Patents by Inventor Nozad Karim
Nozad Karim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230275061Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: ApplicationFiled: May 8, 2023Publication date: August 31, 2023Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Patent number: 11646290Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: GrantFiled: June 7, 2021Date of Patent: May 9, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Publication number: 20220052016Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: ApplicationFiled: June 7, 2021Publication date: February 17, 2022Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Patent number: 11031366Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: GrantFiled: June 10, 2019Date of Patent: June 8, 2021Assignee: Amkor Technology Singapore Pte. Ltd.Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Publication number: 20190371760Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: ApplicationFiled: June 10, 2019Publication date: December 5, 2019Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Patent number: 10424556Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: GrantFiled: August 15, 2016Date of Patent: September 24, 2019Assignee: Amkor Technology, Inc.Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Publication number: 20160351525Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: ApplicationFiled: August 15, 2016Publication date: December 1, 2016Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Patent number: 9433117Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: GrantFiled: May 18, 2012Date of Patent: August 30, 2016Assignee: AMKOR TECHNOLOGY, INC.Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Patent number: 9060430Abstract: A method includes forming a patterned sacrificial layer on a first carrier and a patterned trace layer on the patterned sacrificial layer. The patterned sacrificial layer and the patterned trace layer are laminated to a dielectric material. The first carrier and the patterned sacrificial layer are removed creating sacrificial layer gaps above the patterned trace layer. The sacrificial layer gaps are filled with a trace layer isolation dielectric material. Shield trenches are laser-ablated within the dielectric material and on opposite sides of a signal trace of the patterned trace layer. The shield trenches are filled with an electrically conductive material to form shield walls. The electrically conductive material is patterned to form a shield top. The shield top, the shield walls, and a second carrier form a bias shield around the signal trace.Type: GrantFiled: October 8, 2010Date of Patent: June 16, 2015Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, Nozad Karim
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Patent number: 8199518Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: GrantFiled: February 18, 2010Date of Patent: June 12, 2012Assignee: Amkor Technology, Inc.Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
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Patent number: 7958626Abstract: A method of forming an embedded passive component network substrate includes providing a first carrier with a first dielectric layer and patterning the first dielectric layer to form a first patterned dielectric layer including circuit pattern artifacts. A first etch stop layer is plated within the circuit pattern artifacts. A first conductor layer is plated on the first etch stop layer and within the circuit pattern artifacts. The first etch stop layer and the first conductor layer form a first etch stop metal protected circuit pattern comprising a passive component embedded with the first patterned dielectric layer.Type: GrantFiled: October 25, 2007Date of Patent: June 14, 2011Assignee: Amkor Technology, Inc.Inventors: Nozad Karim, Ronald Patrick Huemoeller, Sukianto Rusli
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Patent number: 7832097Abstract: A method includes forming a patterned sacrificial layer on a first carrier and a patterned trace layer on the patterned sacrificial layer. The patterned sacrificial layer and the patterned trace layer are laminated to a dielectric material. The first carrier and the patterned sacrificial layer are removed creating sacrificial layer gaps above the patterned trace layer. The sacrificial layer gaps are filled with a trace layer isolation dielectric material. Shield trenches are laser-ablated within the dielectric material and on opposite sides of a signal trace of the patterned trace layer. The shield trenches are filled with an electrically conductive material to form shield walls. The electrically conductive material is patterned to form a shield top. The shield top, the shield walls, and a second carrier form a bias shield around the signal trace.Type: GrantFiled: January 23, 2008Date of Patent: November 16, 2010Assignee: Amkor Technology, Inc.Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, Nozad Karim