Abstract: A propylene resin composition containing a propylene homopolymer that satisfies conditions (1) to (3) described below, and having a semicrystallization time (t1/2) of 60 seconds or more: (1) having a melting point (Tm-D) of 120° C. or lower; (2) having a molecular weight distribution (Mw/Mn) less than 3.0; (3) having a melt viscosity at 190° C. of 30,000 mPa·s or less.

Abstract: A plasticizer may be suitable for resins and contain an amorphous propylenic polymer having a weight-average molecular weight (Mw), measured according to a GPC method, in a range of from 5,000 to 30,000 and having a molecular weight distribution (Mw/Mn) of 3.0 or less.

Abstract: The present invention relates to a thermoplastic resin composition containing a base polymer containing a propylene-based polymer (A) in which a melting endotherm (?H-D) is 0 J/g or more and 60 J/g or less, and a melting point (Tm-D) is not observed or is 0° C. or higher and 120° C. or lower; and a propylene-based polymer (C) in which a melting endotherm (?H-D) is 20 J/g or more and 120 J/g or less, and a melting point (Tm-D) is higher than 120° C., the content of the propylene-based polymer (C) being 0.5 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the content of the propylene-based polymer (A).

Abstract: A polypropylene-based adhesive containing a polypropylene-based resin (A?) prepared by reducing the weight-average molecular weight of a polypropylene-based resin (A) by decomposition, in which the melting endotherm (?H-D) of the polypropylene-based resin (A) is 0 J/g or more and 80 J/g or less, as obtained from a melting endothermic curve drawn by holding a sample at ?10° C. for 5 minutes in a nitrogen atmosphere followed by heating it at 10° C./min using a differential scanning calorimeter (DSC).

Abstract: A polypropylene-based resin composition containing a polypropylene-based resin (A) which has a melting endotherm (?H-D) of 0 J/g or more and 40 J/g or less and which does not exhibit an observable melting point (Tm-D) or has a melting point (Tm-D) of 0° C. or higher and lower than 90° C., and a polypropylene-based resin (B) which has a melting endotherm (?H-D) of more than 40 J/g and 125 J/g or less.

Abstract: A resin composition containing at least one selected from the group consisting of an amorphous polyolefin resin (A-1) having a melt endotherm (?H-D) of less than 3 Jig and a high-viscosity oil (A-2), and a polypropylene resin (B) having a melt endotherm (?H-D) of 3 to 80 J/g, wherein, relative to the total amount 100% by mass of the the amorphous polyolefin resin (A-1), the high-viscosity oil (A-2) and the polypropylene resin (B), the total of the amorphous polyolefin resin (A-1) and the high-viscosity oil (A-2) is 5.0 to 99.5% by mass, and the amount of the polypropylene resin (B) is 0.5 to 95.0% by mass.

Abstract: A polypropylene-based resin composition containing a polypropylene-based resin (A) which has a melting endotherm (?H-D) of 0 J/g or more and 40 J/g or less and which does not exhibit an observable melting point (Tm-D) or has a melting point (Tm-D) of 0° C. or higher and lower than 90° C., and a polypropylene-based resin (B) which has a melting endotherm (?H-D) of more than 40 J/g and 125 J/g or less.

Abstract: A resin composition containing (a) an olefinic polymer (A) having a melting endotherm (?H-D) of 0 J/g or more and 80 J/g or less and a molecular weight distribution (Mw/Mn) of less than 3.0, (b) an olefinic polymer (B) having a melting point (Tm-D) of 100° C. or higher, and (c) fibers (C) having an aspect ratio of 10 or more, and a mean fiber diameter of 0.01 ?m or more and 1,000 ?m or less.

Abstract: A polyolefin molded product comprising a resin composition containing (1) from 1 to 30% by mass of an olefin-based polymer having an elastic modulus of from 5 to 450 MPa, (2) a propylene-based polymer having an elastic modulus of 500 MPa or more (the content of the component (2) is the balance), and (3) from 0.0001 to 2% by mass of an additive.

Abstract: Disclosed is a polyolefin composition for stretched film including an olefin-based polymer (A) having a melting endotherm (?H-D), as obtained from a melting endothermic curve which is obtained under a measurement condition of holding a sample at ?10° C. for 5 minutes in a nitrogen atmosphere and then increasing the temperature at a rate of 10° C./min with a differential scanning calorimeter (DSC), of 0 to 80 J/g; and an olefin-based polymer (B) having a melting endotherm (?H-D), as observed under the foregoing measurement condition, of more than 80 J/g, wherein a content of the olefin-based polymer (A) is 0.5% by mass or more and less than 17% by mass relative to a total content of the olefin-based polymer (A) and the olefin-based polymer (B), and the polyolefin composition has a melting endotherm (?H-D), as observed under the foregoing measurement condition, of 80 to 120 J/g.

Abstract: Disclosed is a polyolefin composition for stretched film including an olefin-based polymer (A) having a melting endotherm (?H-D), as obtained from a melting endothermic curve which is obtained under a measurement condition of holding a sample at ?10° C. for 5 minutes in a nitrogen atmosphere and then increasing the temperature at a rate of 10° C./min with a differential scanning calorimeter (DSC), of 0 to 80 J/g; and an olefin-based polymer (B) having a melting endotherm (?H-D), as observed under the foregoing measurement condition, of more than 80 J/g, wherein a content of the olefin-based polymer (A) is 0.5% by mass or more and less than 17% by mass relative to a total content of the olefin-based polymer (A) and the olefin-based polymer (B), and the polyolefin composition has a melting endotherm (?H-D), as observed under the foregoing measurement condition, of 80 to 120 J/g.

Abstract: A polyolefin molded product comprising a resin composition containing (1) from 1 to 30% by mass of an olefin-based polymer having an elastic modulus of from 5 to 450 MPa, (2) a propylene-based polymer having an elastic modulus of 500 MPa or more (the content of the component (2) is the balance), and (3) from 0.0001 to 2% by mass of an additive.