Abstract: An inkjet printing head 1 includes a pressure chamber 5, a movable film formation layer 10 that includes a movable film 10A defining a top surface portion of the pressure chamber 5, and a piezoelectric element 6 that is formed to contact a surface of the movable film 10A at an opposite side from the pressure chamber 5 and having a peripheral edge receded further toward an interior of the pressure chamber 5 than the movable film 10A in plan view. The piezoelectric element 6 includes a lower electrode 7 formed on a surface of the movable film formation layer 10 at the opposite side from the pressure chamber 5, an upper electrode 9 disposed at an opposite side from the movable film formation layer 10 with respect to the lower electrode 7, and a piezoelectric film 8 provided between the upper electrode 9 and the lower electrode 7, and the upper electrode 9 has a thin portion 92 at least at a portion of a peripheral edge portion.

Abstract: An image capturing module is used in an endoscope. The image capturing module comprises an image capturing portion having opposed surfaces defined by respective photodetection and reverse surfaces. The reverse surface includes external electrodes disposed thereon. A layered optical portion having a front surface to which light is applied and a rear surface that is opposite of the front surface. The layered optical portion having a plurality of optical members layered together. A layered device having a first principal surface with joint electrodes disposed thereon. A second principal surface opposes the first principal surface. The first principal surface is bonded to the reverse surface. The joint electrodes are joined to the external electrodes. The layered device includes a plurality of semiconductor devices layered together in which the first principal surface is larger in area than the photodetection surface and smaller in area than the rear surface.

Abstract: A manufacturing method of an image pickup apparatus for endoscope includes: manufacturing two optical wafers each of which has a glass wafer as a base substrate and is a hybrid lens wafer including a plurality of resin lenses, and a spacer wafer including a plurality of spacers and being formed with an inorganic material; manufacturing a bonded wafer in which space in which the plurality of resin lenses are disposed is hermetically sealed by directly bonding the two optical wafers and the spacer wafer at a temperature lower than a softening point of the plurality of resin lenses; disposing a plurality of image pickup members on the bonded wafer; and cutting the bonded wafer on which the plurality of image pickup members are disposed.

Abstract: An endoscope includes an insertion portion that includes a distal end portion and a bending portion configured to change a direction of the distal end portion. The distal end portion includes a casing having a round shape in a cross-section, and an image pickup module that includes an optical module section including a plurality of optical members and an image pickup section, the image pickup module having a rectangular shape in a cross-section, and the image pickup section includes an image pickup device and a semiconductor stack in which a plurality of semiconductor devices is stacked, and entirety of the image pickup module is completely housed inside the casing.

Abstract: An image pickup apparatus for endoscope includes an optical member that is a hybrid lens element in which a plurality of optical elements are bonded to each other, at least any one of the plurality of optical elements including a resin lens disposed on a principal surface of a parallel flat glass plate, and an image pickup member that receives an object image brought into focus by the optical member. A surface of the resin lens and the principal surface around the resin lens are covered with a transparent inorganic film such that a boundary between the surface of the resin lens and the principal surface around the resin lens is also covered with the inorganic film.

Abstract: An endoscope includes: an imaging unit disposed at a distal end portion of an insertion section inserted into a body of a subject; and a built-in component provided parallel with the imaging unit at the distal end portion, and extending substantially parallel with an axial direction of the insertion section. The imaging unit includes: a solid state image sensor including a light receiving unit; a flexible circuit board electrically connecting the solid state image sensor; and a rigid circuit board at least partially disposed on a proximal end side of the endoscope relative to the solid state image sensor, and electrically connected to the flexible circuit board.

Abstract: An image pickup apparatus includes: an image pickup device including: a light receiving section configured to receive light entering from a light receiving surface; and a plurality of convex electrodes disposed on an opposing surface; an optical system configured to condense the light on the light receiving section; and a wiring board including a plurality of bonded terminals on a main surface, the plurality of bonded terminals respectively bonded to the plurality of convex electrodes, wherein the plurality of convex electrodes are not arranged in a light receiving section facing region that faces a region provided with the light receiving section.

Abstract: An image capturing module is used in an endoscope. The image capturing module comprises an image capturing portion having opposed surfaces defined by respective photodetection and reverse surfaces. The reverse surface includes external electrodes disposed thereon. A layered optical portion having a front surface to which light is applied and a rear surface that is opposite of the front surface. The layered optical portion having a plurality of optical members layered together. A layered device having a first principal surface with joint electrodes disposed thereon. A second principal surface opposes the first principal surface. The first principal surface is bonded to the reverse surface. The joint electrodes are joined to the external electrodes. The layered device includes a plurality of semiconductor devices layered together in which the first principal surface is larger in area than the photodetection surface and smaller in area than the rear surface.

Abstract: An imaging device includes a lens group configured to collect incident light, a prism configured to reflect the light collected by the lens group, and an image sensor having a light receiving unit configured to receive the light reflected by the prism and to perform photoelectric conversion on the received light to generate an electrical signal. The prism is mounted on the light receiving unit, and the lens group is directly mounted on a surface of the image sensor.

Abstract: An image pickup unit includes a first element with a first flat glass, a second element with a second flat glass, a first spacer configured to define a distance between the first element and the second element, an image pickup device, and a second spacer configured to define a distance between the second element and the image pickup device, wherein no resin lens is disposed on a light incidence surface of the first flat glass, a resin lens with a negative power is disposed on a surface opposing the light incidence surface, a resin lens with a positive power is disposed on a second flat glass, the image pickup unit has side surfaces covered with a sealing member composed of an inorganic material, a brightness aperture is disposed between the first element and the second element, and an path space is a sealed space.

Abstract: An imaging device includes: a first chip including a light receiving unit, and a read circuit; a second chip including a timing control circuit, an A/D conversion circuit, and a cable transmission circuit; and a connection unit configured to connect the first and the second chips. The read circuit includes a column read circuit and a horizontal selection circuit, and a vertical selection circuit. The connection unit of the first chip is provided in a first area along a side of the rectangular light receiving unit, and in a second area adjacent to the column read circuit, the horizontal selection circuit, and the vertical selection circuit. The connection unit of the second chip is provided in a third area around the timing control circuit, the A/D conversion circuit, and the cable transmission circuit and in a fourth area adjacent to the timing control circuit and the A/D conversion circuit.

Abstract: An image pickup apparatus includes: an image pickup device including a plurality of convex electrodes disposed on an opposing surface; and a wiring board including a plurality of first edge electrodes on a first main surface and a plurality of second edge electrodes on a second main surface, wherein the wiring board is disposed in an upright state on the opposing surface, the plurality of convex electrodes include first convex electrodes and second convex electrodes, the first convex electrodes are bonded to the first edge electrodes, the second convex electrodes are bonded to the second edge electrodes, and the wiring board is held between the first convex electrodes and the second convex electrodes.

Abstract: An imaging module includes: a first chip having a light-receiving unit; a flexible printed board connected to an electrode pad of the first chip via an inner lead extended from one end of the flexible printed board; a second chip having a transmission buffer on the flexible printed board; an image signal cable configured to output an image signal; and a drive signal cable configured to input a drive signal. The first and second chips constitute a CMOS imager. The image signal output from the first chip is amplified by the second chip. The flexible printed board includes two or more regions divided by bending the flexible printed board at a bending part arranged parallel to an optical axis direction of the imaging module. The second chip and the drive signal cable are connected to different regions of the flexible printed board.

Abstract: An image pickup apparatus includes: an image pickup chip including a light receiving section and electrode pads, on a first main face, and a plurality of connection electrodes, each of which is connected to each of the electrode pads via each of a plurality of through-hole interconnections, on a second main face; a transparent cover glass having a larger plan-view dimension than the image pickup chip; a transparent adhesive layer that bonds the first main face of the image pickup chip and the cover glass; and a sealing member that covers a side face of the image pickup chip and a side face of the adhesive layer, and is made of an insulating material having a same plan-view dimension as the cover glass.

Abstract: An image pickup unit includes a first element with a first flat glass, a second element with a second flat glass, a first spacer configured to define a distance between the first element and the second element, an image pickup device, and a second spacer configured to define a distance between the second element and the image pickup device, wherein no resin lens is disposed on a light incidence surface of the first flat glass, a resin lens with a negative power is disposed on a surface opposing the light incidence surface, a resin lens with a positive power is disposed on a second flat glass, the image pickup unit has side surfaces covered with a sealing member composed of an inorganic material, a brightness aperture is disposed between the first element and the second element, and an path space is a sealed space.

Abstract: A manufacturing method for an image pickup unit, the method including: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units; and a step of respectively bonding solid-state image pickup devices to emission surfaces of lights of the bending optical elements of the optical units.

Abstract: An image sensor includes: a pixel chip provided with a plurality of pixels, a plurality of first transfer lines, and a plurality of capacitors; a circuit chip provided with a plurality of column reading circuits, a plurality of column scanning circuits, a second transfer line, and a constant current source; and a connection portion stacked and provided between the pixel chip and the circuit chip and configured to connect a capacitor, which is arranged in the pixel chip and has a trench structure, and a first transistor arranged in the circuit chip to each other via an electrode. The capacitor is configured to form a transfer capacity removing a noise included in an imaging signal and connect the pixel chip and the circuit chip to each other via the electrode and the connection portion.

Abstract: An endoscope includes an insertion portion that includes a distal end portion and a bending portion configured to change a direction of the distal end portion . The distal end portion includes a casing having a round shape in a cross-section, and an image pickup module that includes an optical module section including a plurality of optical members and an image pickup section, the image pickup module having a rectangular shape in a cross-section, and the image pickup section includes an image pickup device and a semiconductor stack in which a plurality of semiconductor devices is stacked, and entirety of the image pickup module is completely housed inside the casing.

Abstract: An imaging device includes: a first chip including a light receiving unit, and a read circuit; a second chip including a timing control circuit, an A/D conversion circuit, and a cable transmission circuit; and a connection unit configured to connect the first and the second chips. The read circuit includes a column read circuit and a horizontal selection circuit, and a vertical selection circuit. The connection unit of the first chip is provided in a first area along a side of the rectangular light receiving unit, and in a second area adjacent to the column read circuit, the horizontal selection circuit, and the vertical selection circuit. The connection unit of the second chip is provided in a third area around the timing control circuit, the A/D conversion circuit, and the cable transmission circuit and in a fourth area adjacent to the timing control circuit and the A/D conversion circuit.

Abstract: An image pickup device including a vacant space portion that allows a connection electrode to be exposed to a second main surface side, the vacant space portion being formed at a position overlapping at least the connection electrode in a state where the image pickup device is viewed in plan view from a thickness direction A, and the connection electrode exposed to the second main surface side is electrically connected with a substrate at a position in the vacant space portion, the position overlapping the image pickup device in the state where the image pickup device is viewed in plan view from the thickness direction.