Abstract: Provided is an electronic device capable of reducing the possibility of malfunction. An electronic device is provided with: a first substrate including a drive circuit; a second substrate including a light-emitting unit driven by the drive circuit and mounted on one surface side of the first substrate; and a light-shielding unit provided on the first substrate and configured to shield at least a part of the drive circuit from light emitted by the light-emitting unit.

Abstract: A light-emitting device formed by easily mounting a light-emitting element onto a supporting base and a method of manufacturing the light-emitting device are provided. A light-emitting device includes: a supporting base including a depression section on a top surface thereof, the depression section having an inclined surface on a side wall thereof; a first light-emitting element arranged on a bottom surface of the depression section; and a second light-emitting element arranged on the first light-emitting element and the supporting base.

Abstract: A light emitting device includes: a support base; a first light emitting element which is provided at one surface side of the support base and has a first substrate; and a second light emitting element which is provided between the first light emitting element and the support base and has a second substrate, which has a light emitting section as a semiconductor layer and a peripheral section other than the light emitting section at the first light emitting element side of the second substrate, and which has an embedded layer formed of a material with higher heat conductivity than the semiconductor layer in the peripheral section.

Abstract: The present invention provides a light emitting device solving weakness caused by bonding between first and second light emitting elements and a method of manufacturing the same. A chip-shaped first light emitting element and a second light emitting element overlapped each other are disposed on a supporting base. Four island-shaped projections are provided on the top face of the supporting base, and support the second light emitting element. The projections are formed by wet-etching or dry-etching the supporting base, and a pad electrode is provided on the top face of the projection. The pad electrode is electrically connected to the second light emitting element and is also electrically connected to a wire.

Abstract: A light emitting device includes: a support base; a first light emitting element which is provided at one surface side of the support base and has a first substrate; and a second light emitting element which is provided between the first light emitting element and the support base and has a second substrate, which has a light emitting section as a semiconductor layer and a peripheral section other than the light emitting section at the first light emitting element side of the second substrate, and which has an embedded layer formed of a material with higher heat conductivity than the semiconductor layer in the peripheral section.

Abstract: An optical device includes: an optical element having a first light-emitting region in the vicinity of a first surface and a first metal layer in contact with at least a region of the first surface which does not face the first light-emitting region; a support body disposed on the side of the optical element toward which the first surface faces; and a fuse-bonding layer disposed between the first surface and the support body and in a region which does not face the first light-emitting region, the fuse-bonding layer bonding the first metal layer and the support body.

Abstract: The present invention provides a light emitting device solving weakness caused by bonding between first and second light emitting elements and a method of manufacturing the same. A chip-shaped first light emitting element and a second light emitting element overlapped each other are disposed on a supporting base. Four island-shaped projections are provided on the top face of the supporting base, and support the second light emitting element. The projections are formed by wet-etching or dry-etching the supporting base, and a pad electrode is provided on the top face of the projection. The pad electrode is electrically connected to the second light emitting element and is also electrically connected to a wire.

Abstract: A light-emitting device formed by easily mounting a light-emitting element onto a supporting base and a method of manufacturing the light-emitting device are provided. A light-emitting device includes: a supporting base including a depression section on a top surface thereof, the depression section having an inclined surface on a side wall thereof; a first light-emitting element arranged on a bottom surface of the depression section; and a second light-emitting element arranged on the first light-emitting element and the supporting base.

Abstract: A circuit for generating a time division multiplex signal, that hardly degrades a phase margin of a test pattern which is outputted as the time division multiplex signal. The circuit for generating a time division multiplex signal, has: a signal generator for generating a plurality of parallel signals; a phase synchronous circuit for advancing a phase of a clock signal; a divider for dividing a frequency of an output outputted from the phase synchronous circuit, for every predetermined clock number; and a time division multiplexer for time-division multiplexing the plurality of parallel signals generated by the signal generator, according to the output outputted from the phase synchronous circuit.

Abstract: A phase frequency detecting circuit is designed to produce an output voltage which varies with respect to an input phase difference between a base phase and a reference phase. Herein, a first phase frequency comparator produces a first phase error signal which is proportional to the input phase difference. A first integration circuit performs integration on the first phase error signal to produce a control voltage. Next, a second phase frequency comparator receives a frequency-divided base phase and a frequency-divided reference phase to produce a second phase error signal. A second integration circuit performs integration on the second phase error signal to produce a frequency-divided control voltage. An offset voltage creating circuit creates an offset voltage. Herein, the offset voltage is created based on the frequency-divided control voltage; and a sign thereof is determined responsive to a relationship between the control voltage and frequency-divided control voltage.