Abstract: Examples of a computer system packaged in a three-dimensional stack of dies are described. The package includes an electrical die and an optical die coupled to and stacked with the electrical die. The electrical die includes circuitry to process and communicate electrical signals, and the optical die includes structures to transport optical signals. The electrical die has a smaller area than the optical die so that the optical die includes an exposed mezzanine which is configured with optical input/output ports. Additionally, the packaging can be configured to provide structural support against insertion forces for external optical connections.

Abstract: A synchronous optical bus system for communication between computer system components is described. In one example, the optical bus system is used for communication between a memory controller and memory devices optically coupled to an optical interconnect. Optical bus interface units couple the components to the optical interconnect and are arranged on the optical interconnect in order that a sum of an optical path length from a controller component to each computer system component and from each computer system component to the controller component is the same for all the coupled computer system components. A synchronous protocol is used for communication between the components.

Abstract: A computer system with concurrent direct memory access is provided including a computer node having a processor interface bus and a cut-through network interface controller installed on the processor interface bus. A data transfer is initiated through the cut-through network interface controller by starting a direct memory access to move data from a memory to a transmit buffer in the cut-through network interface controller and a network interface controller physical interface transmitting the data, to the computer node attached to a reliable network, before all of the data is in the transmit buffer.

Abstract: Examples of a computer system packaged in a three-dimensional stack of dies are described. The package includes an electrical die and an optical die coupled to and stacked with the electrical die. The electrical die includes circuitry to process and communicate electrical signals, and the optical die includes structures to transport optical signals. The electrical die has a smaller area than the optical die so that the optical die includes an exposed mezzanine which is configured with optical input/output ports. Additionally, the packaging can be configured to provide structural support against insertion forces for external optical connections.

Abstract: A synchronous optical bus system for communication between computer system components is described. In one example, the optical bus system is used for communication between a memory controller and memory devices optically coupled to an optical interconnect. Optical bus interface units couple the components to the optical interconnect and are arranged on the optical interconnect in order that a sum of an optical path length from a controller component to each computer system component and from each computer system component to the controller component is the same for all the coupled computer system components. A synchronous protocol is used for communication between the components.

Abstract: A system for displaying a wide field of view video image of a location. A series of location cameras disposed at the location captures the wide filed of view video image as a series of individual video images covering the desired field of view. A distance sensor unit senses distances of closest objects in one or more overlap areas between field of views of the location cameras from the two or more location cameras covering each respective overlap area. A display unit displays the series of individual video images to a user for creating a visual experience of the location. A processor unit determines a horizontal span of each individual video image displayed by the display unit based on the sensed distances of the closest objects.

Abstract: A system for displaying a wide field of view video image of a location. A series of location cameras disposed at the location captures the wide filed of view video image as a series of individual video images covering the desired field of view. A distance sensor unit senses distances of closest objects in one or more overlap areas between field of views of the location cameras from the two or more location cameras covering each respective overlap area. A display unit displays the series of individual video images to a user for creating a visual experience of the location. A processor unit determines a horizontal span of each individual video image displayed by the display unit based on the sensed distances of the closest objects.