Patents by Inventor Nozomu Fujii
Nozomu Fujii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12110424Abstract: A polypropylene-based adhesive containing a polypropylene-based resin (A?) prepared by reducing the weight-average molecular weight of a polypropylene-based resin (A) by decomposition, in which the melting endotherm (?H-D) of the polypropylene-based resin (A) is 0 J/g or more and 80 J/g or less, as obtained from a melting endothermic curve drawn by holding a sample at ?10° C. for 5 minutes in a nitrogen atmosphere followed by heating it at 10° C./min using a differential scanning calorimeter (DSC).Type: GrantFiled: July 31, 2019Date of Patent: October 8, 2024Assignee: IDEMITSU KOSAN CO., LTD.Inventors: Nozomu Fujii, Masami Kanamaru, Takuji Okamoto
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Patent number: 12018182Abstract: The present invention relates to a thermoplastic resin composition containing a base polymer containing a propylene-based polymer (A) in which a melting endotherm (?H-D) is 0 J/g or more and 60 J/g or less, and a melting point (Tm-D) is not observed or is 0° C. or higher and 120° C. or lower; and a propylene-based polymer (C) in which a melting endotherm (?H-D) is 20 J/g or more and 120 J/g or less, and a melting point (Tm-D) is higher than 120° C., the content of the propylene-based polymer (C) being 0.5 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the content of the propylene-based polymer (A).Type: GrantFiled: September 2, 2019Date of Patent: June 25, 2024Assignee: IDEMITSU KOSAN CO., LTD.Inventors: Nozomu Fujii, Masami Kanamaru, Asami Koga
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Publication number: 20230303813Abstract: A propylene resin composition containing a propylene homopolymer that satisfies conditions (1) to (3) described below, and having a semicrystallization time (t1/2) of 60 seconds or more: (1) having a melting point (Tm-D) of 120° C. or lower; (2) having a molecular weight distribution (Mw/Mn) less than 3.0; (3) having a melt viscosity at 190° C. of 30,000 mPa·s or less.Type: ApplicationFiled: August 25, 2021Publication date: September 28, 2023Applicant: IDEMITSU KOSAN CO.,LTD.Inventors: Nozomu FUJII, Masaki OKANO, Asami KOGA
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Publication number: 20230235202Abstract: A plasticizer may be suitable for resins and contain an amorphous propylenic polymer having a weight-average molecular weight (Mw), measured according to a GPC method, in a range of from 5,000 to 30,000 and having a molecular weight distribution (Mw/Mn) of 3.0 or less.Type: ApplicationFiled: July 6, 2021Publication date: July 27, 2023Applicant: IDEMITSU KOSAN CO.,LTD.Inventors: Kiyokazu KATAYAMA, Hideaki NODA, Michika TOKUNAGA, Shuhei ARITA, Nozomu FUJII
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Publication number: 20210348039Abstract: The present invention relates to a thermoplastic resin composition containing a base polymer containing a propylene-based polymer (A) in which a melting endotherm (?H-D) is 0 J/g or more and 60 J/g or less, and a melting point (Tm-D) is not observed or is 0° C. or higher and 120° C. or lower; and a propylene-based polymer (C) in which a melting endotherm (?H-D) is 20 J/g or more and 120 J/g or less, and a melting point (Tm-D) is higher than 120° C., the content of the propylene-based polymer (C) being 0.5 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the content of the propylene-based polymer (A).Type: ApplicationFiled: September 2, 2019Publication date: November 11, 2021Applicant: IDEMITSU KOSAN CO.,LTD.Inventors: Nozomu FUJII, Masami KANAMARU, Asami KOGA
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Publication number: 20210292610Abstract: A polypropylene-based adhesive containing a polypropylene-based resin (A?) prepared by reducing the weight-average molecular weight of a polypropylene-based resin (A) by decomposition, in which the melting endotherm (?H-D) of the polypropylene-based resin (A) is 0 J/g or more and 80 J/g or less, as obtained from a melting endothermic curve drawn by holding a sample at ?10° C. for 5 minutes in a nitrogen atmosphere followed by heating it at 10° C./min using a differential scanning calorimeter (DSC).Type: ApplicationFiled: July 31, 2019Publication date: September 23, 2021Applicant: IDEMITSU KOSAN CO.,LTD.Inventors: Nozomu FUJII, Masami KANAMARU, Takuji OKAMOTO
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Patent number: 11034826Abstract: A polypropylene-based resin composition containing a polypropylene-based resin (A) which has a melting endotherm (?H-D) of 0 J/g or more and 40 J/g or less and which does not exhibit an observable melting point (Tm-D) or has a melting point (Tm-D) of 0° C. or higher and lower than 90° C., and a polypropylene-based resin (B) which has a melting endotherm (?H-D) of more than 40 J/g and 125 J/g or less.Type: GrantFiled: April 9, 2018Date of Patent: June 15, 2021Assignee: IDEMITSU KOSAN CO., LTD.Inventors: Masami Kanamaru, Nozomu Fujii, Yutaka Minami
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Publication number: 20210032510Abstract: A resin composition containing at least one selected from the group consisting of an amorphous polyolefin resin (A-1) having a melt endotherm (?H-D) of less than 3 Jig and a high-viscosity oil (A-2), and a polypropylene resin (B) having a melt endotherm (?H-D) of 3 to 80 J/g, wherein, relative to the total amount 100% by mass of the the amorphous polyolefin resin (A-1), the high-viscosity oil (A-2) and the polypropylene resin (B), the total of the amorphous polyolefin resin (A-1) and the high-viscosity oil (A-2) is 5.0 to 99.5% by mass, and the amount of the polypropylene resin (B) is 0.5 to 95.0% by mass.Type: ApplicationFiled: February 25, 2019Publication date: February 4, 2021Applicant: IDEMITSU KOSAN CO., LTD.Inventors: Masami KANAMARU, Nozomu FUJII, Hiroki FUJINAMI, AsMI KOGA
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Publication number: 20200123360Abstract: A polypropylene-based resin composition containing a polypropylene-based resin (A) which has a melting endotherm (?H-D) of 0 J/g or more and 40 J/g or less and which does not exhibit an observable melting point (Tm-D) or has a melting point (Tm-D) of 0° C. or higher and lower than 90° C., and a polypropylene-based resin (B) which has a melting endotherm (?H-D) of more than 40 J/g and 125 J/g or less.Type: ApplicationFiled: April 9, 2018Publication date: April 23, 2020Applicant: IDEMITSU KOSAN CO., LTD.Inventors: Masami KANAMARU, Nozomu FUJII, Yutaka MINAMI
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Publication number: 20180312677Abstract: A resin composition containing (a) an olefinic polymer (A) having a melting endotherm (?H-D) of 0 J/g or more and 80 J/g or less and a molecular weight distribution (Mw/Mn) of less than 3.0, (b) an olefinic polymer (B) having a melting point (Tm-D) of 100° C. or higher, and (c) fibers (C) having an aspect ratio of 10 or more, and a mean fiber diameter of 0.01 ?m or more and 1,000 ?m or less.Type: ApplicationFiled: October 24, 2016Publication date: November 1, 2018Applicant: IDEMITSU KOSAN CO., LTD.Inventors: Nozomu FUJII, Masahiro KUBO
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Patent number: 10062472Abstract: A polyolefin molded product comprising a resin composition containing (1) from 1 to 30% by mass of an olefin-based polymer having an elastic modulus of from 5 to 450 MPa, (2) a propylene-based polymer having an elastic modulus of 500 MPa or more (the content of the component (2) is the balance), and (3) from 0.0001 to 2% by mass of an additive.Type: GrantFiled: October 25, 2013Date of Patent: August 28, 2018Assignee: IDEMITSU KOSAN CO., LTD.Inventors: Nozomu Fujii, Masahiro Kubo
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Patent number: 9688847Abstract: Disclosed is a polyolefin composition for stretched film including an olefin-based polymer (A) having a melting endotherm (?H-D), as obtained from a melting endothermic curve which is obtained under a measurement condition of holding a sample at ?10° C. for 5 minutes in a nitrogen atmosphere and then increasing the temperature at a rate of 10° C./min with a differential scanning calorimeter (DSC), of 0 to 80 J/g; and an olefin-based polymer (B) having a melting endotherm (?H-D), as observed under the foregoing measurement condition, of more than 80 J/g, wherein a content of the olefin-based polymer (A) is 0.5% by mass or more and less than 17% by mass relative to a total content of the olefin-based polymer (A) and the olefin-based polymer (B), and the polyolefin composition has a melting endotherm (?H-D), as observed under the foregoing measurement condition, of 80 to 120 J/g.Type: GrantFiled: October 29, 2014Date of Patent: June 27, 2017Assignee: IDEMITSU KOSAN CO., LTD.Inventors: Nozomu Fujii, Masahiro Kubo
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Publication number: 20160237268Abstract: Disclosed is a polyolefin composition for stretched film including an olefin-based polymer (A) having a melting endotherm (?H-D), as obtained from a melting endothermic curve which is obtained under a measurement condition of holding a sample at ?10° C. for 5 minutes in a nitrogen atmosphere and then increasing the temperature at a rate of 10° C./min with a differential scanning calorimeter (DSC), of 0 to 80 J/g; and an olefin-based polymer (B) having a melting endotherm (?H-D), as observed under the foregoing measurement condition, of more than 80 J/g, wherein a content of the olefin-based polymer (A) is 0.5% by mass or more and less than 17% by mass relative to a total content of the olefin-based polymer (A) and the olefin-based polymer (B), and the polyolefin composition has a melting endotherm (?H-D), as observed under the foregoing measurement condition, of 80 to 120 J/g.Type: ApplicationFiled: October 29, 2014Publication date: August 18, 2016Applicant: IDEMITSU KOSAN CO., LTD.Inventors: Nozomu FUJII, Masahiro KUBO
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Publication number: 20150274949Abstract: A polyolefin molded product comprising a resin composition containing (1) from 1 to 30% by mass of an olefin-based polymer having an elastic modulus of from 5 to 450 MPa, (2) a propylene-based polymer having an elastic modulus of 500 MPa or more (the content of the component (2) is the balance), and (3) from 0.0001 to 2% by mass of an additive.Type: ApplicationFiled: October 25, 2013Publication date: October 1, 2015Applicant: IDEMITSU KOSAN CO., LTD.Inventors: Nozomu Fujii, Masahiro Kubo