Patents by Inventor Noriyoshi Urushiwara

Noriyoshi Urushiwara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11211881
    Abstract: A power conversion device achieves size reduction and reliability by reducing the number of components of the system. The power conversion device has a semiconductor module of a half-bridge configuration in which two semiconductor elements are arranged in series. The semiconductor module has a cuboidal shape and has, along a longitudinal direction thereof, a positive pole terminal, a negative pole terminal, and terminals for inputting or outputting alternating current or for forming a single phase of the power conversion device. In the vertical direction corresponding to a widthwise direction of the cuboid, a plurality of the semiconductor modules are arranged vertically, forming a plurality of phases of the power conversion device. The semiconductor modules of the plurality of phases are installed in contact with a cooling unit, and one or more capacitors are disposed so as to face the cooling unit across the semiconductor modules of the plurality of phases.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: December 28, 2021
    Assignee: HITACHI, LTD.
    Inventors: Keisuke Horiuchi, Kiyoshi Nakata, Noriyoshi Urushiwara, Shuichi Terakado, Kiyoshi Terasawa
  • Publication number: 20210075342
    Abstract: A power conversion device achieves size reduction and reliability by reducing the number of components of the system. The power conversion device has a semiconductor module of a half-bridge configuration in which two semiconductor elements are arranged in series. The semiconductor module has a cuboidal shape and has, along a longitudinal direction thereof, a positive pole terminal, a negative pole terminal, and terminals for inputting or outputting alternating current or for forming a single phase of the power conversion device. In the vertical direction corresponding to a widthwise direction of the cuboid, a plurality of the semiconductor modules are arranged vertically, forming a plurality of phases of the power conversion device. The semiconductor modules of the plurality of phases are installed in contact with a cooling unit, and one or more capacitors are disposed so as to face the cooling unit across the semiconductor modules of the plurality of phases.
    Type: Application
    Filed: October 15, 2018
    Publication date: March 11, 2021
    Inventors: Keisuke HORIUCHI, Kiyoshi NAKATA, Noriyoshi URUSHIWARA, Shuichi TERAKADO, Kiyoshi TERASAWA
  • Patent number: 7453138
    Abstract: The manufacturing method for an electronic circuit device comprises attaching an electronic circuit assembly including a circuit substrate with electronic circuit elements attached to a base, joining lead terminals integrally with the base via frames before molding the lead terminals composed of a different material from that of the base with mold resin, electrically connecting the lead terminals to the electronic circuit assembly, molding the electronic circuit assembly, lead terminals, and flange with mold resin in a batch partially excluding the flange and lead terminals installed on the base, and separating and removing the frames from the lead terminals and base after the molding with the mold resin.
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: November 18, 2008
    Assignee: Hitachi, Ltd.
    Inventors: Kazuhiko Kawakami, Noriyoshi Urushiwara
  • Publication number: 20070148341
    Abstract: The manufacturing method for an electronic circuit device comprises attaching an electronic circuit assembly including a circuit substrate with electronic circuit elements attached to a base, joining lead terminals integrally with the base via frames before molding the lead terminals composed of a different material from that of the base with mold resin, electrically connecting the lead terminals to the electronic circuit assembly, molding the electronic circuit assembly, lead terminals, and flange with mold resin in a batch partially excluding the flange and lead terminals installed on the base, and separating and removing the frames from the lead terminals and base after the molding with the mold resin.
    Type: Application
    Filed: March 7, 2007
    Publication date: June 28, 2007
    Applicant: HITACHI, LTD.
    Inventors: Kazuhiko KAWAKAMI, Noriyoshi URUSHIWARA
  • Patent number: 7230320
    Abstract: In an electronic circuit device including a substrate including a front surface on which an electronic circuit element is mounted and a reverse surface opposite to the front surface in a thickness direction of the substrate, an electrically conductive terminal member electrically connected to the electronic circuit element, a lead frame extending perpendicular to the thickness direction to face the reverse surface in the thickness direction, and a sealing resin covering at least partially the electronic circuit element, substrate and lead frame while at least a part of the electrically conductive terminal member is prevented from being covered by the sealing resin, the substrate extends to project outward from an end of the lead frame in a transverse direction perpendicular to the thickness direction while the end of the lead frame is covered by the sealing resin.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: June 12, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Hiroaki Doi, Noriyoshi Urushiwara, Akira Matsushita
  • Patent number: 7207314
    Abstract: An engine electronic control unit is inserted through a through hole provided in an intake pipe and mounted in an intake air passage in a direction substantially perpendicularly with respect to a plane of the intake pipe forming the intake air passage. This unit is then secured to the intake pipe using a fixing flange provided at a connector portion. A fixing rail is protruded inside the intake pipe and leading edges of a metal base and a metal cover of the unit are inserted into this rail, thereby securing in position an end opposite to a side of the connector portion of the unit. This realizes an engine electronic control unit offering an outstanding heat radiation performance and vibration resistance, without having to provide special heat radiating parts or without involving an increase in an intake air resistance within the intake air passage. By using such an engine electronic control unit, it is possible to provide a low-cost, compact engine air intake system.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: April 24, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Kohei Sakurai, Minoru Ohsuga, Nobuyasu Kanekawa, Masatoshi Hoshino, Atsushi Kanke, Yutaka Nishimura, Mitsuru Watabe, Noriyoshi Urushiwara
  • Patent number: 7208816
    Abstract: The manufacturing method for an electronic circuit device comprises attaching an electronic circuit assembly including a circuit substrate with electronic circuit elements attached to a base, joining lead terminals integrally with the base via frames before molding the lead terminals composed of a different material from that of the base with mold resin, electrically connecting the lead terminals to the electronic circuit assembly, molding the electronic circuit assembly, lead terminals, and flange with mold resin in a batch partially excluding the flange and lead terminals installed on the base, and separating and removing the frames from the lead terminals and base after the molding with the mold resin.
    Type: Grant
    Filed: August 14, 2003
    Date of Patent: April 24, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Kazuhiko Kawakami, Noriyoshi Urushiwara
  • Patent number: 7047939
    Abstract: An engine electronic control unit is inserted through a through hole provided in an intake pipe and mounted in an intake air passage in a direction substantially perpendicularly with respect to a plane of the intake pipe forming the intake air passage. This unit is then secured to the intake pipe using a fixing flange provided at a connector portion. A fixing rail is protruded inside the intake pipe and leading edges of a metal base and a metal cover of the unit are inserted into this rail, thereby securing in position an end opposite to a side of the connector portion of the unit.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: May 23, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Kohei Sakurai, Minoru Ohsuga, Nobuyasu Kanekawa, Masatoshi Hoshino, Atsushi Kanke, Yutaka Nishimura, Mitsuru Watabe, Noriyoshi Urushiwara
  • Publication number: 20050252487
    Abstract: An engine electronic control unit is inserted through a through hole provided in an intake pipe and mounted in an intake air passage in a direction substantially perpendicularly with respect to a plane of the intake pipe forming the intake air passage. This unit is then secured to the intake pipe using a fixing flange provided at a connector portion. A fixing rail is protruded inside the intake pipe and leading edges of a metal base and a metal cover of the unit are inserted into this rail, thereby securing in position an end opposite to a side of the connector portion of the unit. This realizes an engine electronic control unit offering an outstanding heat radiation performance and vibration resistance, without having to provide special heat radiating parts or without involving an increase in an intake air resistance within the intake air passage. By using such an engine electronic control unit, it is possible to provide a low-cost, compact engine air intake system.
    Type: Application
    Filed: July 1, 2005
    Publication date: November 17, 2005
    Inventors: Kohei Sakurai, Minoru Ohsuga, Nobuyasu Kanekawa, Masatoshi Hoshino, Atsushi Kanke, Yutaka Nishimura, Mitsuru Watabe, Noriyoshi Urushiwara
  • Patent number: 6892699
    Abstract: A throttle body for an internal combustion engine includes an airflow sensor for measuring the flow rate of air passing through a throttle bore, a throttle position sensor for measuring the opening of a throttle valve in the throttle bore, and an engine control unit for controlling the engine. The engine control unit is secured to a base which is any other member than the body containing the throttle bore, and has pins which are electrically connected to at least any of a motor for driving the throttle valve, the airflow sensor, and the throttle position sensor.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: May 17, 2005
    Assignee: Hitachi, Ltd.
    Inventor: Noriyoshi Urushiwara
  • Publication number: 20040212965
    Abstract: A resin-sealed electronic circuit apparatus capable of maintaining a high heat-dissipating property and packaging density in applications where high hermetic-sealing property and durability are required. The electronic circuit apparatus comprises at least two wiring circuit boards 12 and 13 on which electronic components are mounted. The wiring circuit boards 12 and 13 are fixed to a heat sink 14 having a high heat conductivity via an adhesive 9 and 10. The entirety of the wiring circuit boards 12 and 13 and heat sink 14, as well as a part of an external connection terminal 8 are hermetically sealed and integrally molded by a thermosetting resin composition 7. The electronic circuit apparatus is small and highly reliable and can be provided at low cost.
    Type: Application
    Filed: March 17, 2004
    Publication date: October 28, 2004
    Inventors: Toshiaki Ishii, Nobutake Tsuyuno, Mitsuhiro Masuda, Noriyoshi Urushiwara, Akira Matsushita
  • Publication number: 20040159919
    Abstract: In an electronic circuit device including a substrate including a front surface on which an electronic circuit element is mounted and a reverse surface opposite to the front surface in a thickness direction of the substrate, an electrically conductive terminal member electrically connected to the electronic circuit element, a lead frame extending perpendicular to the thickness direction to face the reverse surface in the thickness direction, and a sealing resin covering at least partially the electronic circuit element, substrate and lead frame while at least a part of the electrically conductive terminal member is prevented from being covered by the sealing resin, the substrate extends to project outward from an end of the lead frame in a transverse direction perpendicular to the thickness direction while the end of the lead frame is covered by the sealing resin.
    Type: Application
    Filed: July 29, 2003
    Publication date: August 19, 2004
    Applicant: Hitachi, Ltd.
    Inventors: Hiroaki Doi, Noriyoshi Urushiwara, Akira Matsushita
  • Publication number: 20040154588
    Abstract: An object of this invention is to provide a throttle body and an intake system for an internal combustion engine that can be assembled more easily.
    Type: Application
    Filed: November 25, 2003
    Publication date: August 12, 2004
    Inventor: Noriyoshi Urushiwara
  • Publication number: 20040084756
    Abstract: The manufacturing method for an electronic circuit device comprises attaching an electronic circuit assembly including a circuit substrate with electronic circuit elements attached to a base, joining lead terminals integrally with the base via frames before molding the lead terminals composed of a different material from that of the base with mold resin, electrically connecting the lead terminals to the electronic circuit assembly, molding the electronic circuit assembly, lead terminals, and flange with mold resin in a batch partially excluding the flange and lead terminals installed on the base, and separating and removing the frames from the lead terminals and base after the molding with the mold resin.
    Type: Application
    Filed: August 14, 2003
    Publication date: May 6, 2004
    Applicant: Hitachi, Ltd.
    Inventors: Kazuhiko Kawakami, Noriyoshi Urushiwara
  • Publication number: 20030168043
    Abstract: An engine electronic control unit is inserted through a through hole provided in an intake pipe and mounted in an intake air passage in a direction substantially perpendicularly with respect to a plane of the intake pipe forming the intake air passage. This unit is then secured to the intake pipe using a fixing flange provided at a connector portion. A fixing rail is protruded inside the intake pipe and leading edges of a metal base and a metal cover of the unit are inserted into this rail, thereby securing in position an end opposite to a side of the connector portion of the unit. This realizes an engine electronic control unit offering an outstanding heat radiation performance and vibration resistance, without having to provide special heat radiating parts or without involving an increase in an intake air resistance within the intake air passage. By using such an engine electronic control unit, it is possible to provide a low-cost, compact engine air intake system.
    Type: Application
    Filed: September 27, 2002
    Publication date: September 11, 2003
    Applicant: Hitachi, Ltd..
    Inventors: Kohei Sakurai, Minoru Ohsuga, Nobuyasu Kanekawa, Masatoshi Hoshino, Atsushi Kanke, Yutaka Nishimura, Mitsuru Watabe, Noriyoshi Urushiwara
  • Patent number: 6046584
    Abstract: A rotating position detecting device is capable of detecting a rotating position with high accuracy even if there exists variation in the air gap, and thereby capable of widening a detectable range of the air gap. A position of an irregularity on the detected rotating body is converted into a rectangular wave-form electric signal, and a rotating position of the detected rotating body is detected based on a building-up signal or a falling signal of the rectangular wave-form. The rotating position detecting device has a magneto-electric converter element for outputting an electric signal corresponding to a magnetic intensity, a magnet for generating a magnetic field, and a detected rotating body made of a magnetic material having the irregularity.
    Type: Grant
    Filed: September 29, 1997
    Date of Patent: April 4, 2000
    Assignees: Hitachi, Ltd, Hitachi Car Engineering Co., Ltd.
    Inventors: Mitsutoshi Nakane, Ryoichi Kobayashi, Noriyoshi Urushiwara
  • Patent number: 5581131
    Abstract: A switching circuit for an electronic distributor ignition device for an internal combustion engine. Current flowing through the primary ignition coil is controlled by a semiconductor switch circuit connected between the coil and ground. A control input to the semiconductor switch is also connected to ground by a pair of oppositely poled zener diodes which have a temperature coefficient which approximates that of the semiconductor switch circuit.
    Type: Grant
    Filed: January 19, 1993
    Date of Patent: December 3, 1996
    Assignee: Hitachi, Ltd.
    Inventors: Noriyoshi Urushiwara, Noboru Sugiura
  • Patent number: 5284124
    Abstract: An ignition system of electronic distribution type for an internal combustion engine with which merits of sharing circuits and elements can be expected with satisfactory result, in which wires of a GND line will not be disconnected by fusion even under a condition of abnormal power supply, and in which the engine will not be stalled even in a mode of simultaneously igniting two cylinders, thus enabling the limp-form traveling and made start-up with simultaneous ignition of two cylinders. To this end, power transistors 20 through 25 for power supply control and feedback control circuits 30 through 35 for limiting currents are respectively provided to control ignition coils 4 through 9 in one-to-one relation. A total of two systems of resistance devices 17a, 17b for detecting currents are provided with each resistance device operating a respective group of three cylinders. The feedback control circuits and the resistance devices for detecting currents are formed on a thick-film circuit board 60.
    Type: Grant
    Filed: September 25, 1992
    Date of Patent: February 8, 1994
    Assignee: Hitachi, Ltd.
    Inventors: Norio Moriyama, Noboru Sugiura, Noriyoshi Urushiwara
  • Patent number: 5282452
    Abstract: An electronic distributor for an internal combustion engine, having a plurality of switching elements for conducting and breaking currents flowing to a plurality of ignition coils, a first lead frame for separately flowing the currents of the plurality of switching elements to the plurality of ignition coils and a second single lead frame for dropping current levels of currents of at least two switching elements of the plurality of switching elements to a common electric potential, characterized in that a resistance value of the first lead frames has been set to be larger than a resistance value of the second lead frame.
    Type: Grant
    Filed: October 20, 1992
    Date of Patent: February 1, 1994
    Assignee: Hitachi, Ltd.
    Inventors: Noriyoshi Urushiwara, Noboru Sugiura, Norio Moriyama
  • Patent number: 5193514
    Abstract: An induction discharge system ignition device for an internal combustion engine includes a power switching device for producing a voltage to be applied to the primary winding of an induction coil. The secondary of the induction coil is connected to apply a high-tension voltage to a spark plug. The power switching device and the coil are particularly arranged to produce a voltage of at least 6.0 kV across the electrodes of the spark plug when the spark plug has a leakage of 100 k.OMEGA.. The turns ratio of the coil is, preferably, 70 or less.
    Type: Grant
    Filed: July 8, 1991
    Date of Patent: March 16, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Ryouichi Kobayashi, Noboru Sugiura, Noriyoshi Urushiwara