Abstract: A dissimilar material joining product according to at least one embodiment of the disclosure includes a base material, a cladding layer formed of a dissimilar material having a different main component element from that of the base material and formed to cover at least a part of the base material, and an additively manufactured layer formed of a dissimilar material having a different main component element from that of the base material and joined to the base material with the cladding layer interposed therebetween.

Abstract: A method of producing an additively manufactured object comprises: a step of cooling a shaped body of an alloy formed by additive manufacturing to 0° C. or lower; and a step of aging the shaped body under a temperature condition of 400° C. or higher and 600° C. or lower after the step of cooling the shaped body. The alloy contains: Fe as a main component; 17.0 mass % or more and 19.0 mass % or less of Ni; 7.0 mass % or more and 12.5 mass % or less of Co; 4.6 mass % or more and 5.2 mass % or less of Mo; 0.13 mass % or more and 1.6 mass % or less of Ti; and 0.05 mass % or more and 0.15 mass % or less of Al.

Abstract: A method of manufacturing a metal member, includes shaping a metal member configured of Ni-based alloy by an additive manufacturing; and carrying a solution treatment to the metal member. In the solution treatment, a heat treatment is carried out at a temperature in a temperature range of (TC?100)° C. to (TC?50)° C. (TC is a solid solution temperature of Ni-based alloy). In this way, a creep characteristic and a low cycle fatigue characteristic have been secured sufficient in the metal member shaped by the additive manufacturing.

Abstract: An oxide film removing method is a method of removing an oxide film formed in a surface of a superalloy part that contains a first metal as a base metal and a second metal different from the first metal. The oxide film removing method includes arranging the superalloy part inside a heating chamber; reducing the oxide of the base metal to the base metal by heating the inside of the heating chamber in a condition that a reduction gas atmosphere or a vacuum atmosphere is maintained; and carrying out acid processing to apply acid solution to the superalloy part after the reduction. The oxide film formed in the surface of the superalloy is removed effectively without using a highly toxic gaseous fluoride.

Abstract: A method for depositing a layer includes repeatedly performing a unit deposition process until the layer on a deposition target reaches a predetermined thickness. The unit deposition process includes (depositing the layer on the deposition target by a cold spray process while the deposition target is heated by a heater and heat treating the deposition target after the depositing.

Abstract: A method for depositing a layer includes repeatedly performing a unit deposition process until the layer on a deposition target reaches a predetermined thickness. The unit deposition process includes (A) placing the deposition target in a chamber, (B) providing a non-oxidizing gas atmosphere or a vacuum atmosphere in the chamber, (C) depositing the layer on the deposition target by a cold spray process in the non-oxidizing gas atmosphere or the vacuum atmosphere, and (D) heat treating the deposition target after the depositing.

Abstract: A film growing method includes: (A) attaching wall members to ends of a film grown surface of a base material; (B) growing a film on the film grown surface by a cold spray method; and (C) removing the wall members after a thickness of the grown film on the film grown surface becomes equal to a desired film thickness. It can be prevented that the side ends of the grown film are formed in a slope when a thick film is to be grown by using the cold spray.

Abstract: A manufacturing method of a TiAl joined body includes: an arranging step and a heating step. The arranging step is a step of arranging a plurality of members which contains a TiAl intermetallic compound and insert materials which contain Ti as a major element, Cu and Ni such that each of the insert materials is inserted between two adjacent members of the plurality of members. The heating step is a step of heating the plurality of members and the insert materials in a non-oxidizing atmosphere at a temperature above melting points of the insert materials and below melting points of the plurality of members.

Abstract: A method for depositing a layer has a step of repeatedly performing a unit deposition process until the layer on a deposition target reaches a predetermined thickness. The unit deposition process includes (A) a step of placing the deposition target in a chamber, (B) a step of providing a non-oxidizing gas atmosphere or a vacuum atmosphere in the chamber, (C) depositing the layer on the deposition target by a cold spray process in the non-oxidizing gas atmosphere or the vacuum atmosphere, and (D) heat treating the deposition target after the depositing.

Abstract: A method for depositing a layer has a step of repeatedly performing a unit deposition process until the layer on a deposition target reaches a predetermined thickness. The unit deposition process includes (A) a step of depositing the layer on the deposition target by a cold spray process while the deposition target is heated by a heater and (B) a step of heat treating the deposition target after said depositing.

Abstract: A film growing method includes: (A) attaching wall members to ends of a film grown surface of a base material; (B) growing a film on the film grown surface by a cold spray method; and (C) removing the wall members after a thickness of the grown film on the film grown surface becomes equal to a desired film thickness. It can be prevented that the side ends of the grown film are formed in a slope when a thick film is to be grown by using the cold spray.

Abstract: A brazing method includes fixing a padding plate on a base material such that the padding plate is arranged in a lower position from a groove formed in a repair region of the base material, and heating the base material such that a base material powder is melt, after a paste that base material 1 contains the base material powder which is formed from a same material as the base material is filled into the groove. The base material powder filled into groove can be prevented from flowing out from the groove even if being fused since the padding plate is arranged for the base material. Thus, a repair region can be repaired more appropriately.

Abstract: A manufacturing method of a TiAl joined body includes: an arranging step and a heating step. The arranging step is a step of arranging a plurality of members which contains a TiAl intermetallic compound and insert materials which contain Ti as a major element, Cu and Ni such that each of the insert materials is inserted between two adjacent members of the plurality of members. The heating step is a step of heating the plurality of members and the insert materials in a non-oxidizing atmosphere at a temperature above melting points of the insert materials and below melting points of the plurality of members.

Abstract: A repairing method includes heating a base material by a heater, and irradiating a laser beam to a repair region of the base material by using a laser oscillator unit, after the base material is heated. In the method, generation of a crack and a break can be suppressed, and the repair region can be repaired more appropriately.

Abstract: A brazing method includes fixing a padding plate on a base material such that the padding plate is arranged in a lower position from a groove formed in a repair region of the base material, and heating the base material such that a base material powder is melt, after a paste that base material 1 contains the base material powder which is formed from a same material as the base material is filled into the groove. The base material powder filled into groove can be prevented from flowing out from the groove even if being fused since the padding plate is arranged for the base material. Thus, a repair region can be repaired more appropriately.

Abstract: An optical-pickup apparatus configured to prevent noise caused by return light by superposing a high-frequency signal, generated from a high-frequency signal generation circuit, on a driving signal to be supplied to a laser diode, the optical-pickup apparatus includes: a high-frequency superimposition integrated circuit including the high-frequency signal generation circuit; first wiring connected between an anode of the laser diode and the high-frequency superimposition integrated circuit; and second wiring connected between a cathode of the laser diode and the high-frequency-superimposition integrated circuit, the laser diode and the high-frequency superimposition integrated circuit mounted on a circuit board, the first wiring and the second wiring arranged, for the most part, in a region where the laser diode is arranged, the second wiring configured to pass through between an anode terminal of the laser diode and an anode terminal of a monitor diode.

Abstract: An optical-pickup apparatus configured to prevent noise caused by return light by superposing a high-frequency signal, generated from a high-frequency signal generation circuit, on a driving signal to be supplied to a laser diode, the optical-pickup apparatus includes: a high-frequency superimposition integrated circuit including the high-frequency signal generation circuit; first wiring connected between an anode of the laser diode and the high-frequency superimposition integrated circuit; and second wiring connected between a cathode of the laser diode and the high-frequency-superimposition integrated circuit, the laser diode and the high-frequency superimposition integrated circuit mounted on a circuit board, the first wiring and the second wiring arranged, for the most part, in a region where the laser diode is arranged, the second wiring configured to pass through between an anode terminal of the laser diode and an anode terminal of a monitor diode.

Abstract: An optical pickup apparatus includes: a circuit board; a laser diode mounted on one face of the circuit board; and a high-frequency superimposition integrated circuit arranged on the other face of the circuit board, the high-frequency superimposition integrated circuit including a high-frequency signal generation circuit, the circuit board having an area greater than or equal to an area occupied by a lead pin of the laser diode and a region smaller than or equal to twice a region where the laser diode is mounted, a high-frequency signal generated from the high-frequency signal generation circuit being superimposed on a driving signal to be supplied to the laser diode, in order to take a measure against noise caused by return light of the laser diode.

Abstract: Provided is an optical pickup device with which a short-circuit can be released from above and below. The optical pickup device (15) is provided with: a housing (15B) formed by ejecting a resin material in a prescribed shape; an actuator (15D) that is positioned on the top surface of the housing (15B) so as to hold an objective lens (17); a circuit board (15A) that is fixed to the main surface of the housing (15B); and a connector (15C) that is attached to the top surface of the circuit board (15A). A second short-circuit part (25) and a first short-circuit part (24) are disposed on the top surface and the bottom surface of the circuit board (15A), and a built-in light-emitting chip is protected from electrostatic discharge damage by shorting either one of the short-circuit parts.

Abstract: An optical pickup apparatus includes: a circuit board; a laser diode mounted on one face of the circuit board; and a high-frequency superimposition integrated circuit arranged on the other face of the circuit board, the high-frequency superimposition integrated circuit including a high-frequency signal generation circuit, the circuit board having an area greater than or equal to an area occupied by a lead pin of the laser diode and a region smaller than or equal to twice a region where the laser diode is mounted, a high-frequency signal generated from the high-frequency signal generation circuit being superimposed on a driving signal to be supplied to the laser diode, in order to take a measure against noise caused by return light of the laser diode.