Abstract: A packaging structure is capable of electrically connecting an external lead to a pad of a semiconductor chip by directly bonding the external lead to the pad of the semiconductor chip without an adhesive, which requires no resin sealing. The packaging structure comprises a lead member 20 having an fitting part with a U-shaped cross section, which can be fit into the semiconductor chip 10 from the end part thereof, and the fitting part pinches the semiconductor chip by means of an elastic restoration force or a plastic deformation, thereby allowing a contact point 20a at one end of the lead member 20 to directly bring into contact with the pad part 11 of the semiconductor chip and, at the same time, the fitting part is provided with a construction for insulating the lead member from the semiconductor chip in the internal circumference except for the contact point.