Abstract: A method of producing a flexible circuit according to an embodiment herein include supplying a substrate layer film and supplying a cover layer film. A conductive ink is printed on at least a portion of the substrate layer film using an ink jet printing technique. The cover layer film is then laminated over the substrate layer film to provide the flexible circuit. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: A flat flexible cable having conductive pathways laminated between a top and a bottom insulating layer and including an integrated stiffening element. The integrated stiffening element is laminated in between one of the top and bottom insulating layers and the conductive pathways. Integrating the stiffening element into the flat flexible cable in this manner allows the stiffening element to resist peeling or other removal from the remainder of the flat flexible cable.