Patents by Inventor Noritsugu Matsukura

Noritsugu Matsukura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Piezoelectric vibrating devices and methods for manufacturing same
    Patent number: 8729775
    Abstract: An exemplary piezoelectric vibrating device includes a piezoelectric vibrating piece that vibrates when electrically energized. A first package plate has a main recess in which the piezoelectric vibrating piece is placed, and a peripheral surface surrounding the recess. A second package plate is bonded to the peripheral surface of the first package plate in airtight manner. A band of adhesive bonds the first package plate to the second package plate. The adhesive band surrounds the peripheral surface. Between the adhesive and the main recess is a band of metal film. The band of metal film prevents gas, generated from the adhesive, from flowing into the recess. The band of metal film surrounds the peripheral surface and is disposed inboard of the band of adhesive.
    Type: Grant
    Filed: June 20, 2011
    Date of Patent: May 20, 2014
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventors: Mitoshi Umeki, Ryoichi Ichikawa, Yoshiaki Amano, Kenji Kamezawa, Kenichi Kikuchi, Noritsugu Matsukura
  • PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME
    Publication number: 20110316390
    Abstract: An exemplary piezoelectric vibrating device includes a piezoelectric vibrating piece that vibrates when electrically energized. A first package plate has a main recess in which the piezoelectric vibrating piece is placed, and a peripheral surface surrounding the recess. A second package plate is bonded to the peripheral surface of the first package plate in airtight manner. A band of adhesive bonds the first package plate to the second package plate. The adhesive band surrounds the peripheral surface. Between the adhesive and the main recess is a band of metal film. The band of metal film prevents gas, generated from the adhesive, from flowing into the recess. The band of metal film surrounds the peripheral surface and is disposed inboard of the band of adhesive.
    Type: Application
    Filed: June 20, 2011
    Publication date: December 29, 2011
    Inventors: Mitoshi Umeki, Ryoichi Ichikawa, Yoshiaki Amano, Kenji Kamezawa, Kenichi Kikuchi, Noritsugu Matsukura