Abstract: Disclosed is a taphole plugging composition for metal melting apparatus, the composition comprising (a) a refractory aggregate having a maximum particle size of 5 mm or less, (b) graphite and silicon nitride each having a maximum particle size of 0.2 mm or less, (c) a refractory clay, (d) a compatibilized binder mixture comprising a phenolic resin, a ketone compound and a pitch, and (e) an organic fine fiber.

Abstract: A colored refractory material for lining an instrument/apparatus used at a high temperature is formed by mixing a powder of a raw material containing ceramics with a coloring agent and kneading with a liquid using a binder. The refractory material is put in lining for a portion being in contact with a high temperature molten substance or being exposed to a high temperature atmosphere, and is dried by heating while adjusting a temperature and a heating time on the basis of color change on the surface of the refractory material.

Abstract: A valve inserting apparatus for an internal combustion engine has a cylinder head of the engine supported by a jig such that its surface on a combustion chamber side is positioned facing upward and the longitudinal axis of a valve guide assembled to the cylinder head is kept vertical while a valve is inserted into the valve guide from above. The valve inserting apparatus includes a valve inserting unit for moving upwards and downwards. A valve holding device detachably, swingably, holds the valve with its head portion facing upward. A valve push-in device is provided and a suction device moves into contact with a lower end of the valve guide. The push-in device comprises an upwardly and downwardly movable push rod having a weight attached to the upper end portion. The push rod abuts the head portion of the valve from above.

Abstract: A valve inserting apparatus is provided for an internal combustion engine having an intake valve and an exhaust valve inserted into respective valve guides on the intake and the exhaust of engine. The valve inserting apparatus comprises a pair of valve supply devices for supplying intake valves and the exhaust valves. A jig has a jig plate, a jig base and a horizontal shaft. The jig plate is supported on the jig base and is swingable about the shaft. A valve inserting device inserts both the intake and exhaust valves. A base for the two valve supply devices and the jig is disposed circumferentially around the base. A supporting column is mounted on the base. The supporting column is movable to advance towards and retract from the jig. The valve inserting device is supported on a swingable frame swingably mounted an the supporting column.

Abstract: In a semiconductor device, particularly a memory device, radioactive rays emitted from the ceramic material of the package enclosing the LSI chip of the device detrimentally influence the electrical properties of the device. In the memory device, the information is destroyed by the radioactive ray emission, which is referred to as a soft error. In the present invention, a shield plate having a shielding effect against radioactive rays is arranged in the space defined by a cover and a carrier. Thus, the radioactive rays emitted from the cover and carrier are blocked by the shielding plate, preferably made of high purity silicon, as well as by the silicon substrate of the LSI chip.

Abstract: A semiconductor device comprising at least one heat sink joined to a plurality of IC packages mounted on a mother board. Plural individual heat sinks are joined to respectively corresponding IC packages each comprising a central shaft joined to and extending in substantially perpendicular relationship from a respective said package and plural, parallel spaced fins extending outwardly from and in perpendicular relationship to the shaft.

Abstract: An integrated circuit device for realizing high integration density wherein a small size package called chip carrier (1) comprising a semiconductor integrated circuit element and providing connecting area at the perimeter of the rear side of said package is mounted onto a wiring board called mother board (2) providing connecting area corresponding to the connecting area of said small size package at the upper surface, characterized in that, contamination or dust existing in the gap between the upper surface of the mother board (2) and rear side of the chip carrier (1) can easily flow out and can be removed, thus improving reliability, by providing a through hole (7) at the chip carrier mounting area on said mother board (2).

Abstract: A semiconductor device having a semiconductor chip (102), a ceramic base (101), a ceramic frame (105) and a cover (106). The ceramic base (101) is formed with a through hole. One side of said hole is covered by a high-heat conductivity metal plate (100). Said semiconductor chip (102) is mounted through a molybdenum plate (110) on the bottom of a recess formed by one side by said high-heat conductivity metal plate (100) and said through hole. A cooling means (107,108) is secured on said high-heat conductivity metal plate (100) opposite to the side for receiving the semiconductor chip (102).