Patents by Inventor Noritoshi SHIBATA

Noritoshi SHIBATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Storage device including semiconductor chips sealed with resin on metal plate
    Patent number: 11616024
    Abstract: A semiconductor device includes a metal plate; a sidewall member surrounding a periphery of a space above the metal plate; a circuit board provided on the metal plate; a semiconductor chip provided on the circuit board; a first wire connecting the semiconductor chip and an interconnect part of the circuit board; a first resin member covering a bonding portion between the semiconductor chip and the first wire; and a second resin member provided in the space, the second resin member covering an upper surface of the metal plate, the circuit board, the first resin member, and the first wire. A Young's modulus of the first resin member is greater than a Young's modulus of the second resin member. A volume of the second resin member is greater than a volume of the first resin member.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: March 28, 2023
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventor: Noritoshi Shibata
  • SEMICONDUCTOR DEVICE
    Publication number: 20210242133
    Abstract: A semiconductor device includes a metal plate; a sidewall member surrounding a periphery of a space above the metal plate; a circuit board provided on the metal plate; a semiconductor chip provided on the circuit board; a first wire connecting the semiconductor chip and an interconnect part of the circuit board; a first resin member covering a bonding portion between the semiconductor chip and the first wire; and a second resin member provided in the space, the second resin member covering an upper surface of the metal plate, the circuit board, the first resin member, and the first wire. A Young's modulus of the first resin member is greater than a Young's modulus of the second resin member. A volume of the second resin member is greater than a volume of the first resin member.
    Type: Application
    Filed: August 7, 2020
    Publication date: August 5, 2021
    Inventor: Noritoshi SHIBATA