Abstract: A wafer holder according to an embodiment includes a wafer holder. A wafer support-portion is provided at an end portion of a mount region for a wafer. A first portion is located nearer a central portion of the mount region than the wafer support-portion. A first depth of the first portion with reference to an upper surface of the wafer holder outside the mount region is larger than a second depth of the wafer support-portion and a third depth of a third portion located nearer the central portion of the mount region than the first portion. A second portion is located nearer the central portion of the mount region than the wafer support-portion. A fourth depth of the second portion with reference to the upper surface of the wafer holder outside the mount region is larger than the second and third depths and smaller than the first depth.

Abstract: According to an embodiment, a wafer holder includes a heat receiving portion, a heating portion, and a contact making portion. The heat receiving portion receives heat from a heat source. The heating portion heats a wafer using the heat received by the heat receiving portion. The contact making portion makes contact with an outer edge of the wafer. A heat-transfer suppressing portion is provided at least either for the contact making portion, or in between the heat receiving portion and the contact making portion, or in between the heating portion and the contact making portion.