Patents by Inventor Noriyuki Motimaru

Noriyuki Motimaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor substrate planarization apparatus and planarization method
    Patent number: 8366514
    Abstract: A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: February 5, 2013
    Assignee: Okamoto Machine Tool Works, Ltd.
    Inventors: Satoru Ide, Moriyuki Kashiwa, Kazuo Kobayashi, Noriyuki Motimaru, Eiichi Yamamoto, Tomio Kubo, Hiroaki Kida
  • SEMICONDUCTOR SUBSTRATE PLANARIZATION APPARATUS AND PLANARIZATION METHOD
    Publication number: 20110165823
    Abstract: A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.
    Type: Application
    Filed: March 26, 2010
    Publication date: July 7, 2011
    Applicant: OKAMOTO MACHINE TOOL WORKS, LTD.
    Inventors: Satoru IDE, Moriyuki Kashiwa, Kazuo Kobayashi, Noriyuki Motimaru, Eiichi Yamamoto, Tomio Kubo, Hiroaki Kida