Abstract: A surface protective sheet comprises an adhesive layer having a plurality of layers on one side of a base film, the adhesive layer having a 25° C. storage elastic modulus of 10 to 100 MPa, and an adhesive strength with respect to a silicon mirror wafer of 1.0 N/20 mm or less at peeling off the surface protective sheet. The surface protective sheet is used for a semiconductor wafer having a protruding electrode of 10 to 150 ?m height on its surface.

Abstract: An adhesive sheet for dicing a semiconductor wafer having a laminate comprises; a base film, an intermediate layer and an adhesive layer, the intermediate layer is formed by a thermoplastic resin having a melting point of 50 to 100° C.; and the base film has a higher melting point than the intermediate layer as well as a method for dicing a semiconductor wafer comprises the steps of: adhering the adhesive sheet according to the above to a corrugated surface of a semiconductor wafer, and dicing the semiconductor wafer.

Abstract: The present invention provides a method of applying a pressure-sensitive adhesive sheet for semiconductor wafer protection, the method including applying to a surface of a semiconductor wafer a pressure-sensitive adhesive sheet for semiconductor wafer protection including a substrate, at least one interlayer, and a pressure-sensitive adhesive layer superposed in this order, in which the pressure-sensitive adhesive sheet is applied to the semiconductor wafer at an application temperature in the range of from 50° C. to 100° C. and the interlayer in contact with the pressure-sensitive adhesive layer has a loss tangent (tan ?) of 0.5 or larger at the application temperature.

Abstract: The invention provides an adhesive sheet for grinding a back surface of a semiconductor wafer, which is to be adhered to a circuit forming surface of the semiconductor wafer when the back surface of the semiconductor wafer is ground, in which the adhesive sheet contains an adhesive layer, an intermediate layer and a substrate in this order from the circuit forming surface side, the intermediate layer has a JIS-A hardness of more than 55 to less than 80, and the intermediate layer has a thickness of 300 to 600 ?m. Furthermore, the invention also provides a method for grinding a back surface of a semiconductor wafer, including adhering the above-mentioned adhesive sheet to a circuit forming surface of the semiconductor wafer, followed by grinding the back surface of the semiconductor wafer.

Abstract: The weather strip of the invention has an attachment base and a sealing part to be integrally attached to the attachment base for sealing a gap between a vehicle body opening open/close member and a vehicle body opening part. The attachment base has a substantially U-shaped section or a substantially J-shaped section that is formed of a vehicle exterior side wall, a vehicle interior side wall, and a bottom wall, and a sealant member formed from an adhesive material is attached to an inner surface of the attachment base having the substantially U-shaped section or the substantially J-shaped section. The tip of the flange is inserted into an inner part of the sealant member, and the attachment base is attached by an adhesion force of the sealant member.