Abstract: A computer implemented method and system for providing a credit evaluation report, the method comprising: searching a reference file of entities; identifying an entity of interest; determining user specified rules or criteria; selecting at least one relevant trade experience from a database of trade experiences for the entity of interest based upon the user specified rules or criteria, records for comparison to the relevant trade experience, and/or peer groups; and generating the credit evaluation report of the entity of interest based upon the relevant trade experience.

Abstract: A computer implemented method and system for providing a credit evaluation report, the method comprising: searching a reference file of entities; identifying an entity of interest; determining user specified rules or criteria; selecting at least one relevant trade experience from a database of trade experiences for the entity of interest based upon the user specified rules or criteria, records for comparison to the relevant trade experience, and/or peer groups; and generating the credit evaluation report of the entity of interest based upon the relevant trade experience.

Abstract: A system and method for providing access to detailed payment experience includes a data acquisition component, a data calculation component, a data synthesis component, and at least one storage device. The data acquisition component captures detailed trade data from various sources. The data storage component calculates a plurality summarized variables and a manner of payment and a high credit amount based on the detailed trade data. The data synthesis component calculates a plurality of scores using the trade variables. The detailed trade data, summarized variables, and scores are stored for various time periods, such as 3-month, 6-month, 9-month, 12-month, 16-month and 24-month periods.

Abstract: Apparatus (11) for handling articles (12), such as semiconductor devices, temporarily mounted to an adhesively coated surface of a diaphragm (29) of a mounting frame (21) includes an index table (31) for positioning a selected one of the articles (12) at a pickup axis (34). The article (12) is removed from adhesive contact with the diaphragm (29) by first engaging the underside of the diaphragm with spaced support pins (72) and urging the engaged portions of the diaphragm and the selected article upward while pulling adjacent regions of the diaphragm out of contact with the article by means of an applied vacuum. Then a vacuum tip (112) moves downward toward the selected article as supported in its original orientation in a position raised above a plane of an array of the articles.

Abstract: A bonder for attaching in succession small articles such as electronic devices to substrates has eight stations located along the path of a rotary member. The rotary member supports eight holders for substrates which are moved in sequence from station to station. At a first station a substrate is loaded onto one of the holders. The holder is then moved to an alignment station and transferred from the support member to a planar manipulator. An optical alignment control system recognizes a position of the substrate on the holder and controls the manipulation of the holder to align a substrate to a predetermined reference axis. The holder is then transferred back to the support member to fix the position of the substrate with respect to the support member. At the next station an article is also aligned to a corresponding reference axis and then tack-bonded or preliminarily attached to a bond site on the substrate.