Patents by Inventor Norimasa Sato

Norimasa Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240105349
    Abstract: A nuclear fusion system comprises: a muon generation unit to generate negative muons including electron and positron accelerators for generating electron and positron beams; a gas supply unit to supply to circulate gaseous deuterium or gaseous deuterium-tritium mixture as raw material gas; a Laval nozzle to accelerate the raw material gas to supersonic velocity; and a shock wave cone connected to the Laval nozzle to introduce the raw material gas accelerated to supersonic velocity to generate an oblique shock wave, the raw material gas accelerated to supersonic velocity being introduced into the shock wave cone to generate the oblique shock wave, the oblique shock wave being decelerated to create a high-density gas target in an in-flight manner, the muons generated as a result of causing electrons and positrons to collide with each other being introduced into the high-density gas target thereby to cause a muon-catalyzed nuclear fusion reaction to occur.
    Type: Application
    Filed: October 24, 2023
    Publication date: March 28, 2024
    Applicant: CHUBU UNIVERSITY EDUCATIONAL FOUNDATION
    Inventors: Shinji OKADA, Motoyasu SATO, Atsuo IIYOSHI, Kimitaka ITOH, Takashi MUTOH, Norimasa YAMAMOTO, Yoshiharu TANAHASHI
  • Patent number: 7774154
    Abstract: In the digitizer, a plurality of ADCs convert a plurality of analogue signals output from the device to be tested, to digital signals, respectively. The processing circuit is configured as a software-independent circuit and processes a plurality of digital signals output from the plurality of ADCs. The processing circuit is formed on the FPGA. In the processing circuit, the FFT circuit performs complex Fourier transform on two digital signals.
    Type: Grant
    Filed: June 8, 2007
    Date of Patent: August 10, 2010
    Assignee: Advantest Corporation
    Inventors: Norimasa Sato, Kenji Inaba
  • Publication number: 20080281538
    Abstract: In the digitizer, a plurality of ADCs convert a plurality of analogue signals output from the device to be tested, to digital signals, respectively. The processing circuit is configured as a software-independent circuit and processes a plurality of digital signals output from the plurality of ADCs. The processing circuit is formed on the FPGA. In the processing circuit, the FFT circuit performs complex Fourier transform on two digital signals.
    Type: Application
    Filed: June 8, 2007
    Publication date: November 13, 2008
    Inventors: Norimasa Sato, Kenji Inaba
  • Patent number: 5176812
    Abstract: A copper fin material for heat-exchangers is characterized in that, on the surface of Cu or Cu alloy strip, an inner side diffused layer comprising Cu and Zn and a surface side diffused layer provided on the surface side thereof comprising Cu, Zn and elements with a lower diffusion coefficient into Cu than that of Zn is formed. A method of producing the same is characterized in that, after an alloy film comprising Zn and element with a lower diffusion coefficient into Cu than that of Zn is formed on the surface of a Cu or Cu alloy strip, a diffusion treatment is performed under heat so that, on the surface of the Cu or Cu alloy strip, an inner side diffused layer comprising Cu and Zn and a surface side diffused layer provided on the surface side thereof comprising Cu, Zn and elements with a lower diffusion coefficient into Cu than that of Zn are formed. Alternatively, the diffusion treatment under heat is combined with a rolling processing step.
    Type: Grant
    Filed: July 29, 1991
    Date of Patent: January 5, 1993
    Assignees: The Furukawa Electric Co., Ltd., Nippondenso Co., Ltd.
    Inventors: Hideo Suda, Norimasa Sato, Katsuhiko Takada, Sumio Susa, Yasushi Aiyoshizawa, Kenichi Omata
  • Patent number: 5063117
    Abstract: A copper fin material for heat-exchanger characterized in that, on the surface of Cu or Cu alloy strip, the formation of an inner side diffused layer comprising Cu and Zn and a surface side diffused layer being provided on the surface side thereof and comprising Cu, Zn and elements with a lower diffusion coefficient into Cu than that of Zn is disclosed. A method of producing the same is characterized in that, after an alloy film comprising elements with a lower diffusion coefficient into Cu than that of Zn and Zn was formed on the surface of Cu or Cu alloy strip, a diffusion treatment is given under heat so that, on the surface of Cu or Cu alloy strip, an inner side diffused layer comprising Cu and Zn and a surface side diffused layer being provided on the surface side thereof and comprising Cu, Zn and elements with a lower diffusion coefficient into Cu than that of Zn are formed, or the diffusion treatment under heat and the rolling processing are given.
    Type: Grant
    Filed: December 21, 1989
    Date of Patent: November 5, 1991
    Assignees: The Furukawa Electric Co., Ltd., Nippondenso Co., Ltd.
    Inventors: Hideo Suda, Norimasa Sato, Katsuhiko Takada, Sumio Susa, Yasushi Aiyoshizawa, Kenichi Omata
  • Patent number: 4765055
    Abstract: A method of inexpensively fabricating a superconducting cavity having thin, clean, and smooth superconductive films of excellent resonance characteristics, and the steps of forming a first thin film layer made of hydrogen transmission-preventive metal on the outer periphery of the core made of a metal having a higher ionization tendency than hydrogen in the electrochemical series, then forming a second thin film layer of superconducting material on the outer periphery of the first thin film layer, forming a third thin film layer made of a metal having a high thermal conductivity and a high bondabilty on the outside of the second thin film layer, forming a reinforced coating layer of stabilizing metal through composite fiber plated with copper on tungsten fiber on the third thin film layer, forming a cooling pipe on the outside, and then removing the core and the first thin film layer by dissolving with the surface of the superconductor being a replica of the core surface.
    Type: Grant
    Filed: August 18, 1986
    Date of Patent: August 23, 1988
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Masanori Ozaki, Isamu Ohishi, Norimasa Sato, Yasuzou Tanaka