Patents by Inventor Norimasa Takada

Norimasa Takada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip type semiconductor device
    Patent number: 5046161
    Abstract: A flip chip type semiconductor device includes a substrate, a polyimide film and an inorganic passivation film. An opening having a rectangular configuration is formed in the inorganic passivation layer provided on an electrode pad. The polyimide film is formed within the opening and on the inorganic passivation layer only in the vicinity of the opening so that the polyimide film is not formed on a circuit element of the semiconductor device. A circular window is formed in the polyimide film within the opening. A bump structure formed in the window is electrically connected to the electrode pad.
    Type: Grant
    Filed: February 22, 1989
    Date of Patent: September 3, 1991
    Assignee: NEC Corporation
    Inventor: Norimasa Takada
  • Finger grip for syringe
    Patent number: D895110
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: September 1, 2020
    Assignees: Taisei Kako Co., Ltd., Seikagaku Corporation
    Inventors: Norimasa Takada, Tomoyuki Sonoyama