Abstract: To improve thermal resistance of a double-sided wiring glass substrate. A through-hole is filled with a copper post composed of metallic copper to thereby electrically connect the front and rear surfaces of the double-sided wiring glass substrate. The filling with the copper post is performed by first sealing, with copper, one opening part of the through-hole using an electrolytic plating method and then further plating copper from the one sealed opening part to the other opening part. As a result, the front and rear surfaces of the double-sided wiring glass substrate can be surely electrically connected as well as high thermal resistance of the whole double-sided wiring glass substrate can be secured.

Abstract: To improve thermal resistance of a double-sided wiring glass substrate. A through-hole is filled with a copper film layer composed of metallic copper for electrically connecting the front and rear surfaces of the double-sided wiring glass substrate. The copper film layer is formed by first forming an electroless plating copper layer and then forming an electrolytic plating copper layer on a sidewall of the through-hole. As a result, the front and rear surfaces of the double-sided wiring glass substrate can be surely electrically connected as well as high thermal resistance of the whole double-sided wiring glass substrate can be secured.

Abstract: To improve thermal resistance of a double-sided wiring glass substrate. A through-hole is filled with a copper post composed of metallic copper to thereby electrically connect the front and rear surfaces of the double-sided wiring glass substrate. The filling with the copper post is performed by first sealing, with copper, one opening part of the through-hole using an electrolytic plating method and then further plating copper from the one sealed opening part to the other opening part. As a result, the front and rear surfaces of the double-sided wiring glass substrate can be surely electrically connected as well as high thermal resistance of the whole double-sided wiring glass substrate can be secured.

Abstract: To improve thermal resistance of a double-sided wiring glass substrate. A through-hole is filled with a copper film layer composed of metallic copper for electrically connecting the front and rear surfaces of the double-sided wiring glass substrate. The copper film layer is formed by first forming an electroless plating copper layer and then forming an electrolytic plating copper layer on a sidewall of the through-hole. As a result, the front and rear surfaces of the double-sided wiring glass substrate can be surely electrically connected as well as high thermal resistance of the whole double-sided wiring glass substrate can be secured.