Abstract: In a semiconductor integrated circuit device including a semiconductor integrated circuit board having a mask ROM area and an internal bus and a programmable ROM which is mounted on the semiconductor integrated circuit board and which has a plurality of ROM connecting terminals, the ROM connecting terminals are electrically connected to a plurality of bus connecting terminals connected to the internal bus, respectively. The bus connecting terminals may be disposed around periphery of the semiconductor integrated circuit board, may be formed on the mask ROM area, and may be disposed on the internal bus. In this event, the ROM connecting terminals and the bus connecting terminals are electrically connected to each other using wire bonding technique.