Abstract: In a semiconductor integrated circuit device having laser-trimmable fuses and a trimming position pattern, in order to increase trimming accuracy and reduce the size of the positioning pattern, the fuses and the positioning pattern are formed using the same thin film. The trimming positioning pattern has an abrupt boundary between a high light reflectivity region and a low reflectivity region so that light reflectivity varies abruptly. To further reduce size, the trimming positioning pattern can be formed in pad areas of a integrated circuit chip or placed at intersections between scribe lines in a wafer.

Abstract: A linear image sensor IC comprising a plurality of switching circuits each connected to a plurality of light receiving elements in series; scanning circuits for sequentially switching said switching circuits; and driving circuits for operating said scanning circuits, wherein a LOCOS isolation layer is formed between an edge in the main scanning direction of the linear image sensor IC which is closest to an array of the light receiving elements and a light receiving portion of the light receiving element. The inventive image sensor IC is mounted by devising so that the circuit can be put into a thin and long pattern in the scanning direction, so that the chip having a width thinner than a thickness thereof which had been beyond expectation by the prior art can be realized. The use of this very thin IC allows a compact IC assembling substrate having less fluctuation among ICs to be manufactured at low cost.