Abstract: In order to enable cutting of a soft ceramic green block by a dicing saw having excellent cutting accuracy, heat treatment is performed on the ceramic green block to dissociate a plasticizer, thereby improving hardness of the ceramic green block. Then the ceramic green block is cut by the dicing saw.

Abstract: In order to enable the cutting of a soft ceramic green block by a dicing saw with excellent cutting accuracy and at high speed, heat treatment is performed on the ceramic green block to dissociate a plasticizer, thereby improving the hardness of the ceramic green block. Thereafter the ceramic green block is cut by the dicing saw.

Abstract: A ceramic multilayer substrate (13) having a built-in inductance includes a conductor (15) which is arranged in a substrate consisting of a sintered body (14), and ferromagnetic metal films (6A, 6B) consisting of Ni which are arranged on both sides of the conductor (15).

Abstract: A ceramic multilayer substrate (13) having a built-in inductance includes a conductor (15) which is arranged in a substrate consisting of a sintered body (14), and ferromagnetic metal films (6A, 6B) consisting of Ni which are arranged on both sides of the conductor (15).

Abstract: A method of manufacturing a monolithic ceramic electronic device includes the following steps: forming a first metal film on a PET film; forming a multilayered metal film by forming a second metal film on a part of the first metal film, the second metal film being thicker than the first metal film; forming a monolithic ceramic structure including the multilayered metal film; forming the first metal film, which is partially overlain by the second metal film in the monolithic ceramic structure, into an insulating structure in such a manner that metal components forming the first metal film are diffused into the ceramics; and firing the ceramics. Disclosed also is a monolithic ceramic electronic device manufactured by the method.

Abstract: A method of manufacturing a monolithic ceramic electronic device includes the following steps: forming a first metal film on a PET film; forming a multilayered metal film by forming a second metal film on a part of the first metal film, the second metal film being thicker than the first metal film; forming a monolithic ceramic structure including the multilayered metal film; forming the first metal film, which is partially overlain by the second metal film in the monolithic ceramic structure, into an insulating structure in such a manner that metal components forming the first metal film are diffused into the ceramics; and firing the ceramics. Disclosed also is a monolithic ceramic electronic device manufactured by the method.

Abstract: A method of manufacturing a resistor integrated in a sintered body, by patterning a plurality of metal thin films which are formed by a thin film forming method, thereafter transferring the patterned metal thin films onto a ceramic green sheet (11), stacking another ceramic green sheet and/or a ceramic green sheet stacked with another metal thin film thereon for obtaining a laminate, and firing the resulting laminate, thereby forming a resistor integrated in a sintered body which is structured by by alloying the plurality of metal thin films in a ceramic sintered body.

Abstract: A method of fabricating an electronic component of multilayered type comprising the steps of sequentially forming and laminating a plurality of metal films respectively having different metal compositions for constituting the alloy composition of an inner electrode by the thin film forming process to obtain a laminated metal film, laminating a plurality of ceramic green sheets through laminated metal films such that the laminated metal film is arranged between the ceramic green sheets, sintering a laminated body thus obtained and alloying the laminated metal films to form a plurality of inner electrodes each composed of an alloy.