Patents by Inventor Norman E. DeVolder

Norman E. DeVolder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5032692
    Abstract: This invention relates to a hermetically sealed electronic component package and method for making the package. In one embodiment of the invention, the electronic component is mechanically and electrically attached to the package by heating rings of brazing material. In another embodiment of the invention, an insulative, inorganic preform is heated to mechanically attach the electronic circuit within the package housing. The package is then hermetically sealed by mounting a preform within an electronic component package and heating the combination to a second predetermined high temperature to cause the preform to flow.
    Type: Grant
    Filed: May 9, 1989
    Date of Patent: July 16, 1991
    Assignee: AVX Corporation
    Inventor: Norman E. DeVolder