Patents by Inventor Nozomi MATSUBARA

Nozomi MATSUBARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITION CONTAINING COMPOUND HAVING POLYOXYALKYLENE CHAIN AND COMPOUND HAVING POLY(METH)ACRYLATE CHAIN
    Publication number: 20240132645
    Abstract: A composition containing a compound represented by the following Formula (1): [in the Formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group; and R13 represents a divalent group having a polyoxyalkylene chain]; and a compound represented by the following Formula (2): [in the Formula (2), R21 and R22 each independently represent a hydrogen atom or a methyl group; and R23 represents a divalent group having a poly(meth)acrylate chain].
    Type: Application
    Filed: February 17, 2022
    Publication date: April 25, 2024
    Inventors: Naoki FURUKAWA, Yuki NAKAMURA, Nozomi MATSUBARA, Hiroshi YOKOTA
  • COMPOSITION CONTAINING (METH)ACRYLAMIDE COMPOUND AND COMPOUND HAVING POLYOXYALKYLENE CHAIN
    Publication number: 20240132646
    Abstract: A composition containing a compound represented by the following Formula (1): [in the Formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group; and R13 represents a divalent group having a polyoxyalkylene chain]; and a compound represented by the following Formula (2): [in the Formula (2), R21 and R22 each independently represent a hydrogen atom or a monovalent organic group, and R21 and R22 may be bonded to each other to form a ring; and R23 represents a hydrogen atom or a methyl group].
    Type: Application
    Filed: February 17, 2022
    Publication date: April 25, 2024
    Inventors: Naoki FURUKAWA, Yuki NAKAMURA, Nozomi MATSUBARA, Hiroshi YOKOTA
  • Acrylic resin, producing method thereof, resin composition set, heat storage material, and article
    Patent number: 11965048
    Abstract: An aspect according to the present invention provides an acrylic resin including a first structural unit represented by formula (1) and a second structural unit represented by formula (2): [in the formula (1), R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl group having 12-30 carbon atoms] [in the formula (2), R3 and R5 each independently represent a hydrogen atom or a methyl group, and R4 represents a divalent organic group].
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: April 23, 2024
    Assignee: RESONAC CORPORATION
    Inventors: Naoki Furukawa, Nozomi Matsubara, Tsuyoshi Morimoto, Akira Nagai
  • COMPOSITION AND SHEET CONTAINING CURED PRODUCT OF SAME
    Publication number: 20240043648
    Abstract: A composition containing a compound represented by the following Formula (1): [in the Formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group; and R13 represents a divalent group having a polyoxyalkylene chain.]; and hollow particles.
    Type: Application
    Filed: December 20, 2021
    Publication date: February 8, 2024
    Inventors: Tomoko HIGASHIUCHI, Hiroshi YOKOTA, Naoki FURUKAWA, Nozomi MATSUBARA
  • COMPOSITION AND SHEET
    Publication number: 20240043597
    Abstract: A composition containing first hollow particles being thermally expandable hollow particles; second hollow particles being hollow particles other than the first hollow particles; and a polymerizable compound.
    Type: Application
    Filed: December 20, 2021
    Publication date: February 8, 2024
    Inventors: Tomoko HIGASHIUCHI, Hiroshi YOKOTA, Naoki FURUKAWA, Nozomi MATSUBARA
  • METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20240047230
    Abstract: A method for manufacturing a semiconductor device, the method including: a step of disposing an adhesive thermal insulation material on a semiconductor device; a step of performing reflow of the semiconductor device having the thermal insulation material disposed thereon; and a step of detaching the thermal insulation material from the semiconductor device.
    Type: Application
    Filed: December 20, 2021
    Publication date: February 8, 2024
    Inventors: Tomoko HIGASHIUCHI, Hiroshi YOKOTA, Tomohiko KOTAKE, Naoki FURUKAWA, Naoki MARUYAMA, Yutaka OKADA, Nozomi MATSUBARA
  • CURABLE COMPOSITION SET AND ARTICLE
    Publication number: 20230016868
    Abstract: A curable composition set containing: a first liquid containing an oxidizing agent; and a second liquid containing a reducing agent, wherein at least one of the first liquid and the second liquid contains a compound represented by the following formula (1): wherein R11 and R12 each independently represent a hydrogen atom or a methyl group, and R13 represents a divalent group having a polyoxyalkylene chain, and wherein at least one of the first liquid and the second liquid contains a thermally conductive filler.
    Type: Application
    Filed: November 26, 2020
    Publication date: January 19, 2023
    Inventors: Nozomi MATSUBARA, Yuki NAKAMURA, Naoki FURUKAWA, Hiroshi YOKOTA, Tsuyoshi MORIMOTO
  • COMPOSITION SET CONTAINING COMPOUND HAVING POLYOXYALKYLENE CHAIN
    Publication number: 20220403082
    Abstract: A composition set containing: a first liquid containing an oxidizing agent; and a second liquid containing a reducing agent, wherein at least one of the first liquid and the second liquid contains a compound represented by the following formula (1): wherein R11 and R12 each independently represent a hydrogen atom or a methyl group, and R13 represents a divalent group having a polyoxyalkylene chain, and wherein the polyoxyalkylene chain has 100 or more of oxyalkylene groups.
    Type: Application
    Filed: November 26, 2020
    Publication date: December 22, 2022
    Inventors: Nozomi MATSUBARA, Naoki FURUKAWA, Yuki NAKAMURA, Hiroshi YOKOTA, Tsuyoshi MORIMOTO
  • Resin composition, heat storage material, and commodity
    Patent number: 11352466
    Abstract: An aspect of the present invention is a resin composition comprising: an acrylic resin; and a curing agent, wherein the acrylic resin is a resin obtained by polymerizing monomer components comprising a first monomer represented by the following formula (1): wherein R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl group having 12 to 30 carbon atoms, and a second monomer copolymerizable with the first monomer and having a reactive group capable of reacting with the curing agent.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: June 7, 2022
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Naoki Furukawa, Akira Nagai, Tsuyoshi Morimoto, Keiko Kizawa, Nozomi Matsubara
  • ACRYLIC RESIN, PRODUCING METHOD THEREOF, RESIN COMPOSITION SET, HEAT STORAGE MATERIAL, AND ARTICLE
    Publication number: 20210301059
    Abstract: An aspect according to the present invention provides an acrylic resin including a first structural unit represented by formula (1) and a second structural unit represented by formula (2): [in the formula (1), R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl group having 12-30 carbon atoms] [in the formula (2), R3 and R5 each independently represent a hydrogen atom or a methyl group, and R4 represents a divalent organic group].
    Type: Application
    Filed: June 27, 2019
    Publication date: September 30, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Naoki FURUKAWA, Nozomi MATSUBARA, Tsuyoshi MORIMOTO, Akira NAGAI
  • RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
    Publication number: 20210261706
    Abstract: An aspect of the present invention provides a resin composition containing an acrylic resin which is obtained by polymerizing a monomer component including: a first monomer represented by formula (1); and a second monomer which is copolymerizable with the first monomer and has a block isocyanate group. (In the formula, R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl group having 12-30 carbon atoms.
    Type: Application
    Filed: June 27, 2019
    Publication date: August 26, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Naoki FURUKAWA, Tsuyoshi MORIMOTO, Akira NAGAI, Nozomi MATSUBARA
  • RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
    Publication number: 20210246349
    Abstract: An aspect of the present invention is a resin composition containing an acrylic resin obtained by polymerizing a monomer component including: a first monomer represented by formula (1); and a second monomer copolymerizable with the first monomer and having a reactive group. [In the formula, R1 represents a hydrogen atom or a methyl group, and R2 represents a group having a polyoxyalkylene chain.
    Type: Application
    Filed: May 10, 2019
    Publication date: August 12, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Naoki FURUKAWA, Tsuyoshi MORIMOTO, Atsuko SANO, Hiroshi YOKOTA, Nozomi MATSUBARA, Akira NAGAI, Keiko KIZAWA
  • RESIN MEMBER, METHOD FOR PRODUCING RESIN MEMBER AND HEAT STORAGE BODY
    Publication number: 20210024803
    Abstract: A resin member contains a copolymer of ethylene and an olefin having 3 or more carbon atoms, and a fatty acid ester.
    Type: Application
    Filed: April 4, 2018
    Publication date: January 28, 2021
    Inventors: Keiko KIZAWA, Akira NAGAI, Tsuyoshi MORIMOTO, Naoki FURUKAWA, Nozomi MATSUBARA
  • RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND COMMODITY
    Publication number: 20200165437
    Abstract: An aspect of the present invention is a resin composition comprising: an acrylic resin; and a curing agent, wherein the acrylic resin is a resin obtained by polymerizing monomer components comprising a first monomer represented by the following formula (1): wherein R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl group having 12 to 30 carbon atoms, and a second monomer copolymerizable with the first monomer and having a reactive group capable of reacting with the curing agent.
    Type: Application
    Filed: May 10, 2018
    Publication date: May 28, 2020
    Inventors: Naoki FURUKAWA, Akira NAGAI, Tsuyoshi MORIMOTO, Keiko KIZAWA, Nozomi MATSUBARA