Patents by Inventor Noriyasu Ikeda

Noriyasu Ikeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230220371
    Abstract: A method and a device that enable inactivation of a virus even if the nature and the like of the virus is unknown. The method for inactivating a virus involves preparing a laser that emits laser light having a specific wavelength, and irradiating a virus with the laser light to inactivate the virus.
    Type: Application
    Filed: March 9, 2021
    Publication date: July 13, 2023
    Inventor: Noriyasu IKEDA
  • Publication number: 20230188770
    Abstract: Current bidirectional broadcasting systems do not consider the reduced level of performance by performers when distributing a no-audience live performance. Provided is a bidirectional broadcasting method enabling an audience to enjoy a live performance distributed through a monitor, and characterized by comprising collecting reaction sound in real time from each audience member in response to a live distribution, outputting the real-time reaction sound from each audience member in response to the live distribution as an analog acoustic signal to speakers installed in a live event venue from which the live event is being distributed over a communication channel, and communicating, to a live performer in real time, the reactions of the audience members to the live distribution.
    Type: Application
    Filed: March 9, 2021
    Publication date: June 15, 2023
    Inventor: Noriyasu IKEDA
  • Publication number: 20150318286
    Abstract: This semiconductor device comprises: a bit line that is arranged in a memory cell region on a semiconductor substrate; and a gate electrode of a transistor for a peripheral circuit, which is arranged in a peripheral circuit region on the semiconductor substrate. The lateral surface of the gate electrode is provided with a plurality of side wall insulating films, while the lateral surface of the bit line is provided with a single side wall insulating film.
    Type: Application
    Filed: November 11, 2013
    Publication date: November 5, 2015
    Inventor: Noriyasu Ikeda
  • Patent number: 8604522
    Abstract: In one embodiment, a semiconductor device includes a well region of a second conductivity type, a control electrode, a first main electrode and a second main electrode. The well region has a source region and a drain region of a first conductivity type selectively formed in a surface of the well region. The control electrode is configured to control a current path between the source region connected to the first main electrode and the drain region connected to the second main electrode. With respect to a reference defined as a position of the well region at an identical depth to a portion of the source region or the drain region with maximum curvature, a peak of impurity concentration distribution of the second conductivity type is in a range of 0.15 micrometers on a side of the surface of the well region and on a side opposite to the surface.
    Type: Grant
    Filed: January 17, 2011
    Date of Patent: December 10, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masataka Takebuchi, Kazuhiro Utsunomiya, Noriyasu Ikeda
  • Publication number: 20110175173
    Abstract: In one embodiment, a semiconductor device includes a well region of a second conductivity type, a control electrode, a first main electrode and a second main electrode. The well region has a source region and a drain region of a first conductivity type selectively formed in a surface of the well region. The control electrode is configured to control a current path between the source region connected to the first main electrode and the drain region connected to the second main electrode. With respect to a reference defined as a position of the well region at an identical depth to a portion of the source region or the drain region with maximum curvature, a peak of impurity concentration distribution of the second conductivity type is in a range of 0.15 micrometers on a side of the surface of the well region and on a side opposite to the surface.
    Type: Application
    Filed: January 17, 2011
    Publication date: July 21, 2011
    Inventors: MASATAKA TAKEBUCHI, Kazuhiro Utsunomiya, Noriyasu Ikeda
  • Patent number: 5712046
    Abstract: A titanium ring for an electrodeposition drum has an attractive, uniform surface without patterns comprising bright and dark spots which are formed during surface polishing. The ring has a thickness of 4-30 mm and a surface hardness when it has been polished to an average surface roughness Ra of at most 0.3 .mu.m such that the difference between the maximum and minimum Vickers hardness measured with a load of at most 1 kg at 10 or more points disposed at a pitch of 0.3-1 mm along a line in an arbitrary direction along the surface is at most 10. The ring can be manufactured by welding of a rolled plate or by ring rolling of a tube. When the temperature of the material forming the ring is heated to at least its .beta. transformation point, cooling past the .beta. transformation point is carried out at a rate of at least 1000.degree. C. per hour. Subsequent working or heat treatment is carried out below the .beta. transformation point.
    Type: Grant
    Filed: July 3, 1996
    Date of Patent: January 27, 1998
    Assignee: Sumitomo Metal Industries, Ltd.
    Inventors: Toru Kamidaira, Seishi Ishiyama, Noriyasu Ikeda, Daiharu Doi
  • Patent number: 4653684
    Abstract: This invention relates to a welding material for welding a high-Si austenite stainless steel, capable of ensuring a high corrosion resistance of the weld metal in hot nitric acid of high concentration, while maintaining a toughness of the weld metal not smaller than 2 Kg-m/cm.sup.2, and the method of application therefor. The welding material has a composition containing not greater than 0.015% of C, 5 to 7% of Si, not greater than 2% of Mn, 15 to 20% of Cr, 10 to 22% of Ni, not greater than 0.02% of N, not greater than 0.45% of one or both of Nb and Ta, and the balance substantially Fe and inevitable impurities the sum of C and N contents is selected to be not greater than 0.03% and the sum of Nb and Ta contents is selected to be not smaller than 15.times.(C+N)%. The Ni-balance value given by the following formula ranges between -4 and -2.Ni balance value=% Ni+30(%C+%N)+0.5(%Mn)-1.1(%Cr+1.5.times.%Si)+8.
    Type: Grant
    Filed: September 12, 1984
    Date of Patent: March 31, 1987
    Assignees: Nippon Stainless Steel Co. Ltd., Sumitomo Chemical Co., Ltd.
    Inventors: Kiichi Saito, Masahiro Aoki, Noriyasu Ikeda, Masayoshi Miki, Masaaki Nagayama
  • Patent number: 4585479
    Abstract: This invention relates to a welding material of ferrite-austenite two-phase stainless steel capable of producing a weld metal having a high resistance to corrosion, particularly in an environment containing nitric acid, and the method of application therefor. The welding material consists essentially of not more than 0.03% of C, not more than 2.0% of Si, not more than 2.0% of Mn, 25 to 30% of Cr, 7 to 12% of Ni, not more than 0.35% of N, and the balance Fe and inevitable impurities. The Ni balance value given by the following formula ranges between -11.7 and -6.7:Ni balance value=Ni%+0.5.times.Mn%+30.times.(C+N)%-1.1 (Cr%+1.5.times.Si%)+8.2.
    Type: Grant
    Filed: February 16, 1984
    Date of Patent: April 29, 1986
    Assignees: Sumitomo Chemical Co., Ltd., Nippon Stainless Steel Co., Ltd.
    Inventors: Masahiro Aoki, Kiichi Saito, Takeshi Yoshida, Noriyasu Ikeda, Masanori Takahashi, Masao Okubo, Masaaki Nagayama