Abstract: A multilayer wiring substrate includes a substrate main body and a plurality of wiring lines. The substrate main body includes first and second main surfaces. The plurality of wiring lines extend from the first main surface toward the second main surface side in the substrate main body. The substrate main body includes a plurality of insulator layers laminated on each other. The wiring lines each include via conductors separately provided in the plurality of insulator layers. In at least one of the plurality of wiring lines, a diameter of the via conductor provided in a first insulator layer defining the first main surface of the substrate main body is smaller than a diameter of the via conductor provided in at least one of the plurality of insulator layers other than the first insulator layer.

Abstract: A multilayer substrate having a built-in chip-type electronic component includes a ceramic laminate having a plurality of ceramic layers, a chip-type electronic component disposed in the ceramic laminate and having an external terminal electrode, and a via conductor disposed in the ceramic layers in the lamination direction. The external terminal electrode of the chip-type electronic component is connected to the via conductor, and a connection step is provided in at least one of the upper and lower end surfaces of the via conductor.

Abstract: The purpose of the present invention is to provide, in a simple and also inexpensive manner, a pharmaceutical composition which comprises a plurality of lysosomal enzymes and is effective in treating lysosomal storage disease caused by a deficiency in a plurality of lysosomal enzymes. Provided is a pharmaceutical composition for treating lysosomal storage disease, the composition comprising as an active ingredient a lysosomal enzyme group obtained from cells derived from a subject who does not suffer from lysosomal storage disease.

Abstract: In a method for manufacturing a multilayer ceramic electronic device, a multilayer ceramic element assembly including laminated unsintered ceramic base material layers, a first conductor pattern, a seat portion disposed in a surface of the multilayer ceramic element assembly and arranged to mount a surface mount electronic device thereon, a second conductor pattern connected to the surface mount electronic device, and a resin introduction portion located outside a vertically projected region of the surface mount electronic device and arranged to introduce a resin to the seat portion is prepared. The multilayer ceramic element assembly is fired and the surface mount electronic device is mounted on the seat portion of the fired multilayer ceramic element assembly with the second conductor pattern therebetween. The resin is filled from the resin introduction portion into the seat portion and between the seat portion and the surface mount electronic device and is cured.

Abstract: A multilayer substrate includes a plurality of stacked thermoplastic resin layers each including an in-plane conductive pattern provided on one principal surface thereof and an interlayer conductive portion arranged to penetrate through the thermoplastic resin layer in a thickness direction. The plurality of thermoplastic resin layers include a first thermoplastic resin layer and a second thermoplastic resin layer, a stacking direction of which is inverted with respect to a stacking direction of the first thermoplastic resin layer. The second thermoplastic resin layer is thicker than the first thermoplastic resin layer. One end in the thickness direction of the interlayer conductive portion provided in the second thermoplastic resin layer is connected with the interlayer conductive portion of the thermoplastic resin layer adjacent to the second thermoplastic resin layer in the thickness direction such that the in-plane conductive pattern is not interposed therebetween.

Abstract: A multilayer flexible substrate includes a first structural layer including at least one resin sheet including an insulating layer, a wiring conductor provided on a principal surface of the insulating layer, and filled vias disposed in the insulating layer; and a second structural layer provided on a principal surface of a portion of the first structural layer and including at least one resin sheet including an insulating layer, a wiring conductor provided on a principal surface of the insulating layer, and a filled via provided in the insulating layer. The multilayer flexible substrate includes rigid regions and a flexible region that is more flexible than the rigid regions. In the multilayer flexible substrate, the filled via disposed in the flexible region has a higher porosity than the filled via disposed in the second structural layer.

Abstract: A steam turbine includes two or more rotating blades and a diaphragm outer ring. Each of the rotating blades includes a tip cover, moisture-trapping grooves, a droplet ejection hole, and a drain guide groove. The tip cover is provided to a tip of each of the rotating blades and is connected in contact with another tip cover adjacent to the tip cover. The moisture-trapping grooves are formed in a longitudinal direction of each of the rotating blades. The droplet ejection hole is to connect an outside of the tip cover on a side of the diaphragm outer ring with an inside of the tip cover. The drain guide groove is to connect ends of the moisture-trapping grooves on the side of the tip cover with the droplet ejection hole. The diaphragm outer ring includes a drain pocket which faces the droplet ejection hole.

Abstract: In a method for manufacturing a multilayer ceramic electronic device, a multilayer ceramic element assembly is prepared that includes laminated unsintered ceramic base material layers, a first conductor pattern, a seat portion disposed in a surface of the multilayer ceramic element assembly and arranged to mount a surface mount electronic device thereon, a second conductor pattern connected to the surface mount electronic device, and a resin introduction portion located outside a vertically projected region of the surface mount electronic device and arranged to introduce a resin to the seat portion. The multilayer ceramic element assembly is fired and the surface mount electronic device is mounted on the seat portion of the fired multilayer ceramic element assembly with the second conductor pattern therebetween. The resin is filled from the resin introduction portion into the seat portion and between the seat portion and the surface mount electronic device, and the resin is cured.

Abstract: A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.

Abstract: A packaging material includes an electromagnetic coupling module for an RFID system, in which a radio IC chip is protected from external shock and environmental change without affecting the planarity of the packaging material, the assembly including an electromagnetic coupling module is facilitated, and the radiation characteristics are satisfactory. A packaging material includes a liner and a wave-shaped core material, wherein an electromagnetic coupling module is arranged inside of the packaging material. The electromagnetic coupling module includes a radio IC chip and a feeder circuit board, on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element. The packaging material is made of a dielectric, wherein the dielectric and the electromagnetic coupling module are electromagnetically coupled to transmit/receive high frequency signals.

Abstract: An image processing device including a first image reading unit to read image data on a front side of a document page, a second image reading unit to read image data on a back side of the document page, a first image processing unit to process the image data read by the first image reading unit, a second image processing unit to process the image data read by the second image reading unit, a memory to store image data, a memory control unit to control access to the memory, and a bus switch that connects the first image processing unit and the second image processing unit to the memory control unit. The bus switch includes a first compression unit to compress the image data processed by the first image processing unit, and a second compression unit to compress the image data processed by the second image processing unit.

Abstract: A multilayer substrate includes a plurality of stacked thermoplastic resin layers each including an in-plane conductive pattern provided on one principal surface thereof and an interlayer conductive portion arranged to penetrate through the thermoplastic resin layer in a thickness direction. The plurality of thermoplastic resin layers include a first thermoplastic resin layer and a second thermoplastic resin layer, a stacking direction of which is inverted with respect to a stacking direction of the first thermoplastic resin layer. The second thermoplastic resin layer is thicker than the first thermoplastic resin layer. One end in the thickness direction of the interlayer conductive portion provided in the second thermoplastic resin layer is connected with the interlayer conductive portion of the thermoplastic resin layer adjacent to the second thermoplastic resin layer in the thickness direction such that the in-plane conductive pattern is not interposed therebetween.

Abstract: An electronic component module includes a substrate including a first electrode pattern and a first resist pattern on a first main surface thereof, a first electronic component mounted on the first main surface via the first electrode pattern, and a component-embedding resin layer provided on the first main surface so as to embed the first electronic component therein, and including, in an inside portion or a lateral portion thereof, an interlayer connection conductor connecting the first electrode pattern and an external connection electrode pattern disposed on a surface of the component-embedding resin layer to each other. The first electrode pattern and the first resist pattern are arranged so that the first resist pattern is disposed on top of a circumferential portion of the first electrode pattern.

Abstract: A steam turbine includes two or more rotating blades and a diaphragm outer ring. Each of the rotating blades includes a tip cover, moisture-trapping grooves, a droplet ejection hole, and a drain guide groove. The tip cover is provided to a tip of each of the rotating blades and is connected in contact with another tip cover adjacent to the tip cover. The moisture-trapping grooves are formed in a longitudinal direction of each of the rotating blades. The droplet ejection hole is to connect an outside of the tip cover on a side of the diaphragm outer ring with an inside of the tip cover. The drain guide groove is to connect ends of the moisture-trapping grooves on the side of the tip cover with the droplet ejection hole. The diaphragm outer ring includes a drain pocket which faces the droplet ejection hole.

Abstract: A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.

Abstract: A container includes an electromagnetic coupling module on an inner surface of a container main body and a radiator made of a metal material on an outer surface of the container main body. The electromagnetic coupling module includes a feeder circuit board, on which a radio IC chip is mounted and in which a feeder circuit including a resonant circuit that has a predetermined resonant frequency and includes an inductance element is provided. The electromagnetic coupling module and the radiator preferably transmit and receive high-frequency signals through electromagnetic coupling. The container thus has an electromagnetic coupling module that includes a radio IC chip that is resistant to a shock applied from the outside and an environmental change, realizes an easy arrangement of a radiator and the electromagnetic coupling module, provides a preferable radiation characteristic, and is suitably used in an RFID system.

Abstract: A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.

Abstract: In a composite body, a frame body includes a frame member and a plurality of connection members formed by bending thin metal plates. The frame member includes a through-hole and extends along a peripheral portion of a substrate body. Each of the plurality of connection members has a first strip and a second strip continuously connected to opposed ends of a middle strip. The connection members are disposed in the frame member. Each of the first and second strips of the connection member is exposed on a major surface extending around the through-hole. The first strip and the second strip extend in a direction in which the connection members face each other, and opposed ends of the middle strip are continuously connected to the first strip and the second strip on the side adjacent to the through-hole. The middle strip extends through the inside of the frame member.

Abstract: A multilayer substrate having a built-in chip-type electronic component includes a ceramic laminate having a plurality of ceramic layers, a chip-type electronic component disposed in the ceramic laminate and having an external terminal electrode, and a via conductor disposed in the ceramic layers in the lamination direction. The external terminal electrode of the chip-type electronic component is connected to the via conductor, and a connection step is provided in at least one of the upper and lower end surfaces of the via conductor.

Abstract: A multilayer substrate having a built-in chip-type electronic component includes a ceramic laminate having a plurality of ceramic layers, a chip-type electronic component disposed in the ceramic laminate and having an external terminal electrode, and a via conductor disposed in the ceramic layers in the lamination direction. The external terminal electrode of the chip-type electronic component is connected to the via conductor, and a connection step is provided in at least one of the upper and lower end surfaces of the via conductor.