromatography, the epoxy resin is contained in an amount of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin, and the inorganic filler is contained in an amount of 30 to 70% by weight based on the total resin content.

Abstract: A metal material subjected to a treatment for seizure prevention is provided. The metal material includes a metal base material and a film formed thereon, the film being composed of a carbodiimide group-containing resin obtained from an aromatic polyisocyanate or of a mixture of said carbodiimide group-containing resin and a lubricant. A method for producing a metal material subjected to a treatment for seizure prevention is also provided. The method includes coating, on a metal base material, a carbodiimide group-containing resin obtained from an aromatic polyisocyanate or a mixture of said carbodiimide group-containing resin and a lubricant, and then subjecting the coated metal base material to a heat treatment at a temperature of 120° C. or higher.

Abstract: A thermosetting resin composition comprising:

Abstract: The present invention provides a prepreg which is composed of a mixture of a polycarbodiimide resin and an epoxy resin and which has a film shape; a prepreg composed of (1) a mixture of a polycarbodiimide resin and an epoxy resin and (2) a base material; a multilayer printed wiring board obtained by alternately laminating an internal substrate and an insulating adhesive layer and adhering them to each other, wherein the above prepreg is used as the insulating adhesive; and a process for producing a multilayer printed wiring board, which comprises alternately laminating an internal substrate and the above prepreg, adhering them to each other, and allowing all the internal substrates to communicate with each other at the required portions. The above prepreg has high flexibility at room temperature, causes neither chipping nor peeling of resin, and is superior in heat resistance and electrical insulation after press molding.

Abstract: A method for bonding LCPs mutually or an LCP and another material comprising the step of bonding LCPs mutually or an LCP and another material using an adhesive prepared by adding a polycarbodiimide resin with an epoxy resin composition comprising an epoxy resin and a curing agent, thereby providing excellent adhesion and heat resistance.

Abstract: The present invention provides a film-shaped encapsulating agent for electronic parts which is composed essentially of a polycarbodiimide resin and an epoxy resin or of a polycarbodiimide resin, an epoxy resin and colorant, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as determined by gel permeation chromatography and the epoxy resin is contained in a proportion of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin. The film-shaped encapsulating agent enables, for its good processability, the continuous encapsulation of electronic parts without requiring any expensive apparatus (therefore, no cost increase is incurred) and is excellent in heat resistance and electrical insulation after the encapsulation.

Abstract: The present invention provides a one-pack type epoxy resin composition comprising an epoxy resin having at least two epoxy groups in the molecule and a polyguanidine. The one-pack type epoxy resin composition has high storage stability, can be made into a film, is curable at relatively low temperatures, and has high adhesivity.

Abstract: An epoxy resin composition comprising(1) an epoxy resin,(2) a polymer obtained by reacting a polycarbodiimide with a compound having, in the molecule, at least one group reactive with carbodiimide group, between the carbodiimide group of said polycarbodiimide and the group reactive with carbodiimide group, of said compound, and(3) a curing agent for epoxy resin.The above epoxy resin composition alleviates the problems of the prior art; has a long pot life in a solution state, has an appropriate gelling time and accordingly good workability, is superior in film formability and handleability in B-stage, and has high heat resistance after curing; therefore, is suitably used in printed wiring board, prepreg, etc.

Abstract: There are provided a polycarbodiimide copolymer having a main structure represented by the following formula (1): ##STR1## wherein R.sub.1 is an isocyanate residue; R.sub.2 is a polyfunctional liquid rubber residue; X is a urethane bond, an amide bond or a urea bond; p is an integer of 5 to 50; q is an integer of 1 to 5; and r is 0 or 1; and a process for producing the above polycarbodiimide copolymer, which comprises reacting a polyfunctional liquid rubber with an organic diisocyanate in excess of the rubber and then subjecting the diisocyanate components in the reaction system to carbodiimization using a carbodiimidization catalyst. The polycarbodiimide copolymer alleviates the problems of the prior art, has the excellent heat resistance inherently possessed by polycarbodiimide resins, is improved, as compared with conventional polycarbodiimide resins, in thermoformability under heating and pressure when made into a solid such as a powder or granules, and causes no blistering under heating.

Abstract: A process for producing a polycarbodiimide resin powder, which includes reacting an organic diisocyanate in the presence of a carbodiimidization catalyst in a solvent to produce a polycarbodiimide resin and obtaining the resin in a powder form, where the organic diisocyanate is represented by the following formula ##STR1## where R.sub.1 is a lower alkyl group or a lower alkoxyl group, or ##STR2## where R.sub.2 and R.sub.3 are independently a hydrogen atom, a lower alkyl group or a lower alkoxyl group, and X is an oxygen atom or a methylene group, or ##STR3## where R.sub.4 and R.sub.5 are independently a hydrogen atom, a lower alkyl group or a lower alkoxyl group; the solvent is a mixed solvent of a good solvent to polycarbodiimide resin and a poor solvent to the resin, having a precipitation number of 30-80; and when the reaction has reached a certain stage, the reaction system is cooled to make the system a slurry of a polycarbodiimide, and then the polycarbodiimide is obtained in a powder form.

Abstract: A fail-safe vehicle rear wheel steering control system includes a hydraulic actuator for steering the rear wheels, an electromagnetic control valve for controlling fluid pressure of the actuator in accordance with a control signal, and a controller for controlling the rear wheel steer angle by producing the control signal. This fail-safe control system is characterized by a fail-safe cutoff valve disposed between the actuator and the control valve, and a fail-safe controller independent from the main controller. When the main controller or the control valve fails, the fail-safe controller brings the fail-safe valve to a closed position, and therefore, the fail-safe valve prevents an abrupt change of the rear wheel steer angle, and instead gradually allows a decrease of the rear wheel steer angle to zero by allowing a gradual leakage of the oil under pressure from the actuator.

Abstract: In a data outputting device, data to be outputted is digitally stored in a memory and is read out when addressed over a predetermined period in a time division multiplex mode with addresses which are provided by a counter in such a manner that the number thereof of addresses provided per predetermined time period corresponds to the number of channels employed, and the data thus read out with the addresses are selected for the channels by a selection circuit, respectively, so that they are outputted separately according to the channels.