Abstract: The invention provides an optical device that enables a mutual electrical connection between the stacked semiconductor substrates to be realized with ease and high reliability and to provide for miniaturization. The optical device has a first semiconductor substrate having an optical part and a first pad, a second semiconductor substrate having an integrated circuit and a second pad which is stacked under the first semiconductor substrate, a through-hole continuously extending through the first and the second semiconductor substrate, and a conductive part so formed as to include the inside of the through-hole.

Abstract: A semiconductor chip includes a semiconductor substrate, terminals of A (A is an integer equal to or larger than two groups that are included in each of groups, and an integrated circuit. A plurality of terminals in each of the groups are arranged in accordance with predetermined basic terminal arrangement. Each of the A groups is disposed at each of positions that are defined by rotating one of the positions around a point. Each of the groups includes same-function terminals Vdd (Vss, OE, and WE) to achieve the same function at the same positions of the basic terminal arrangement to enable the same semiconductor chips to be stacked.

Abstract: An electronic device includes first and second electronic components. Each of terminals of a first group of the first electronic component is disposed on one of a plurality of first lines passing through a first point. Each of terminals of a second group of the second electronic component is disposed on one of a plurality of second lines passing through a second point. The first and second points coincide with each other, and the first and second lines overlap. The terminals of at least one of the first and second groups are formed to extend along first lines or second lines.

Abstract: A wiring board has a substrate and an interconnect pattern formed on the substrate. The interconnect pattern includes a plurality of lands. Each of the lands includes a base section and an additional section extending from the base section, the base section of each of the lands having the same shape. When a spiral curve is rotated around an origin and disposed to pass over the base section, the additional section is formed to extend from the base section of any one of the lands in a direction along the spiral curve.

Abstract: The invention provides an optical device that enables a mutual electrical connection between the stacked semiconductor substrates to be realized with ease and high reliability and to provide for miniaturization. The optical device has a first semiconductor substrate having an optical part and a first pad, a second semiconductor substrate having an integrated circuit and a second pad which is stacked under the first semiconductor substrate, a through-hole continuously extending through the first and the second semiconductor substrate, and a conductive part so formed as to include the inside of the through-hole.

Abstract: A device is provided to heat the whole heated surface of a carried member carried intermittently with a temperature change over time maintained constant. The device controls the driving of a belt-conveyer so that a heater moves in a carrying direction at a carry time movement velocity that is slower than the carry velocity of a TAB tape if the TAB tape is in a carried state. On the other hand, the heater moves in an opposite carrying direction at a carry standby time movement velocity derived from the difference between the carry velocity and the carry time movement velocity if the TAB tape is in a carry standby state.

Abstract: A semiconductor chip includes a semiconductor substrate, terminals of A (A is an integer equal to or larger than two groups that are included in each of groups, and an integrated circuit. A plurality of terminals in each of the groups are arranged in accordance with predetermined basic terminal arrangement. Each of the A groups is disposed at each of positions that are defined by rotating one of the positions around a point. Each of the groups includes same-function terminals Vdd (Vss, OE, and WE) to achieve the same function at the same positions of the basic terminal arrangement to enable the same semiconductor chips to be stacked.

Abstract: An electronic device includes first and second electronic components. Each of terminals of a first group of the first electronic component is disposed on one of a plurality of first lines passing through a first point. Each of terminals of a second group of the second electronic component is disposed on one of a plurality of second lines passing through a second point. The first and second points coincide with each other, and the first and second lines overlap. The terminals of at least one of the first and second groups are formed to extend along first lines or second lines.

Abstract: A card type semiconductor device includes a main circuit board and a first sub-circuit-board equipped with a main memory. The main circuit board is connected to the first sub-circuit-board through an FPC. A first TCP equipped with the CPU and a second TCP equipped with the I/O sub-system chip are mounted on the top and bottom surfaces of the main circuit board. The first and second TCPs are mounted to directly oppose each other. The card type semiconductor device is used as a card type computer. The main circuit board and the sub-circuit-board face each other by bending the FPC and enclosing the main circuit board and the sub-circuit-board in a card-shaped thin housing. The card type semiconductor device achieves a high density packaging in a small form factor.