Abstract: A resin composition for photoimprinting, a cured product of the resin composition which is excellent in etching and heat resistance, and a pattern forming process using the resin composition are provided. The resin composition contains photocurable monomer (A) containing at least one carbazole compound of formula (I): a photocurable monomer (B) containing at least one compound of the following formulae (II), (III), and (IV): and a photopolymerization initiator (C). The weight ratio of the photocurable monomer (A) to the photocurable monomer (B) is from 30/70 to 87/13.

Abstract: A resin composition for photoimprinting, a cured product of the resin composition which is excellent in etching and heat resistance, and a pattern forming process using the resin composition are provided. The resin composition contains photocurable monomer (A) containing at least one carbazole compound of formula (I): a photocurable monomer (B) containing at least one compound of the following formulae (II), (III), and (IV): and a photopolymerization initiator (C). The weight ratio of the photocurable monomer (A) to the photocurable monomer (B) is from 30/70 to 87/13.

Abstract: A thermosetting aqueous-type emulsion of nadimide is disclosed. The emulsion comprises 1-70% by weight of an alkenyl-substituted nadimide, 0.1-20% by weight of protective colloid and/or surface-active agent and balance water. The emulsion is especially useful for making a paint, a coating material or an adhesive because the emulsion can easily be cured only by heating without forming any undesirable organic pollutants. In the past, various resins have been used together with organic solvents. However, because of the recent worldwide concern over the influence of organic solvents to pollution of the aerospace and underground environments, non-use or reduced-use of organic solvents is actively desired. Accordingly, developments of aqueous solution or aqueous-type emulsion of resins are desired. Until now there is no aqueous-type emulsion of a monomer of highly heat resistant polyimide.

Abstract: An alkenyl-substituted bisnadimide represented by the following formula [1]: ##STR1## [wherein R.sup.1 and R.sup.2 individually represent a hydrogen atom or a methyl group, and E is an alkylene.multidot.phenylene group or an alkylene.multidot.phenylene.multidot.alkylene group represented by the following formula [2]: ##STR2## (wherein a is an integer of 0 or 1, and R.sup.3 and R.sup.3' individually represent a C.sub.1 -C.sub.4 alkylene group or a C.sub.5 -C.sub.8 cycloalkylene group)], a process for the preparation of the same and a process for curing the same are disclosed. Further, an adhesive material and a coating material containing the bisnadimide as a curing component are also disclosed. A cured material obtaind from the bisnadimide has excellent heat resistance, mechanical strength, toughness, adhesion property to many kinds of substrates, and so on. The adhesive material shows excellent heat resistance and the coating material shows excellent boiling water resistance.

Abstract: A thermosetting resin composition comprising compounds (A) an alkenyl-substituted nadimide, (B) a compound having at least one vinyl group or cyclic olefin, or both and (C) a phenol resin, and optionally (D) at least one polymerization catalyst selected from the group consisting of organic peroxides, onium salts, and cationic catalysts is disclosed. The components contained in the composition exhibit excellent compatibility among them. The cured product obtained from the thermosetting resin composition has superior anti-hygroscopicity and toughness, without impairing excellent heat resistance, electrical characteristics, mechanical strength, and small molding shrinkage inherently possessed by alkenyl-substituted nadimide resin. The composition is useful not only as a laminating material, a casting material, a molding material, a coating material, a paint, an adhesive, a sealing material, etc., but also as a matrix resin for composite materials.

Abstract: An alkenyl-substituted bisnadimide represented by the following formula 1!: ##STR1## wherein R.sup.1 and R.sup.2 individually represent a hydrogen atom or a methyl group, and E is an alkylene.phenylene group or an alkylene.phenylene.alkylene group represented by the following formula 2!: ##STR2## (wherein a is an integer of 0 or 1, and R.sup.3' individually represent a C.sub.1 -C.sub.4 alkylene group or a C.sub.5 -C.sub.8 cycloalkylene group)!, a process for the preparation of the same and a process for curing the same are disclosed. Further, an adhesive material and a coating material containing the bisnadimide as a curing component are also disclosed. A cured material obtaind from the bisnadimide has excellent heat resistance, mechanical strength, toughness, adhesion property to many kinds of substrates, and so on. The adhesive material shows excellent heat resistance and the coating material shows excellent boiling water resistance.