Abstract: A low alpha-particle-emitting ceramic composite cover which when used in a ceramic integrated circuit package to encapsulate an integrated circuit device, reduces soft errors caused by alpha-particles emitted from the ceramic material. An alpha-particle-absorbing barrier layer is attached to the major portion of the interior surface of the ceramic cover to absorb alpha-particles emitted by the ceramic material. The barrier layer may be an organic polymeric material or an inorganic high purity material. Preferably the barrier layer is a polyimide film which is attached to the ceramic cover by a glass sealant material. Various constructions of the composite cover and ceramic integrated circuit packages utilizing the composite cover are disclosed.

Abstract: A composite material having solid ingredients of finely divided ceramic powders and about 5 to 25% by weight (10 to 42 by volume) of finely divided powdered polymer such as an epoxy resin. Shaped articles can be formed using standard ceramic formulation practices while providing the advantage of very low temperature firing to fuse the articles into high strength solids.