Patents by Inventor Norman H. Pond

Norman H. Pond has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6635154
    Abstract: Sequential sputtered film deposition of distinct materials on a workpiece is obtained with discrete targets composed of such distinct materials disposed on separate area portions of a common cathode/heatsink. Sputtering without cross contamination of the deposited films is enabled during an interval of relative motion between the target and workpiece or in an indexed static relative disposition, wherein the workpiece projection is entirely proximate one such portion to deposit the respective layer.
    Type: Grant
    Filed: November 3, 2001
    Date of Patent: October 21, 2003
    Assignee: Intevac, Inc.
    Inventors: Paul Markoff Johnson, Norman H. Pond, Robert Ruck, Nathan Fo
  • Publication number: 20030085114
    Abstract: Sequential sputtered film deposition of distinct materials on a workpiece is obtained with discrete targets composed of such distinct materials disposed on separate area portions of a common cathode/heatsink. Sputtering without cross contamination of the deposited films is enabled during an interval of relative motionbetween the target and workpiece or in an indexed static relative disposition, wherein the workpiece projection is entirely proximate one such portion to deposit the respective layer.
    Type: Application
    Filed: November 3, 2001
    Publication date: May 8, 2003
    Inventors: Paul Markoff Johnson, Norman H. Pond, Robert Ruck, Nathan Fo
  • Patent number: 5873989
    Abstract: A magnetron sputtering source for depositing a material onto a substrate includes a target from which the material is sputtered, a magnet assembly disposed in proximity to the target for confining a plasma at the surface of the target and a drive assembly for scanning the magnet assembly relative to the target. The sputtering source may further include an anode for maintaining substantially constant plasma characteristics as the magnet assembly is scanned relative to the target. The anode may be implemented as variable voltage stationary electrodes positioned at or near the opposite ends of the scan path followed by the magnet assembly, spaced-apart anode wires positioned between the target and the substrate or a movable anode that is scanned with the magnet assembly. The magnet elements of the magnet assembly may have different spacings from the surface of the target to enhance depositional thickness uniformity.
    Type: Grant
    Filed: February 6, 1997
    Date of Patent: February 23, 1999
    Assignee: Intevac, Inc.
    Inventors: John L. Hughes, Gary A. Davis, Robert J. Kolenkow, Carl T. Petersen, Norman H. Pond, Robert E. Weiss
  • Patent number: 3938056
    Abstract: Method and apparatus are described for reducing amplifier distortion by establishing a first signal at a first frequency to be amplified in an amplifier which while amplifying the first signal produces a second undesired signal at another frequency, producing on a cycle by cycle basis of the first signal a third signal at the other frequency, adjusting by no more than substantially 180.degree. the relative phase and amplitude of the first and third signals for mutual cancellation of the second and third signals and then amplifying the first signal in the amplifier and reducing the power of signals at the other frequency relative to the power of the amplifier signal at the first frequency. Examples are given where the second signal is a harmonic or an intermodulation frequency signal of the first signal.
    Type: Grant
    Filed: January 18, 1971
    Date of Patent: February 10, 1976
    Assignee: Teledyne, Inc.
    Inventor: Norman H. Pond