Abstract: An integrated circuit package is fabricated by assembling a stack which is comprised of a plurality of thin flat epoxy-glass layers, adhesive layers between the epoxy-glass layers, and a staircase-shaped cavity. This cavity extends from an outer epoxy-glass layer to an internal epoxy-glass layer and goes parallel along a portion of the flat surface of the internal epoxy-glass layer and then penetrates through it. Conductors lie on the internal epoxy-glass layer, including bonding pads on the flat surface portions. After the stack is assembled, a plug is inserted into its cavity. This plug is thermoplastic; and it fits snugly into the cavity and extends over a larger area outside the cavity. While the plug is in the cavity, the stack is laminated at a temperature and pressure which causes the plug to soften and conform to the exact shape of the cavity. This dams the adhesive from flowing onto the bonding pads.

Abstract: An integrated circuit package comprises a plurality of thin flat epoxy-glass layers which are arranged in a stack and are laminated together by prepreg layers that lie between the epoxy-glass layers. This stack has a cavity which is staircase-shaped and extends from an outer epoxy-glass layer to an internal epoxy-glass layer, goes parallel along the internal epoxy-glass layer and then penetrates through it. Patterned electrical conductors lie on the flat surface of the internal epoxy-glass layer, including wire bonding pads on its exposed flat surface portion.

Abstract: An assembly of intercoupled integrated circuit die comprises: a substrate having a plurality of holes which extend through the substrate; each hole is of a size that is suitable to receive an integrated circuit die; a plurality of independent subassemblies are also provided; each subassembly includes an integrated circuit die and a heat sink which is attached to the back of the die and extends beyond it; each subassembly is aligned with a respective hole in the substrate such that the die lies in the hole and the heat sink extends beyond the hole and attaches to the substrate; subassemblies are interconnected by printed conductors on the substrate and discrete wires that are bonded from the front of the die to the conductors; and the die and heat sink have similar thermal expansion coefficients, while the substrate has a substantially different thermal expansion coefficient.