Patents by Inventor Notoru Tanabe

Notoru Tanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3-D communication and interconnect technique for increased number of computational modules in large-scale electronic equipment
    Patent number: 5329418
    Abstract: A circuit board packaging structure includes an array of rectangular pipe-shaped circuit modules with rows and columns. Each of the circuit modules has two opposite openings, inner wall surfaces which permit electric circuit components to be mounted thereon and have wiring patterns for electrical interconnection among the circuit components, and outer wall surfaces. Intermodule connectors are provided on the outer wall surfaces of the pipe-shaped circuit modules to permit electrical interconnection between each of the circuit modules and its associated circuit module. A cooling medium is forced to flow through each of the circuit modules in one direction, thereby directly or indirectly cooling the electric circuit components such as semiconductor integrated circuit devices mounted on the inner wall surfaces of the circuit modules.
    Type: Grant
    Filed: November 18, 1992
    Date of Patent: July 12, 1994
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Notoru Tanabe