Patents by Inventor Noriyuki Shirasawa

Noriyuki Shirasawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8124881
    Abstract: A printed board comprising a packaging surface on which an electronic component is packaged, an adhesion prohibited portion which is provided at a region of the printed board different from a region where the electronic component is provided, and to which adhesion of the adhesive material is prohibited, and a blocking step portion which is formed at a region between the region where the electronic component is provided and the region where the adhesion prohibited portion is provided, which blocks any adhesive material which has spilled out from between the bottom surface of the electronic component and the packaging surface from reaching the adhesion prohibited portion.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: February 28, 2012
    Assignee: Kyocera Corporation
    Inventor: Noriyuki Shirasawa
  • Publication number: 20090211795
    Abstract: A printed board comprising a packaging surface on which an electronic component is packaged, an adhesion prohibited portion which is provided at a region of the printed board different from a region where the electronic component is provided, and to which adhesion of the adhesive material is prohibited, and a blocking step portion which is formed at a region between the region where the electronic component is provided and the region where the adhesion prohibited portion is provided, which blocks any adhesive material which has spilled out from between the bottom surface of the electronic component and the packaging surface from reaching the adhesion prohibited portion.
    Type: Application
    Filed: February 27, 2009
    Publication date: August 27, 2009
    Applicant: KYOCERA CORPORATION
    Inventor: Noriyuki SHIRASAWA