Abstract: A circuit module includes: a multilayer board having a plurality of first through-holes each penetrating at least one layer thereof; a plurality of high frequency components disposed in the plurality of first through-holes, respectively; and a plurality of shield parts individually surrounding the plurality of high frequency components. The multilayer board has a second through-hole penetrating at least a layer in which each high frequency component is disposed. Each of the plurality of shield parts includes a first conductor, a second conductor, and a third conductor. The first conductor and the second conductor sandwich the high frequency component in a lamination direction of the multilayer board. The third conductor is disposed in the second through-hole.

Abstract: A high frequency device includes a semiconductor chip including a semiconductor substrate, and an amplifier provided on a front surface of the semiconductor substrate and amplifying a high frequency signal, a first reference potential layer provided above the semiconductor chip in an upper direction perpendicular to the front surface of the semiconductor substrate, and provided so as to overlap with the semiconductor chip in a plan view from above, and to which a reference potential is supplied, and a resonator provided between the semiconductor chip and the first reference potential layer in the upper direction perpendicular to the front surface of the semiconductor substrate, wherein a resonance frequency of the resonator is included in an operating frequency band of the amplifier, and an impedance of the resonator becomes minimal at the resonance frequency.

Abstract: A harmonic processing circuit includes: a feeder line configured to feed power to an amplifying device; and a harmonic processing unit connected to the feeder line, and configured to perform harmonic processing to a harmonic of a signal outputted from the amplifying device. The feeder line is connected to a fundamental wave matching circuit that is connected to the amplifying device and performs matching with respect to a fundamental wave of the signal.

Abstract: A harmonic processing circuit includes: a first feeder line branching from a signal line configured to transmit a signal to be inputted to or outputted from an amplifier; and a first setting unit connected to the first feeder line and configured to set an impedance in the signal line to a harmonic of the signal. At least part of the first setting unit is configured by a lumped circuit.