Patents by Inventor Normand Cote
Normand Cote has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8082637Abstract: A releasable touch fastener includes a loop component and a hook component, with a particularly small overall engaged thickness in combination with a high fastening strength, both in peel and shear. The loop component is a woven material, while the hook component may be woven or molded. The molded hook component includes a scrim reinforcement for tear resistance and sewability. The fastener is useful for high cycle applications, such as on non-disposable garments, footwear and luggage.Type: GrantFiled: October 15, 2003Date of Patent: December 27, 2011Assignee: Velcro Industries B.V.Inventors: Nancy J. Tolan, Mark A. Clarner, William B. S. Mc Dougall, Normand A. Cote, Howard A. Kingsford, Paul R. Erickson, Clinton Dowd
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Patent number: 7964542Abstract: Liquid compositions containing a specific hindered phenol or a hindered phenol in combination with an aromatic phosphite are provided which are used as a thermal interface between a heatsink and a chip during a test procedure for electronic components which compositions enhance the thermal conductivity between the heatsink and the chip, are easily removed from the heatsink and the chip after the test procedure without any deleterious residue and which allow the use of high temperatures for extended periods during the test procedure without any significant degradation of the composition. A method for using the compositions in electronic component test procedures such as burn-in procedures is also provided.Type: GrantFiled: January 12, 2006Date of Patent: June 21, 2011Assignee: International Business Machines CorporationInventors: Krishna G. Sachdev, Harbans Singh Sachdev, legal representative, Mark S. Chace, Normand Cote, David L. Gardell, Jeffrey D. Gelorme, Sushumna Iruvanti, G. John Lawson, Tuknekah M. Noble
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Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application
Patent number: 7567090Abstract: A heat sink for use in the burn-in of an I/C chip, which chip has a generally “flat” surface. The heat sink has a “flat” surface with micro-channels therein, positioned to open and close in and out of contact against the flat surface of an I/C chip being burned-in. At least one liquid opening communicates with said essentially flat surface on the heat sink to continuously apply liquid between the heat sink and the chip. A liquid inlet is provided to supply liquid to said at least one liquid opening. A recovery channel is positioned to recover liquid from between the heat sink and the chip, and an exhaust member is provided to carry liquid from said recovery channel to the exterior of the heat sink. The invention also includes a method of burning-in a chip.Type: GrantFiled: October 23, 2006Date of Patent: July 28, 2009Assignee: International Business Machines CorporationInventors: Normand Cote, Peter J. Demko, David L. Gardell, Jeffrey D. Gelorme, Marc D. Knox, George J. Lawson, Kathryn C. Rivera -
Liquid Recovery, Collection Method And Apparatus In A Non-Recirculating Test And Burn-In Application
Publication number: 20080116921Abstract: A heat sink for use in the burn-in of an I/C chip, which chip has a generally “flat” surface. The heat sink has a “flat” surface with micro-channels therein, positioned to open and close in and out of contact against the flat surface of an I/C chip being burned-in. At least one liquid opening communicates with said essentially flat surface on the heat sink to continuously apply liquid between the heat sink and the chip. A liquid inlet is provided to supply liquid to said at least one liquid opening. A recovery channel is positioned to recover liquid from between the heat sink and the chip, and an exhaust member is provided to carry liquid from said recovery channel to the exterior of the heat sink. The invention also includes a method of burning-in a chip.Type: ApplicationFiled: October 23, 2006Publication date: May 22, 2008Inventors: Normand Cote, Peter J. Demko, David L. Gardell, Jeffrey D. Gelorme, Marco D. Knox, George J. Lawson, Kathryn C. Rivera -
Patent number: 7332927Abstract: A method, system and apparatus for testing an integrated circuit chip. The system including: means for forming a liquid polyalphaolefine layer on a bottom surface of the integrated circuit chip, a top surface of the integrated circuit chip having and a bottom surface not having signal and power pads; means for placing a surface of a heat sink into physical contact with the bottom surface of the polyalphaolefine layer; means for electrically coupling the integrated circuit chip to a tester; means for electrically testing the integrated circuit chip; means for electrically de-coupling the integrated circuit chip from the tester; means for removing the heat sink from contact with the polyalphaolefine layer, all or a portion of the polyalphaolefine layer remaining on the bottom surface of the integrated circuit chip; and means for removing the polyalphaolefine layer from the bottom surface of the integrated circuit chip.Type: GrantFiled: May 3, 2007Date of Patent: February 19, 2008Assignee: International Business Machines CorporationInventors: Paul J. Aube, Normand Cote, Roger G. Gamache, Jr., David L. Gardell, Paul M. Gaschke, Marc D. Knox, Denis D. Turcotte
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Publication number: 20070285116Abstract: A method, system and apparatus for testing an integrated circuit chip. The system including: means for forming a liquid polyalphaolefine layer on a bottom surface of the integrated circuit chip, a top surface of the integrated circuit chip having and a bottom surface not having signal and power pads; means for placing a surface of a heat sink into physical contact with the bottom surface of the polyalphaolefine layer; means for electrically coupling the integrated circuit chip to a tester; means for electrically testing the integrated circuit chip; means for electrically de-coupling the integrated circuit chip from the tester; means for removing the heat sink from contact with the polyalphaolefine layer, all or a portion of the polyalphaolefine layer remaining on the bottom surface of the integrated circuit chip; and means for removing the polyalphaolefine layer from the bottom surface of the integrated circuit chip.Type: ApplicationFiled: May 3, 2007Publication date: December 13, 2007Inventors: Paul Aube, Normand Cote, Roger Gamache, David Gardell, Paul Gaschke, Marc Knox, Denis Turcotte
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Patent number: 7259580Abstract: A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after step (b), (c) electrically testing the electronic device; after step (c), (d) removing the heat sink from contact with the heat transfer layer; and after step (d), (e) removing any heat transfer layer remaining on the electronic device from the surface of the electronic device.Type: GrantFiled: February 22, 2005Date of Patent: August 21, 2007Assignee: International Business Machines CorporationInventors: Paul J. Aube, Normand Cote, Roger G. Gamache, Jr., David L. Gardell, Paul M. Gaschke, Marc D. Knox, Denis Turcotte
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Publication number: 20070161521Abstract: Liquid compositions containing a specific hindered phenol or a hindered phenol in combination with an aromatic phosphite are provided which are used as a thermal interface between a heatsink and a chip during a test procedure for electronic components which compositions enhance the thermal conductivity between the heatsink and the chip, are easily removed from the heatsink and the chip after the test procedure without any deleterious residue and which allow the use of high temperatures for extended periods during the test procedure without any significant degradation of the composition. A method for using the compositions in electronic component test procedures such as burn-in procedures is also provided.Type: ApplicationFiled: January 12, 2006Publication date: July 12, 2007Inventors: Krishna Sachdev, Mark Chace, Normand Cote, David Gardell, Jeffrey Gelorme, Sushumna Iruvanti, G. Lawson, Tuknekah Noble, Harbans Sachdev
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Publication number: 20060186909Abstract: A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after step (b), (c) electrically testing the electronic device; after step (c), (d) removing the heat sink from contact with the heat transfer layer; and after step (d), (e) removing any heat transfer layer remaining on the electronic device from the surface of the electronic device.Type: ApplicationFiled: February 22, 2005Publication date: August 24, 2006Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul Aube, Normand Cote, Roger Gamache, David Gardell, Paul Gaschke, Marc Knox, Denis Turcotte
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Publication number: 20050081341Abstract: A woven loop fastener product including a fabric base having ground yarns including interwoven warp yarns and filling yarns extending respectively in warp and filling directions, and pile yarns interwoven with the fabric base and forming engageable loops extending from one side of the fabric base for engagement with hooks. The pile yarns include filaments having a nominal diameter and the pile yarn filaments extend from a near side of the fabric base to a mean loop height less than about 30 times the nominal pile yarn filament diameter.Type: ApplicationFiled: October 15, 2003Publication date: April 21, 2005Inventors: William McDougall, Normand Cote
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Publication number: 20050081345Abstract: A releasable touch fastener includes a loop component and a hook component, with a particularly small overall engaged thickness in combination with a high fastening strength, both in peel and shear. The loop component is a woven material, while the hook component may be woven or molded. The molded hook component includes a scrim reinforcement for tear resistance and sewability. The fastener is useful for high cycle applications, such as on non-disposable garments, footwear and luggage.Type: ApplicationFiled: October 15, 2003Publication date: April 21, 2005Inventors: Nancy Tolan, Mark Clarner, William MC Dougall, Normand Cote, Howard Kingsford, Paul Erickson, Clinton Dowd
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Patent number: 5457855Abstract: A woven, self-engaging fastener with upright, mushroom-shaped, monofilament engaging elements that are in a thermally relaxed, stress-reduced condition. The engaging elements are arranged in a twill-like pattern such that weft-wise adjacent engaging elements are aligned diagonally to the weaving direction, and with sufficient density to enable the fastener to function as a self-engaging fastener.The fastener is produced by weaving a three-dimensional, double plush weave having two layers of interwoven warp and weft threads, and monofilament fibers interwoven with and passing back and forth between the two layers. The monofilament fibers are relaxed by heating, then severed between the two layers.Type: GrantFiled: February 28, 1994Date of Patent: October 17, 1995Assignee: Velcro Industries, B.V.Inventors: Randall B. Kenney, Der-Shi Wang, Normand A. Cote