Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract: There are disclosed a novel naphthalocyanine derivative represented by the general formula [I] or [II] shown below, a process for preparing said derivative, an optical information recording medium using said derivative, and a process for preparing thereof: ##STR1## wherein M is a metal, metal oxide, metal hydroxide and the like, R.sup.1 is an alkyl group of 1-22 carbon atoms, n is an integer of 1 to 4, and Y.sub.1 and Y.sub.2 aryloxy group and the like.

Abstract: A photosensitive element for electrophotography has an electrically conductive substrate and a layer structure thereon comprising a charge generating substance and a charge transport substance. An improved charge transport substance is a derivative of triphenylamine in which at least 80% of the electrons in the highest occupied molecular orbital are located on the triphenylamine skeleton. Examples of such compounds have the following formula: ##STR1## wherein X is a an optionally substituted heterocyclic radical containing at least one ring nitrogen, Q is a single bond or --C.dbd.C--, and Z.sub.1, Z.sub.2 and Z.sub.3 are H, lower alkyl or alkoxy, aryl, NO.sub.2, CF.sub.3, --N(R').sub.2, --S--C.sub.6 H.sub.5 or --S(R').sub.2.

Abstract: Polyimides represented by general formula (I), (wherein Ar.sub.1 and Ar.sub.2 each represents an aromatic ring-containing group, Cf represents a fluorinated alkyl group directly bonded to Ar.sub.1, and m.gtoreq.1), and polyamide acids as their percursors. The polyimides have excellent humidity resistance and heat resistance, thus being useful as coating materials for semiconductor chips and insulating films for multi-layered wiring.

Abstract: An electrically insulated coil manufactured with a composition comprising a poly-functional epoxy resin having at least three of p-(2,3-epoxy propoxy) phenyl groups and a bi-functional epoxy resin as a binding resin for a reinforced insulating base sheet and as an impregnation resin has no peeling off in its insulating layers and is capable to be used continuously under the temperature at 200.degree. C. or above.

Abstract: As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Abstract: A metal naphthalocyanine derivative and process for producing said derivative which is represented by the following formula (I): ##STR1## wherein M represents germanium or tin; L and L' each independently represent a halogen, a hydroxyl group, an alkyl group, an alkoxy group or a siloxy group of the formula R.sub.1 R.sub.2 R.sub.3 SiO-- (wherein R.sub.1, R.sub.2 and R.sub.3 each independently represent a hydrogen atom, an alkyl group, an alkoxy group or an aryl group).

Abstract: Disclosed are an electrophotographic plate comprising a photoconductive layer containing an organic photoconductive substance on an electroconductive support, characterized in that said photoconductive layer has a film containing as the organic photoconductive substance a metal naphthalocyanine derivative represented by the formula (I): ##STR1## wherein M represents germanium or tin; L and L' each independently represent a halogen, a hydroxyl group, an alkyl group, an alkoxy group or a siloxy group of the formula R.sub.1 R.sub.2 R.sub.3 SiO-- (wherein R.sub.1, R.sub.2 and R.sub.3 each independently represent a hydrogen atom, an alkyl group, an alkoxy group or an aryl group),a metal naphthalocyanine derivative defined above and a process for producing the same.

Abstract: A resin material comprising a polyamide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and can be shaped together with an inorganic material into one body to give a composite shaped article.

Abstract: A method for forming a polyimide film on a substrate surface by chemical vapor deposition comprises evaporating an aromatic monomer compound having one amino group and two adjacent carboxyl groups or its derivative group, such as esters of 4-amino phthalic acid, and 4-(p-anilino) phthalic acid, thus a high strength polyimide is obtained represented by the general formula having its imide groups being unidirectionally arranged in its backbone chain: ##STR1## wherein R is nil or divalent aliphatic or aromatic group and n is an integer.

Abstract: A polyimide or polyamic acid synthesized from a diamine, which may be fluorinated, and a dianhydride of the following formula: ##STR1## where R.sub.f =perfluoroalkylene and Y.sub.1 and Y.sub.2 are independently oxy-carbonyl or thiocarbonyl.

Abstract: A resin material comprising a polyimide having as chemical structural unit at least one aromatic ring which can rotate around its molecular axis but has no flexibility at another direction, said polyimide being oriented at least at a uniaxial direction, has a low thermal expansion coefficient and can be shaped together with an inorganic material into one body to give a composite shaped article.

Abstract: The humidity-sensitive element of this invention is composed of an insulating substrate (1), a pair of electrodes (2, 3) mounted thereon, and a humidity-sensitive material (8) covering the electrodes. The humidity-sensitive material (8) has a property to change its electric resistance depending on the moisture content in the atmosphere and is formed from fine particles each having a hydrophobic core and a hydrophilic group-containing surface layer covering the core. This humidity-sensitive element exhibits a nearly linear relationship between logarithum of electric resistance and relative humidity and small hysteresis, permitting a precise measurement of relative humidity. Insulating substrate (1) and electrodes (2,3) are preferred to form from an insulating layer of silicon semiconductor and conductive monosilicon formed on it, respectively. This permits size reduction of humidity-sensitive elements or devices.

Abstract: A liquid crystal device comprising a thermal writing type liquid crystal, an electrode for generating heat necessary for said thermal writing, and a support for supporting said liquid crystal and said electrode, wherein a material having a coefficient of thermal expansion lying between the coefficient of thermal expansion of said electrode and that of said support is arranged between said electrode and said support, whereby said electrode for generating heat can be prevented from being degraded by failure or peeling from the support due to thermal stress.

Abstract: The invention relates to a humidity sensor of electric resistance type whose electric resistance changes in accordance with an ambient humidity, characterized by a protective film of silicone resin provided on the surface of a humidity-sensitive material, and to a method for preparing the same. The protective film of silicone resin is formed by applying a varnish of siloxanes to the humidity-sensitive material and subjecting the varnish to reaction. The varnish can be of one-part curing system or two-part curing system, and desirably the reaction of siloxanes is a cross-linking reaction. The formed protective film is not influenced by swelling or shrinking of the humidity-sensitive material, and is prevented from flowing off due to a temperature rise, or from deposition of dusts, etc.

Abstract: An unsaturated polyester resin composition for use in pressure molding, which comprises an unsaturated polyester resin and fillers consisting essentially of (a) calcium carbonate powder which passes a 325 mesh sieve, (b) an inorganic mineral particulate which passes a 12 mesh sieve and is retained on a 200 mesh sieve and (c) glass fibers having a length larger than 0.2 mm, wherein the ratio by weight of (a) to (b) is within a range of from 0.3 to 10, the ratio of (a)+(b) to the unsaturated polyester resin is within a range of from 1.5 to 7, and the ratio of (c) to the total weight of the resin, calcium carbonate, silica sand and glass fiber is within a range of from 0.01 to 0.25.