Patents by Inventor Norimichi SHIBUYA

Norimichi SHIBUYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical module
    Patent number: 10042133
    Abstract: A first conductive layer includes a first signal wiring including, at a position except for an end portion, a wide portion having a width wider than that of the other portion. A second conductive layer includes a signal electrode electrically continuous with the end portion of the first signal wiring, a first ground plane overlapping the wide portion, and a ground terminal. A third conductive layer includes a second signal wiring including an end portion overlapping and bonded to the signal electrode, and a ground electrode overlapping and bonded to the ground terminal. A fourth conductive layer includes a second ground plane. The second ground plane includes a through hole overlapping the end portion of the second signal wiring. A fifth conductive layer includes a third groundplane. The third groundplane overlaps the end portion of the second signal wiring inside the through hole.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: August 7, 2018
    Assignee: Oclaro Japan, Inc.
    Inventors: Daisuke Noguchi, Sachiko Mizuseki, Norimichi Shibuya, Hiroshi Yamamoto
  • OPTICAL MODULE
    Publication number: 20170139160
    Abstract: A first conductive layer includes a first signal wiring including, at a position except for an end portion, a wide portion having a width wider than that of the other portion. A second conductive layer includes a signal electrode electrically continuous with the end portion of the first signal wiring, a first ground plane overlapping the wide portion, and a ground terminal. A third conductive layer includes a second signal wiring including an end portion overlapping and bonded to the signal electrode, and a ground electrode overlapping and bonded to the ground terminal. A fourth conductive layer includes a second ground plane. The second ground plane includes a through hole overlapping the end portion of the second signal wiring. A fifth conductive layer includes a third groundplane. The third groundplane overlaps the end portion of the second signal wiring inside the through hole.
    Type: Application
    Filed: November 1, 2016
    Publication date: May 18, 2017
    Inventors: Daisuke NOGUCHI, Sachiko MIZUSEKI, Norimichi SHIBUYA, Hiroshi YAMAMOTO