Patents by Inventor Norman Hamilton

Norman Hamilton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11970680
    Abstract: The invention generally relates to a microfluidic platforms or “chips” for testing and understanding cancer, and, more specifically, for understanding the factors that contribute to cancer invading tissues and causing metastases. Tumor cells are grown on microfluidic devices with other non-cancerous tissues under conditions that simulate tumor invasion. The interaction with immune cells can be tested to inhibit this activity by linking a cancer chip to a lymph chip.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: April 30, 2024
    Assignee: EMULATE, Inc.
    Inventors: Geraldine A. Hamilton, Norman Wen, Catherine Karalis, Antonio Varone, Daniel Levner, Riccardo Barrile
  • Patent number: 11952592
    Abstract: Organs-on-chips are microfluidic devices for culturing living cells in micrometer sized chambers in order to model physiological functions of tissues and organs. Engineered patterning and continuous fluid flow in these devices has allowed culturing of intestinal cells bearing physiologically relevant features and sustained exposure to bacteria while maintaining cellular viability, thereby allowing study of inflammatory bowl diseases. However, existing intestinal cells do not possess all physiologically relevant subtypes, do not possess the repertoire of genetic variations, or allow for study of other important cellular actors such as immune cells. Use of iPSC-derived epithelium, including IBD patient-specific cells, allows for superior disease modeling by capturing the multi-faceted nature of the disease.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: April 9, 2024
    Assignee: EMULATE, INC.
    Inventors: S. Jordan Kerns, Norman Wen, Carol Lucchesi, Christopher David Hinojosa, Jacob Fraser, Jefferson Puerta, Geraldine Hamilton, Robert Barrett, Clive Svendsen, Daniel Levner, Stephen R Targan, Michael Workman, Dhruv Sareen, Uthra Rajamani, Magdalena Kasendra
  • Publication number: 20240084235
    Abstract: An organomimetic device includes a microfluidic device that can be used to culture cells in its microfluidic channels. The organomimetic device can be part of dynamic system that can apply mechanical forces to the cells by modulating the microfluidic device and the flow of fluid through the microfluidic channels. The membrane in the organomimetic device can be modulated mechanically via pneumatic means and/or mechanical means. The organomimetic device can be manufactured by the fabrication of individual components separately, for example, as individual layers that can be subsequently laminated together.
    Type: Application
    Filed: September 19, 2023
    Publication date: March 14, 2024
    Inventors: Jose Fernandez-Alcon, Norman Wen, Richard Novak, Donald E. Ingber, Geraldine A. Hamilton, Christopher Hinojosa, Karel Domansky, Daniel Levner, Guy Thompson, II, Kambez Hajipouran Benam, Remi Villenave, Thomas Umundum, Alfred Paris, Georg Bauer
  • Patent number: 7665401
    Abstract: A shock tube initiator (STI) for allowing the remote and/or manual initiation of at least one shock tube, typically two shock tubes is disclosed.
    Type: Grant
    Filed: December 1, 2003
    Date of Patent: February 23, 2010
    Assignee: Mas Zengrange (NZ) Ltd
    Inventors: Roger Ballantine, Anthony Paul Hornbrook, Ian Moore, Dave Norman Hamilton
  • Publication number: 20080276818
    Abstract: A shock tube initiator (STI) for allowing the remote and/or manual initiation of at least one shock tube, typically two shock tubes is disclosed.
    Type: Application
    Filed: December 1, 2003
    Publication date: November 13, 2008
    Applicant: MAS ZENGRANGE (NZ) LTD
    Inventors: Roger Ballantine, Anthony Paul Hornbrook, Ian Moore, Dave Norman Hamilton
  • Patent number: 6451181
    Abstract: A method for forming an improved copper inlaid interconnect (FIG. 11) begins by performing an RF preclean operation (408) on the inlaid structure in a chamber (10). The RF preclean rounds corners (210a and 206a) of the structure to reduce voiding and improve step coverage while not significantly removing copper atoms from the underlying exposed copper interconnects surfaces (202a). A tantalum barrier (220) is then deposited where one portion of the tantalum barrier is more tensile than another portion of the tantalum barrier. After formation of the barrier layer (220), a copper seed layer (222) is formed over a top of the barrier layer. The copper layer is formed while clamping the wafer with an improved clamp (85) which reduces copper peeling and contamination at wafer edges. Copper electroplating and chemical mechanical polishing (CMP) processes are then used to complete the copper interconnect structure.
    Type: Grant
    Filed: March 2, 1999
    Date of Patent: September 17, 2002
    Assignee: Motorola, Inc.
    Inventors: Dean J. Denning, Sam S. Garcia, Bradley P. Smith, Daniel J. Loop, Gregory Norman Hamilton, Md. Rabiul Islam, Brian G. Anthony
  • Publication number: 20020092763
    Abstract: A method for forming an improved copper inlaid interconnect (FIG. 11) begins by performing an RF preclean operation (408) on the inlaid structure in a chamber (10). The RF preclean rounds corners (210a and 206a) of the structure to reduce voiding and improve step coverage while not significantly removing copper atoms from the underlying exposed copper interconnects surfaces (202a). A tantalum barrier (220) is then deposited where one portion of the tantalum barrier is more tensile than another portion of the tantalum barrier. After formation of the barrier layer (220), a copper seed layer (222) is formed over a top of the barrier layer. The copper layer is formed while clamping the wafer with an improved clamp (85) which reduces copper peeling and contamination at wafer edges. Copper electroplating and chemical mechanical polishing (CMP) processes are then used to complete the copper interconnect structure.
    Type: Application
    Filed: February 22, 2002
    Publication date: July 18, 2002
    Inventors: Dean J. Denning, Sam S. Garcia, Bradley P. Smith, Daniel J. Loop, Gregory Norman Hamilton, Md. Rabiul Islam, Brian G. Anthony
  • Patent number: 4942614
    Abstract: An ultrasonic test set is calibrated in terms of its frequency characterization by establishing a response trace on a monitor screen of the test set when the probe of the test set is applied to a standard test article, a digitizing camera is arranged for scanning the trace on the test set monitor, and a digital computer receives the digital output signal on the digitizing camera and processes the signal by sampling the signal trace at discrete points with respect to time; the digital computer provides an output on output means such as a monitor screen and/or printer which provides information on the frequency characterization of the ultrasonic test device and includes a frequency spectrum. The apparatus can be implemented by a combination of commercially available and known separate elements providing a cheap and effective apparatus and method for calibration purposes.
    Type: Grant
    Filed: April 7, 1987
    Date of Patent: July 17, 1990
    Assignee: Australian Atomic Energy Commission
    Inventor: Norman Hamilton
  • Patent number: 4116579
    Abstract: An end mill tool holder body and a tool suitable for use in a boring mill or any other metal-cutting machine. The tool has a round body with shank to suit the machine tool and a flat, laterally-disposed surface at one end of the body terminating in a shoulder. An axial bore extends through the body and a draw bar in the bore has a pin which extends through an opening in a cutting insert and a nut on the other end of the draw bar clamps the cutting insert against the shoulder, holding it rigidly in position for milling or boring.The inserts are of the throw-away type and are made of precision dimension so that the body and cutting insert can be used in a computerized operation.
    Type: Grant
    Filed: August 25, 1976
    Date of Patent: September 26, 1978
    Inventor: Martin Norman Hamilton