Abstract: A pile fabric comprises a base fabric and a pile layer composed of many cut piles extending from at least one face of the base fabric, and has a pile length of from 2 to 30 mm. The pile yarns forming the cut piles are core-sheath type composite yarns each comprising a core portion composed of thick fibers (preferably filaments) having a single fiber size of from 5 to 55 dtex and a sheath portion that is composed of thin fibers (preferably filaments) having a single fiber size of from 0.01 to 2.5 dtex, and that surrounds and covers the core portion. The pile fabric is excellent in the dust removal effect during wiping, and resistance to laying flat, and is useful as a fabric for cleaning.

Abstract: To make a three-dimensional object, an optical beam is first irradiated on a predetermined portion of a powder layer to form a sintered layer, which is then covered with a new powder layer. The optical beam is again irradiated on a predetermined portion of the new powder layer to form another sintered layer that has been united with the underlying sintered layer. These processes are repeatedly carried out to form a plurality of sintered layers united together. When the second lower density layer is formed on the first higher density layer, a powder material layer for the lower density layer is formed at a predetermined thickness so as to have a thickness suitable for sintering condition and then the powder material layer is sintered to form the lower density layer.

Abstract: A three-dimensional object of a desired shape is made by irradiating an optical beam on a metal powder layer to form a sintered layer and by laminating such sintered layer one above another. A metal powder composition for use in making such a three-dimensional object includes an iron-based powder material, a nickel and/or nickel alloy powder material, a copper and/or copper alloy powder material, and a graphite powder material. The graphite powder material acts to enhance the wettability during melting and to reduce microcracks during solidification.

Abstract: A three-dimensional object is manufactured by filling and hardening a powder material around a core. A powder material is first filled and layered around the core, and a beam is then selectively irradiated on the layer of powder material to form a hardened layer united with the core. These steps are repeated to form a plurality of hardened layers around the core, thereby manufacturing the three-dimensional object having the core embedded therein.

Abstract: A multilayer printed wiring board is formed with a plurality of conductor layers laminated as a whole with insulating layers interposed, a non-penetrating via hole provided in the insulating layer as bottomed by the conductor layer exposed, a plated layer provided inside the via hole for electric connection between the conductor layers, the via hole being formed to be of a concave curved surface of a radius in a range of 20 to 100 &mgr;m in axially sectioned view at continuing zone of inner periphery to bottom surface of the via hole, whereby the equipotential surfaces occurring upon plating the plated layer are curved along the continuing zone to unify the density of current for rendering the plated layer uniform in the thickness without being thinned at the continuing zone.

Abstract: To make a three-dimensional object, an optical beam is first irradiated on a predetermined portion of a powder layer to form a sintered layer, which is then covered with a new powder layer. The optical beam is again irradiated on a predetermined portion of the new powder layer to form another sintered layer that has been united with the underlying sintered layer. These processes are repeatedly carried out to form a plurality of sintered layers united together, which have a size greater than that of a target shape of the three-dimensional object. A surface region of a shaped object formed by then is removed during the formation of the plurality of sintered layers.

Abstract: A multilayer printed wiring board is formed with a plurality of conductor layers laminated as a whole with insulating layers interposed, a non-penetrating via hole provided in the insulating layer as bottomed by the conductor layer exposed, a plated layer provided inside the via hole for electric connection between the conductor layers, the via hole being formed to be of a concave curved surface of a radius in a range of 20 to 100 &mgr;m in axially sectioned view at continuing zone of inner periphery to bottom surface of the via hole, whereby the equipotential surfaces occurring upon plating the plated layer are curved along the continuing zone to unify the density of current for rendering the plated layer uniform in the thickness without being thinned at the continuing zone.

Abstract: In order for a surface of a three-dimensional sintered object to be smoothly finished by removing unwanted portions and an excessively sintered growth formed during sintering to form sintered layers, the three-dimensional sintered object is formed by repeating successive processes of dispensing a powdery material and directing an optical sintering beam to the powdery material to form the sintered layer, until a required number of integral laminated bodies are formed. During the formation of the integral laminated bodies, trimming is applied to a first zone different from a second zone in which each laminated body is formed, to remove unwanted portions of the respective laminated body.

Abstract: A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns.

Abstract: To make a three-dimensional object, an optical beam is first irradiated on a predetermined portion of a powder layer to form a sintered layer, which is then covered with a new powder layer. The optical beam is again irradiated on a predetermined portion of the new powder layer to form another sintered layer that has been united with the underlying sintered layer. These processes are repeatedly carried out to form a plurality of sintered layers united together, which have a size greater than that of a target shape of the three-dimensional object. A surface region of a shaped object formed by then is removed during the formation of the plurality of sintered layers.

Abstract: A high-frequency module includes first to fifth terminals, a high-pass filter, a high-frequency switch, a transmitter-side balun, and a receiver-side balun. The high-pass filter is connected to the high-frequency switch, and the high-frequency switch is also connected to the transmitter-side balun and to the receiver-side balun. The first terminal is connected to an antenna, the second and third terminals are connected to a transmitter circuit, and the fourth and fifth terminals are connected to a receiver circuit.

Abstract: A high frequency component is constructed such that the characteristics of a high frequency circuit that cannot be measured only by an outwardly extending terminal electrode are easily measured at the final-product stage. In the high frequency component, a substrate has an electrode pattern provided including a signal measuring electrode pad. Additionally, chip components are mounted on the substrate. A metal cover has a hole provided near the signal measuring electrode pad. Through the hole, a probe of a measuring apparatus is inserted from the outside to abut with the electrode pad. With the arrangement, a voltage signal obtained at a predetermined point of the high frequency circuit is measured.

Abstract: A multilayer printed wiring board is formed with a plurality of conductor layers laminated as a whole with insulating layers interposed, a non-penetrating via hole provided in the insulating layer as bottomed by the conductor layer exposed, a plated layer provided inside the via hole for electric connection between the conductor layers, the via hole being formed to be of a concave curved surface of a radius in a range of 20 to 100 &mgr;m in axially sectioned view at continuing zone of inner periphery to bottom surface of the via hole, whereby the equipotential surfaces occurring upon plating the plated layer are curved along the continuing zone to unify the density of current for rendering the plated layer uniform in the thickness without being thinned at the continuing zone.

Abstract: A high frequency component minimizes changes in the inductance of a chip coil mounted on a substrate such that stable characteristics are obtained. In the high frequency component, chip components including the chip coil are mounted on the substrate. A hole is provided in a portion of a metal cover positioned above the chip coil when the metal cover covers the top portion of the substrate.

Abstract: A closed compressor includes a compression mechanism contained in a closed vessel and a motor drive section for driving the compression mechanism. A compression mechanism holder is secured to the inner surface of the closed vessel to hold the compression mechanism within the closed vessel.

Abstract: An automotive air conditioning apparatus 10 is provided which includes a forced water supply system 9 and a heat pump system 14. A controller 16 controls the temperature of a second heat exchanger 38 of the heat pump system 14 to a desired temperature based on a preset temperature. The controller 16 also controls the temperature of the water circulating through the heat exchanger 20 of the forced water supply system 9 to a temperature at which the quantity of heat exchange between the air heated by the second heat exchanger 38 to the desired temperature and the heat exchanger 20 of the forced water supply system is minimized. According to this air conditioning arrangement, the temperature of the vehicle interior can be promptly raised without any capability drop being caused and thus, the heating efficiency of the apparatus being well enhanced.

Abstract: A hermetic electric compressor includes a motor unit having a stator coil and a compressor unit driven by the motor unit for compressing refrigerant gas. A temperature sensor is provided at the stator coil for monitoring a temperature of the stator coil. A control unit is further provided to control a rotational frequency or speed of the motor unit via the stator coil depending on the monitored temperature of the stator coil. The temperature sensor and the control unit are connected via a shielded cable or a twisted pair. The shielded cable or the twisted pair may be grounded via a capacitor. Further, a thermostat may also be provided at the stator coil and connected in series to the temperature sensor.

Abstract: The printed circuit board comprises a substrate 1 including a part loading portion 3 into which an electronic part 5 can be loaded, a plurality of contact terminals 2 which are respectively formed on one surface of the substrate 1 and the surfaces of which are exposed to the outside to provide external contacts, and openings 4 respectively formed in the other surface of the substrate 1 for insertion of bonding wires 6 which are used to connect the electronic part 5, which are to be loaded into the part loading portion 3 of the substrate 1, to its associated contact terminals 2. In the printed circuit board, each of the contact terminals 2 is formed of a metal foil 9 directly and closely attached to the substrate 1. This can prevent the lowered heat resistance of a printed circuit board which occurs when the metal foil, which is used to form the contact terminals 2, is bonded to the substrate 1 using an adhesive.

Abstract: A connector 30 is integrated in a hermetic compressor 10. A flange block 48 is secured on the connector 30 by a screw 62. The connector 30 and the flange block 48 have through-holes 38 and 50, respectively, and a tube 54 is inserted into through-hole 50. A flange 58 is integrally formed in a peripheral surface of one end portion of the tube 54. Also, an elastic ring 60 is fitted near the flange 58. The flange 58 and the elastic ring 60 are positioned in enlarged diameter portions 40 and 42 formed in the connector 30 so that the ring 60 seals against the tube 54 and the connector 30. With this arrangement, simply by tightening the screw using a screwdriver, the tube can be securely connected with the container.

Abstract: A stripline-type delay line has a plurality of rectangular sheet layers which are made from a dielectric material with a relative dielectric constant .di-elect cons.r of about 6.3, having magnesium oxide and silica as main components. One sheet layer is placed at the top, and the other layers are laminated thereunder in the following order: a sheet layer on which a first ground conductor is formed on its upper surface, a sheet layer on which a transmission line folded in a meander shape is formed on its upper surface, and a sheet layer on which a second ground conductor is formed on its upper surface. On side faces of the laminated dielectric and on adjacent portions of the upper and lower surfaces, an input terminal, an output terminal, and ground terminals are formed by printing, and then the dielectric is baked.