Patents by Inventor Norman Frederick, JR.

Norman Frederick, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140312466
    Abstract: The amount of signal propagation and moisture penetration and corresponding reliability problems due to moisture penetration degradation in an IC can be reduced by fabricating a wide seal ring with a channel having offset ingress and egress portions.
    Type: Application
    Filed: July 3, 2014
    Publication date: October 23, 2014
    Inventors: Norman Frederick, JR., Thomas Andrew Myers
  • Patent number: 8803290
    Abstract: The amount of signal propagation and moisture penetration and corresponding reliability problems due to moisture penetration degradation in an IC can be reduced by fabricating two seal rings with non-adjacent gaps. In one embodiment, the same effect can be achieved by fabricating a wide seal ring with a channel having offset ingress and egress portions. Either of these embodiments can also have grounded seal ring segments which further reduce signal propagation.
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: August 12, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: Norman Frederick, Jr., Tom Myers
  • Publication number: 20100291888
    Abstract: A multi-mode multi-band power amplifier (PA) module is described. In an exemplary design, the PA module includes multiple power amplifiers, multiple matching circuits, and a set of switches. Each power amplifier provides power amplification for its input signal when selected. Each matching circuit provides impedance matching and filtering for its power amplifier and provides a respective output signal. The switches configure the power amplifiers to support multiple modes, with each mode being for a particular radio technology. Each power amplifier supports at least two modes. The PA module may further include a driver amplifier and an additional matching circuit. The driver amplifier amplifies an input signal and provides an amplified signal to the power amplifiers. The additional matching circuit combines the outputs of other matching circuits and provides an output signal with higher output power. The driver amplifier and the power amplifiers can support multiple output power levels.
    Type: Application
    Filed: October 7, 2009
    Publication date: November 18, 2010
    Applicant: QUALCOMM INCORPORATED
    Inventors: Aristotele Hadjichristos, Puay Hoe See, Babak Nejati, Guy Klemens, Norman Frederick, JR., Gurkanwal Singh Sahota, Marco Cassia, Nathan Pletcher, Yu Zhao, Thomas Myers
  • Publication number: 20100084751
    Abstract: The amount of signal propagation and moisture penetration and corresponding reliability problems due to moisture penetration degradation in an IC can be reduced by fabricating two seal rings with non-adjacent gaps. In one embodiment, the same effect can be achieved by fabricating a wide seal ring with a channel having offset ingress and egress portions. Either of these embodiments can also have grounded seal ring segments which further reduce signal propagation.
    Type: Application
    Filed: October 3, 2008
    Publication date: April 8, 2010
    Applicant: QUALCOMM Incorporated
    Inventors: Norman Frederick, JR., Tom Myers