Abstract: An epoxy resin composition having components (A), (B), (C), and (D), wherein the epoxy resin composition has a viscosity at 40° C. of about 1×103 to about 1×104 Pa·s, a curing start temperature of about 90 to about 110° C., and a minimum viscosity at the curing start temperature of about 2 to about 20 Pa·s, wherein the components (A), (B), (C), and (D) are as follows: (A) About 60 weight parts or more of a tetraglycidyl amine type epoxy resin per 100 weight parts of the epoxy resin blend; (B) Dicyandiamide; (C) Diaminodiphenyl sulfone and (D) Urea compound.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: An epoxy resin composition having components (A), (B), (C), and (D), wherein the epoxy resin composition has a viscosity at 40° C. of about 1×103 to about 1×104 Pa·s, a curing start temperature of about 90 to about 110° C., and a minimum viscosity at the curing start temperature of about 2 to about 20 Pa·s, wherein the components (A), (B), (C), and (D) are as follows: (A) About 60 weight parts or more of a tetraglycidyl amine type epoxy resin per 100 weight parts of the epoxy resin blend; (B) Dicyandiamide; (C) Diaminodiphenyl sulfone and (D) Urea compound.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2) (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: Embodiments disclosed herein include a resin composition comprising two or more different kinds of thermosetting resins, wherein at least one of the two or more different kinds of the thermosetting resins is a multifunctional resin, and a core-shell particle having a core and a shell, wherein a composition of the core is different from a composition of the shell and the composition of the shell has a branched polymer structure comprising at least one main chain and at least one side chain, the main chain or the side chain containing at least one functional group that reacts with the thermosetting resin, a method of manufacturing the resin composition, and a composite comprising a reinforcing fiber and the resin composition.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: An epoxy resin composition for a cured material, comprising (A) an epoxy resin comprising an epoxy compound X, the epoxy compound X has an epoxy equivalent weight of at least 400, (B) a curing agent, and (C) a liquid rubber that is liquid at room temperature and comprises a reactive group; wherein the epoxy compound X has a solubility parameter value of SpX, the liquid rubber has a solubility parameter value of SpY and the ratio of SpY/SpX could be in the range of 0.7 to 1.3; and wherein the liquid rubber could form no visible domains by optical microscopy or has a maximum domain size of at most 3 microns in the cured material is described. The epoxy resin composition provides a fiber-reinforced material with higher compressive modulus and strength, toughness and better handling ability over standard epoxy resin systems. This invention is excellent for small thin walled tube structures like fishing rods or applications that require good compressive strength.

Abstract: An epoxy resin composition for a cured material, comprising (A) an epoxy resin comprising an epoxy compound X, the epoxy compound X has an epoxy equivalent weight of at least 400, (B) a curing agent, and (C) a liquid rubber that is liquid at room temperature and comprises a reactive group; wherein the epoxy compound X has a solubility parameter value of SpX, the liquid rubber has a solubility parameter value of SpY and the ratio of SpY/SpX could be in the range of 0.7 to 1.3; and wherein the liquid rubber could form no visible domains by optical microscopy or has a maximum domain size of at most 3 microns in the cured material is described. The epoxy resin composition provides a fiber-reinforced material with higher compressive modulus and strength, toughness and better handling ability over standard epoxy resin systems. This invention is excellent for small thin walled tube structures like fishing rods or applications that require good compressive strength.