Abstract: A spindle system is comprised or a journal and thrust air bearing. The journal bearing; has two sets of opposing groove areas. The thrust air bearing has two sets of spiral grooves. The thrust air bearing is gimballed to compensate for misaligment. A bias contact member is connected to the rotating member along the axis of rotation and provides electrical grounding, The spindle system is especially applicable to mounting recording disks in a data storage disk drive.

Abstract: A spindle system is comprised of a journal and thrust air bearing. The journal bearing has two sets of opposing groove areas. The thrust air bearing has two sets of spiral grooves. The thrust air bearing is gimballed to compensate for misalignment. A bias contact member is connected to the rotating member along the axis of rotation and provides electrical grounding. The spindle system is especially applicable to mounting recording disks in a data storage disk drive.

Abstract: In the process of braze attachment of electronic package members, such as attaching metallic coated connector pins to a multilayer ceramic substrate, contact areas of the substrate are formed by sequential coatings of molybdenum and nickel, which are heated to diffuse the nickel. A pure gold paste is applied by screen printing, for example, followed by the step of firing to burn out the paste binder and to sinter the pure gold particles onto a dense low porosity structure. The sintering operation converts the Ni film into a continuous Au-Ni solid solution. During pin braze, Ni-Sn intermetallics are dispersed in a gold rich matrix of the Au-Ni solid solution.

Abstract: A thin film magnetic read/write head/arm assembly and method of manufacturing the same is disclosed herein. Contact soldering of the opposite to disk side of the read/write head to a cable in laminate relationship to the suspension arm, or a polyimide strip with conductors deposited thereon provides both electrical interconnection and mechanical support. Semiconductor devices can also be intermediately soldered between the head and cable for maximum noise suppression.

Abstract: In a data disk file a slider is mechanically attached to the suspension by means of reflowed solder balls. A pattern of solder contact pads is formed on the back side of the slider and a similar pattern of solder-wettable regions is formed on the suspension. Solder balls are formed on either the solder contact pads or the solder-wettable regions, the slider is located on the suspension so that the solder balls are in registration between the solder contact pads and solder-wettable regions, and the solder is heated to reflow, thereby forming solder joints as a mechanical connection between the slider and suspension. When a thin film transducer is formed on the slider trailing edge and the suspension is a laminated type with patterned conductors, solder balls are also formed on the transducer lead terminations on the trailing edge and on a row of solder-wettable regions on the suspension near the location where the trailing edge of the slider is to be located.

Abstract: Brazing of elements to electronic chip carrying substrates requires brazing materials strong at high temperatures used to remove and replace chips. Flanges and pins are brazed with Au:Sn brazing alloys modified during brazing by addition of copper to the brazing material to promote formation of the higher melting point .beta. phase of the alloy and a Group VIII metal to draw Sn out of the melt by gettering, also to promote formation of the .beta. phase of the alloy and to thicken the braze material. A copper preform is plated with Ni and juxtaposed with surfaces to be brazed and the brazing material to add Ni and copper to the melt.

Abstract: Apparatus and method for bonding surfaces together. A laser beam is applied to the opening in a bonding tip. The bonding tip includes a central cavity forming a black body tapered from the opening to a second tip end. The heated tip end is applied to the fuseable surfaces in either a thermocompression or thermosonic bonding operation.

Abstract: Brazing of elements to electronic chip carrying substrates requires brazing materials strong at high temperatures used to remove and replace chips. Flanges and pins are brazed with Au:Sn brazing alloys modified during brazing by addition of Group IB metal to the brazing material to promote formation of the higher melting point .beta. phase of the alloy and a Group VIII metal to draw Sn out of the melt by gettering, also to promote formation of the .beta. phase of the alloy and to thicken the braze material. An Au preform is plated with Ni and juxtaposed with surfaces to be brazed and the brazing materials to add Ni and Au to the melt almost simultaneously.