Abstract: A mounter including at least two mounting stages 109 and 110 where components are mounted onto boards transported from the upstream side in transportation direction of the board 120 and then transport the boards to the downstream side, and the mounter includes a first stopping unit 135 for stopping the board to place a board edge on the downstream side on a first fixed position which is in the downstream side from a first mountable area A, the first mountable area A being a mountable region where the components can be mounted on the first mounting stage 109 on the upstream side, and a second stopping unit 136 for stopping the board to place a board edge on the upstream side on a second fixed position which is the upstream side from a second mountable area A, the second mountable area A being a mountable region where the components can be mounted on the second mounting stage 110.

Abstract: A propylenic polymer according to the present invention or a composition thereof have an excellent melt flowability and contains a less amount of stickiness-causing components, and also has a low modulus and is pliable, and is capable of providing a transparent molded article, thus being useful as a substitute for a pliable vinyl chloride resin. In addition, a molded article made therefrom exhibits an excellent heat seal performance at a low temperature, and is excellent in terms of transparency and rigidity. Specifically, it has an isotactic pentad fraction (mmmm), which indicates a stereoregularity, of 30 to 80%, a molecular weight distribution (Mw/Mn) of 3.5 or less and an intrinsic viscosity [?] of 0.8 to 5 dl/g.

Abstract: A propylenic polymer according to the present invention or a composition thereof have an excellent melt flowability and contains a less amount of stickiness-causing components, and also has a low modulus and is pliable, and is capable of providing a transparent molded article, thus being useful as a substitute for a pliable vinyl chloride resin. In addition, a molded article made therefrom exhibits an excellent heat seal performance at a low temperature, and is excellent in terms of transparency and rigidity. Specifically, it has an isotactic pentad fraction (mmmm), which indicates a stereoregulariry, of 30 to 80%, a molecular weight distribution (Mw/Mn) of 3.5 or less and an intrinsic viscosity [?] of 0.8 to 5 dl/g.

Abstract: A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: The propylene polymer of the present invention satisfies (1) a 25° C. hexane soluble content (H25) of 0-80 wt %; and (2) either no melting temperature (Tm) measurable by differential scanning calorimetry (DSC), or a melting temperature (Tm) satisfying, if measurable by DSC, the following relationship: ?H?3×(Tm?120) wherein ?H is a melting endotherm (J/g). The propylene homopolymer of the present invention satisfies (1) a meso pentad fraction (mmmm) of 30-60 mol %; (2) a racemic pentad fraction (rrrr) satisfying the following relationship: [rrrr/(1?mmmm)]?0.1; (3) a fraction (W25) eluted at a temperatures up to 25° C. by temperature-programmed chromatography, of from 20-100 wt %; and, (4) a pentad fraction (rmrm) of more than 2.5 mol %. The propylene copolymer of the present invention satisfies (1) a stereoregularity index (P) of 55-90 mol % as determined by 13C-NMR measurement; and (2) a fraction (W25) eluted at a temperatures up to 25° C. by temperature-programmed chromatography, of from 20-100 wt %.

Abstract: A mounting-waiting process for making a substrate to be transferred into a mounting process wait before the mounting process; and a substrate discharge-waiting process for making the substrate transferred from the mounting process wait before the following process are provided. When transfer of an unmounted substrate into the mounting process and transfer of a mounted substrate from the mounting process to the substrate discharge-waiting process are performed simultaneously, it is detected, by a substrate-arrival detecting sensor for detecting the mounted substrate transferred to the substrate discharge-waiting process and a substrate-continuity detecting sensor for detecting the unmounted substrate continuously transferred following to the mounted substrate, that a plurality of substrates have been transferred into the discharge-waiting process continuously.

Abstract: A mounter including at least two mounting stages 109 and 110 where components are mounted onto boards transported from the upstream side in transportation direction of the board 120 and then transport the boards to the downstream side, and the mounter includes a first stopping unit 135 for stopping the board to place a board edge on the downstream side on a first fixed position which is in the downstream side from a first mountable area A, the first mountable area A being a mountable region where the components can be mounted on the first mounting stage 109 on the upstream side, and a second stopping unit 136 for stopping the board to place a board edge on the upstream side on a second fixed position which is the upstream side from a second mountable area A, the second mountable area A being a mountable region where the components can be mounted on the second mounting stage 110.

Abstract: A component mounting apparatus is provided with a board holding device for holding a board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: A propylenic polymer according to the present invention or a composition thereof have an excellent melt flowability and contains a less amount of stickiness-causing components, and also has a low modulus and is pliable, and is capable of providing a transparent molded article, thus being useful as a substitute for a pliable vinyl chloride resin. In addition, a molded article made therefrom exhibits an excellent heat seal performance at a low temperature, and is excellent in terms of transparency and rigidity. Specifically, it has an isotactic pentad fraction (mmmm), which indicates a stereoregulariry, of 30 to 80%, a molecular weight distribution (Mw/Mn) of 3.5 or less and an intrinsic viscosity [?] of 0.8 to 5 dl/g.

Abstract: The propylene polymer of the present invention satisfies (1) a 25° C. hexane soluble content (H25) of 0-80 wt %; and (2) either no melting temperature (Tm) measurable by differential scanning calorimetry (DSC), or a melting temperature (Tm) satisfying, if measurable by DSC, the following relationship: ?H?3×(Tm?120) wherein ?H is a melting endotherm (J/g). The propylene homopolymer of the present invention satisfies (1) a meso pentad fraction (mmmm) of 30-60 mol %; (2) a racemic pentad fraction (rrrr) satisfying the following relationship: [rrrr/(1?mmmm)]?0.1; (3) a fraction (W25) eluted at a temperatures up to 25° C. by temperature-programmed chromatography, of from 20-100 wt %; and, (4) a pentad fraction (rmrm) of more than 2.5 mol %. The propylene copolymer of the present invention satisfies (1) a stereoregularity index (P) of 55-90 mol % as determined by 13C-NMR measurement; and (2) a fraction (W25) eluted at a temperatures up to 25° C. by temperature-programmed chromatography, of from 20-100 wt %.

Abstract: A propylenic polymer according to the present invention or a composition thereof have an excellent melt flowability and contains a less amount of stickiness-causing components, and also has a low modulus and is pliable, and is capable of providing a transparent molded article, thus being useful as a substitute for a pliable vinyl chloride resin. In addition, a molded article made therefrom exhibits an excellent heat seal performance at a low temperature, and is excellent in terms of transparency and rigidity. Specifically, it has an isotactic pentad fraction (mmmm), which indicates a stereoregulariry, of 30 to 80%, a molecular weight distribution (Mw/Mn) of 3.5 or less and an intrinsic viscosity [?] of 0.8 to 5 dl/g.

Abstract: While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet (3) corresponding to an adhesion region (R1) of a semiconductor chip (1) are sucked and held, a plurality of protruding portions (30) of a removing member (21) are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change a surface bonding of the semiconductor chip to the adhesive sheet by-adhesion to a point bonding, and further the removing member is moved along the bottom surface of the semiconductor chip so as to change a position of the point bonding and decrease bonding force to the adhesive sheet by the adhesion. Then, the semiconductor chip is removed from the adhesive sheet.

Abstract: A mounting-waiting process for making a substrate to be transferred into a mounting process wait before the mounting process; and a substrate discharge-waiting process for making the substrate transferred from the mounting process wait before the following process are provided. When transfer of an unmounted substrate into the mounting process and transfer of a mounted substrate from the mounting process to the substrate discharge-waiting process are performed simultaneously, it is detected, by a substrate-arrival detecting sensor for detecting the mounted substrate transferred to the substrate discharge-waiting process and a substrate-continuity detecting sensor for detecting the unmounted substrate continuously transferred following to the mounted substrate, that a plurality of substrates have been transferred into the discharge-waiting process continuously.

Abstract: The ?-olefin-aromatic vinyl compound copolymer of the present invention is obtained by using a transition metal compound represented by the following Formula (1) and a promoter component to carry out copolymerization, and it is a novel ?-olefin-aromatic vinyl compound copolymer having a low alternating property and a high blocking property, particularly a high blocking property related to the aromatic vinyl compound: wherein A1 and A2 represent a cyclopentadienyl group, a substituted cyclopentadienyl group or the like; Y1 and Y2 represent a substituted or unsubstituted alkylene group or the like, and at least one of them is the substituted or unsubstituted alkylene group; M1 represents titanium or the like; X1 and X2 represent a hydrogen atom, a halogen atom or the like.

Abstract: A propylenic polymer according to the present invention or a composition thereof have an excellent melt flowability and contains a less amount of stickiness-causing components, and also has a low modulus and is pliable, and is capable of providing a transparent molded article, thus being useful as a substitute for a pliable vinyl chloride resin. In addition, a molded article made therefrom exhibits an excellent heat seal performance at a low temperature, and is excellent in terms of transparency and rigidity. Specifically, it has an isotactic pentad fraction (mmmm), which indicates a stereoregulariry, of 30 to 80%, a molecular weight distribution (Mw/Mn) of 3.5 or less and an intrinsic viscosity [?] of 0.8 to 5 dl/g.

Abstract: A propylenic polymer according to the present invention or a composition thereof have an excellent melt flowability and contains a less amount of stickiness-causing components, and also has a low modulus and is pliable, and is capable of providing a transparent molded article, thus being useful as a substitute for a pliable vinyl chloride resin. In addition, a molded article made therefrom exhibits an excellent heat seal performance at a low temperature, and is excellent in terms of transparency and rigidity. Specifically, it has an isotactic pentad fraction (mmmm), which indicates a stereoregulariry, of 30 to 80%, a molecular weight distribution (Mw/Mn) of 3.5 or less and an intrinsic viscosity [?] of 0.8 to 5 dl/g.

Abstract: Provided is a novel olefin copolymer comprising [A] a cyclic olefin, [B] an aromatic vinyl compound and [C] an aliphatic &agr;-olefin having from 2 to 20 carbon atoms. (1) the component [A] therein accounts for from 0.1 to 30 mol %, the component [B] for from 0.1 to 49.9 mol %, and the total of the components [A] and [B] for from 0.2 to 50 mol %; and (2) the copolymer has a glass transition temperature Tg of lower than 60° C. Having a suitable modulus of elasticity, the copolymer can be a substitute for soft polyvinyl chloride as a soft resin, and it has good elastic recovery and transparency.

Abstract: The &agr;-olefin-aromatic vinyl compound copolymer of the present invention is obtained by using a transition metal compound represented by the following Formula (1) and a promoter component to carry out copolymerization, and it is a novel &agr;-olefin-aromatic vinyl compound copolymer having a low alternating property and a high blocking property, particularly a high blocking property related to the aromatic vinyl compound: 1

Abstract: The invention provides a method for producing &agr;-olefin-aromatic vinyl compound copolymers of high quality at high productivity. The method for producing an &agr;-olefin-aromatic vinyl compound copolymer including copolymerizing an &agr;-olefin and an aromatic vinyl compound in the presence of a copolymerization catalyst formed of a transition metal compound component (A) and a co-catalyst component (B) wherein the component (A) employs a transition metal compound having two cross-linking groups wherein at least one of the cross-linking groups is a cross-linking group exclusively formed of a carbon-carbon bond.