Abstract: A steam valve has a tubular stop valve configured to move toward an upper/lower end side along a direction of an axis when the stop valve is opened/closed; and a valve main body accommodating the stop valve, wherein a base end portion including an end portion of the stop valve at the upper end side is accommodated in a first accommodation space formed in the valve main body, the base end portion has a plurality of inclination surfaces formed on an outer circumference of the base end portion which are inclined such that a distance from the axis to each of the plurality of inclination surfaces decreases toward the upper end side, and a plurality of contact surfaces are formed in the first accommodation space to come in contact with the plurality of inclination surfaces respectively when the stop valve moves toward the upper end side.

Abstract: A forklift apparatus includes: an error prediction unit configured to predict a first positional error which is a positional error after picking-up between a standard position of a fork and a central position of a pallet on the fork after the pallet is picked up and a first angle error which is an angle error after picking-up with respect to the fork in the pallet; a travel route correction unit configured to correct a travel route from a picking-up position of the pallet to a stacking position of the pallet to offset the first positional error and the first angle error when the pallet is stacked; and a conveyance travel control unit configured to perform travel control such that the pallet is conveyed along the corrected travel route.

Abstract: The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.

Abstract: The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.