Abstract: The invention is a method for forming package blanks incorporating selectively located microwave absorbing areas for crisping and/or browning one or more surfaces of a packaged product. Successive lengths of an extended web of thin, microwave transparent film are transported past means for depositing a thin layer of microwave energy absorbing material on one side of the film while masking selected areas of the film web by masks placed adjacent the film surface on which the microwave absorbing layer is deposited. No microwave absorbing material is deposited in the selected masked areas. Successive lengths of the resulting film are laminated onto an extended web of flexible dielectric packaging material with the microwave absorbing layer sandwiched between the film and the flexible dielectric packaging material. Thereafter, successive lengths of the resulting laminated web are fed through a die cutting machine that cuts one or more package blanks from the laminated web.