Patents by Inventor Norio Kurokawa

Norio Kurokawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming an adhesive layer and adhesive composition
    Patent number: 8772176
    Abstract: In a forming method of an adhesive layer including the steps of selectively coating, on a surface to be bonded, an adhesive composition containing a thermosetting composition and an organic solvent using a noncontact coating device; and removing the organic solvent from the adhesive composition coated on the surface to be bonded and in a forming method of an adhesive layer characterized in the thermosetting composition has a hardening property so as to exhibit two kinds of reaction temperatures, the adhesive composition comprising an epoxy resin and an epoxy curing agent which are reacted through a first hardening reaction exhibiting a first DSC peak within a temperature range of 100 to 160° C. and a second hardening reaction relating to a self-polymerization of the epoxy resin and exhibiting a second DSC peak within a temperature range of 140 to 200° C.
    Type: Grant
    Filed: March 15, 2011
    Date of Patent: July 8, 2014
    Assignees: Kyocera Chemical Corporation, Kabushiki Kaisha Toshiba
    Inventors: Kazuyoshi Sakurai, Yuichi Noguchi, Norio Kurokawa, Yasuo Tane
  • METHOD FOR FORMING AN ADHESIVE LAYER AND ADHESIVE COMPOSITION
    Publication number: 20110263132
    Abstract: In a forming method of an adhesive layer including the steps of selectively coating, on a surface to be bonded, an adhesive composition containing a thermosetting composition and an organic solvent using a noncontact coating device; and removing the organic solvent from the adhesive composition coated on the surface to be bonded and in a forming method of an adhesive layer characterized in the thermosetting composition has a hardening property so as to exhibit two kinds of reaction temperatures, the adhesive composition comprising an epoxy resin and an epoxy curing agent which are reacted through a first hardening reaction exhibiting a first DSC peak within a temperature range of 100 to 160° C. and a second hardening reaction relating to a self-polymerization of the epoxy resin and exhibiting a second DSC peak within a temperature range of 140 to 200° C.
    Type: Application
    Filed: March 15, 2011
    Publication date: October 27, 2011
    Applicants: KABUSHIKI KAISHA TOSHIBA, KYOCERA CHEMICAL CORPORATION
    Inventors: Kazuyoshi Sakurai, Yuichi Noguchi, Norio Kurokawa, Yasuo Tane